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ATSAM4C32EA-AU
Microchip
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1 | ARM Microcontrollers - MCU LQFP, Green, IND TEMP, CRYPTO, 1ph SOC, MRLB, 2048K, R | Quad Flat Packages | ATSAM4C32EA-AU |
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53259-0529
Molex
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1 | Headers & Wire Housings 3.5 WtB Wafer Assy R B Wafer Assy RA 5Ckt | Other | 53259-0529 |
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38-00-6293
Molex
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1 | Headers & Wire Housings 2.54mm KK Hdr Vt VrC r Vt VrC FL 5Sn 3Ckt | Header, Vertical | 38-00-6293 |
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T95R337K016LSAL
Vishay
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1 | Tantalum Capacitors - Solid SMD 330uF 16volts 10% R cs Conf HiRel COTS | Other | T95R337K016LSAL |
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YR1B143RCC
TE Connectivity
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1 | TE Connectivity R Series Axial Through Hole Fixed Resistor 143Ω ±0.1% 0.25W ±15ppm/°C | Resistors, Axial Diameter Horizontal Mounting | YR1B143RCC |
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PIC16HV753-E/ML
Microchip
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1 | 8-bit Microcontrollers - MCU 35KB Flsh 128 R 8MHz Int Osc 9-bit DAC | Quad Flat No-Lead | PIC16HV753-E/ML |
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MCP96RL00T-E/MX
Microchip
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1 | Board Mount Temperature Sensors +/- 8.0C Thermocouple to I2C converter in 5mmx5mm QFN. This device supports K, J, T, N, S, E, B, and R type thermocouples. | Quad Flat No-Lead | MCP96RL00T-E/MX |
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TPCR226K006R1500
Kyocera AVX
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1 | Cap Tant Solid 22uF 6.3V R CASE 10% (2 X 1.35 X 1.35mm) Inward L SMD 2012-15 1.5 Ohm 125°C T/R | Capacitor Chip Non-polarised | TPCR226K006R1500 |
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ASMB-LTC3-0D335
Avago Technologies
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1 | BROADCOM - ASMB-LTC3-0D335 - LED, Red, Green, Blue, SMD, 110 °, Round with Flat Top, R 5mA, G 5mA, B 5mA | Other | ASMB-LTC3-0D335 |
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RM352-152-322-5501
Molex
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1 | Rectangular MIL Spec Connectors CONNECTOR, R SERIES, 152 position 3 rows, plug right angle with mounting ears, Pre-tinned termination, SnPb alloy | Other | RM352-152-322-5501 |
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RM232-050-101-5500
Molex
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1 | AirBorn R Series, Rectangular Board Mount Plug, Vertical, Plastic Body, Dual Row, 0.075"/1.91mm Pitch, without Mounting Ears, Through Hole, 0.109" Tail Length, Guide Set, Gold Termination, 50 Circuits | Other | RM232-050-101-5500 |
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53309-2070
Molex
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1 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer Assy R RA 20Ckt EmbsTp Pkg | Other | 53309-2070 |
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150D226X9035R2T
Vishay
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1 | Tantalum Capacitors - Solid Leaded 22uF 35volts 10% R case Axial | Capacitors, Polarized Axial Diameter Horizontal Mounting | 150D226X9035R2T |
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SN74ABT2240AN
Texas Instruments
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1 | Output Ports Have Equivalent 25-Ω SeriesResistors, So No External Resistors AreRequired State-of-the-Art EPIC-ΙΙB BiCMOS DesignSignificantly Reduces Power Dissipation Typical VOLP (Output Ground Bounce) < 1 Vat VCC = 5 V, TA = 25°C Latch-Up Performance Exceeds 500 mAPer JESD 17 ESD Protection Exceeds 2000 V PerMIL-STD-883, Method 3015; Exceeds 200 VUsing Machine Model (C = 200 pF, R = 0) Package Options Include PlasticSmall-Outline (DW), Shrink Small-Outline(DB), and Thin S | Dual-In-Line Packages | SN74ABT2240AN |
