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YR1B649KCC
TE Connectivity
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1 | TE Connectivity R Series Axial Through Hole Fixed Resistor 649kΩ ±0.1% 0.25W ±15ppm/°C | Resistors, Axial Diameter Horizontal Mounting | YR1B649KCC |
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W3A4YC223MAT2A
Kyocera AVX
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1 | Capacitor Arrays & Networks 16V 22nF 20% 0612 X7 R 4CAPS | Other | W3A4YC223MAT2A |
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592D158X06R3R2T20H
Vishay
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1 | Tantalum Capacitors - Solid SMD 1500uF 6.3volts 20% R case Conformal | Other | 592D158X06R3R2T20H |
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IHLP2020CZER1R5M11
Vishay
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1 | IHLP® Automotive Inductors, High Temperature (180 °C) Series | Inductors Precision Moulded | IHLP2020CZER1R5M11 |
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CRG0805-R-1R78FT
Venkel
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1 | RoHS 6/6 Green CR,0805,1/8W,1.78R,±1% | Other | CRG0805-R-1R78FT |
3
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R1RW0416DSB-0PR#D1
Renesas Electronics
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0 | The R1RW0416D is a 4-Mbit High-Speed static RAM organized 256-kword × 16-bit. It has realized High-Speed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuit designing technology. It is most appropriate for the application which requires High-Speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. Especially, LVersion and S-Version are low power consumption and it is the best for the battery backup system. The package prepare | Small Outline Packages | R1RW0416DSB-0PR#D1 |
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IHLP2020CZER1R5M01.
Vishay
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1 | IHLP® Automotive Inductors, High Temperature (180 °C) Series | Inductors Precision Moulded | IHLP2020CZER1R5M01. |
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R1RW0416DSB-0PR#D0
Renesas Electronics
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0 | The R1RW0416D is a 4-Mbit High-Speed static RAM organized 256-kword × 16-bit. It has realized High-Speed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuit designing technology. It is most appropriate for the application which requires High-Speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. Especially, LVersion and S-Version are low power consumption and it is the best for the battery backup system. The package prepare | Small Outline Packages | R1RW0416DSB-0PR#D0 |
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R1RP0416DGE-2PI#B1
Renesas Electronics
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1 | SRAM Memory IC 4Mbit Parallel 12 ns 44-SOJ| Surface Mount ,-40°C ~ 85°C (TA) | Other | R1RP0416DGE-2PI#B1 |
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ASPI0630LR1R5M
ABRACON
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1 | 1.5 µH Shielded Molded Inductor 10 A 12mOhm Max Nonstandard | Other | ASPI0630LR1R5M |
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FP1010R1-R150-R
Eaton
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1 | 150 nH Shielded Inductor 50 A 0.185mOhm Nonstandard | Other | FP1010R1-R150-R |
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R1RW0416DGE-2PR#B0
Renesas Electronics
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1 | The R1RW0416D is a 4-Mbit High-Speed static RAM organized 256-kword × 16-bit. It has realized High-Speed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuit designing technology. It is most appropriate for the application which requires High-Speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. Especially, LVersion and S-Version are low power consumption and it is the best for the battery backup system. The package prepare | Other | R1RW0416DGE-2PR#B0 |
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IHLP4040DZER1R0M11
Vishay
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1 | Fixed Inductors 1uH 20% | Inductors Precision Moulded | IHLP4040DZER1R0M11 |
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IHLP2020CZER1R0M5A
Vishay
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1 | IHLP® Automotive Inductors, High Temperature (180 °C) Series | Inductors Precision Moulded | IHLP2020CZER1R0M5A |
3
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IHLP7575GZER1R0M51
Vishay
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1 | IHLP® Commercial Inductors, High Temperature (155 °C) Series | Inductors Precision Moulded | IHLP7575GZER1R0M51 |
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HPCR0402-R-1R54FT
Venkel
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1 | High Power CR,0402,1/8W,1.54R,±1% | Resistor Chip | HPCR0402-R-1R54FT |
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R1RW0416DSB-2PI#S1
Renesas Electronics
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0 | The R1RW0416DI is a 4-Mbit High-Speed static RAM organized 256-kword × 16-bit. It has realized High-Speed access time by employing CMOS process (6-transistor memory cell) and High-Speed circuit designing technology. It is most appropriate for the application which requires High-Speed, high density memory and wide bit width configuration, such as cache and buffer memory in system. The R1RW0416DI is packaged in 400-mil 44-pin SOJ and 400-mil 44-pin plastic TSOPII for high density surface mounting. | Small Outline Packages | R1RW0416DSB-2PI#S1 |
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IHLP2020CZER1R0M1A
Vishay
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1 | IHLP® Automotive Inductors, High Temperature (180 °C) Series | Inductors Precision Moulded | IHLP2020CZER1R0M1A |
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HPCR0402-R-1R65FT
Venkel
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1 | High Power CR,0402,1/8W,1.65R,±1% | Resistor Chip | HPCR0402-R-1R65FT |
3
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HPCR0402-R-1R43FT
Venkel
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1 | High Power CR,0402,1/8W,1.43R,±1% | Resistor Chip | HPCR0402-R-1R43FT |
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IHLP2020CZER1R0M51
Vishay
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1 | IHLP® Automotive Inductors, High Temperature (180 °C) Series | Inductors Precision Moulded | IHLP2020CZER1R0M51 |
3
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CRG0805-R-1R0JT
Venkel
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1 | RoHS 6/6 Green CR,0805,1/8W,1R,±5% | Other | CRG0805-R-1R0JT |
3
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CRG0805-R-1R6JT
Venkel
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1 | RoHS 6/6 Green CR,0805,1/8W,1.6R,±5% | Other | CRG0805-R-1R6JT |
3
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HPCR0402-R-1R07FT
Venkel
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1 | High Power CR,0402,1/8W,1.07R,±1% | Resistor Chip | HPCR0402-R-1R07FT |
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CRGH1206F71R5
TE Connectivity
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1 | Configuration Features: Number of Resistors 1 | Dimensions: Product Height .55 MM | Product Height .022 INCH | Product Width 1.55 MM | Product Length 3.1 MM | Product Width .061 INCH | Product Length .122 INCH | Electrical Characteristics: Resistance Class Up to 1kΩ | Passive Component Tolerance 1 PCT | Operating Voltage 200 V | Power Rating .5 WATT | Resistance Value 71.5 OHM | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Package Size Code 1206 | Element Type Thick Film | R | Resistor Chip | CRGH1206F71R5 |
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