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C1808P153K1XRC{MILITARYBULK}
Yageo Group
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1 | SMD Mil PRF55681, Ceramic, 0.015 uF, 10%, 100 VDC, BX, Ceramic Chips, MIL PRF 55681 Established Reliability, R (0.01%/1000 Hrs) ,-55/+125°C | Capacitor Chip Non-polarised | C1808P153K1XRC{MILITARYBULK} |
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C1812N473K1XRH{MILITARYBULK}
Yageo Group
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1 | SMD Mil PRF55681, Ceramic, 0.047 uF, 10%, 100 VDC, BX, Ceramic Chips,MIL PRF 55681 Established Reliability, R (0.01%/1000 Hrs), 1812 / 4532 | Capacitor Chip Non-polarised | C1812N473K1XRH{MILITARYBULK} |
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YR1B1K82CC
TE Connectivity
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1 | Precision Resistor, Thin Film, .25 W, 1.82K ohm, .1 %, ±15 ppm/°C, Axial-Leaded, Copper Termination, 6.3 x 2.3 mm, Ammo Packed, 2 Termination, Neohm R | Resistors, Axial Diameter Horizontal Mounting | YR1B1K82CC |
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B32520C0104J289
TDK
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1 | Wound capacitor technology for lead spacing 10 to 37.5 mm = code N, Q or R in digit 7 of orde | Other | B32520C0104J289 |
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86093968813H45V1LF
Amphenol Communications Solutions
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1 | Din Headers and Receptacles, Backplane connectors, Right Angle Receptacle Solder-to-Board Style R 96 ways, Class III, Tail Length: 3mm, with Harpoon | Other | 86093968813H45V1LF |
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YR1B14KCC
TE Connectivity
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1 | 14K ohm, Through-Hole Precision Resistor, Thin Film, .25 W, .1 %, ±15 ppm/°C, Axial-Leaded, Copper Termination, 6.3 x 2.3 mm, Ammo Packed, Neohm R | Resistors, Axial Diameter Horizontal Mounting | YR1B14KCC |
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ERB-RD5R00X
Panasonic
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1 | Micro Chip Fuse, Size [L×W] (EIA) (mm): 1.0×0.5 (EIA:0402), Rated Current (A): 5, Internal R [at 25℃ max.] (mΩ): 19, Rated Voltage (Open Circuit Voltage) [DC] (V): 32, Interrupting Rating (A): 35, Category Temp. Range (°C): -40 to +125 | Other | ERB-RD5R00X |
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ERB-RE2R50V
Panasonic
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1 | Micro Chip Fuse, Size [L×W] (EIA) (mm): 1.6×0.8 (EIA:0603), Rated Current (A): 2.5, Internal R [at 25℃ max.] (mΩ): 40, Rated Voltage (Open Circuit Voltage) [DC] (V): 32, Interrupting Rating (A): 50, Category Temp. Range (°C): -40 to +125 | Other | ERB-RE2R50V |
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ERBRD0R63X
Panasonic
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1 | Micro Chip Fuse, Size [L×W] (EIA) (mm): 1.0×0.5 (EIA:0402), Rated Current (A): 0.63, Internal R [at 25℃ max.] (mΩ): 220, Rated Voltage (Open Circuit Voltage) [DC] (V): 32, Interrupting Rating (A): 35, Category Temp. Range (°C): -40 to +125 | Other | ERBRD0R63X |
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ERBRD1R25X
Panasonic
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1 | Micro Chip Fuse, Size [L×W] (EIA) (mm): 1.0×0.5 (EIA:0402), Rated Current (A): 1.25, Internal R [at 25℃ max.] (mΩ): 82, Rated Voltage (Open Circuit Voltage) [DC] (V): 32, Interrupting Rating (A): 35, Category Temp. Range (°C): -40 to +125 | Other | ERBRD1R25X |
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RNL1E102MDSASQ
Nichicon
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1 | Low ESR, High Capacitance, High ripple current.Large Sized.Load life of 2000 / 5000 hours at 105°C.Radial lead type : Lead free flow soldering conditioncorrespondence.Compliant to the RoHS directive (2011/65/EU,(EU)2015/863). R | Capacitor, Polarized Radial Diameter | RNL1E102MDSASQ |
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