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STM32H747XGH6
STMicroelectronics
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1 | High-performance and DSP with DP-FPU, Arm Cortex-M7 + Cortex-M4 MCU with 1MBytes of Flash memory, 1MB RAM, 480 MHz CPU, Art Accelerator, L1 cache, external memory interface, large set of peripherals, SMPS, MIPI-DSI | BGA | STM32H747XGH6 |
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STM32H745IGT6
STMicroelectronics
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1 | High-performance and DSP with DP-FPU, Arm Cortex-M7 + Cortex-M4 MCU with 1MBytes of Flash memory, 1MB RAM, 480 MHz CPU, Art Accelerator, L1 cache, external memory interface, large set of peripherals, SMPS | Quad Flat Packages | STM32H745IGT6 |
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STM32H743IIK6TR
STMicroelectronics
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1 | High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 2MBytes of Flash memory, 1MB RAM, 480 MHz CPU, Art Accelerator, L1 cache, external memory interface, large set of peripherals | BGA | STM32H743IIK6TR |
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STM32H743XIH6TR
STMicroelectronics
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1 | High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 2MBytes of Flash memory, 1MB RAM, 480 MHz CPU, Art Accelerator, L1 cache, external memory interface, large set of peripherals | BGA | STM32H743XIH6TR |
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UP20-C-F-G-FL-1-P12-TR
Same Sky
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1 | Type C, USB 2.0, 480 Mbps, 20 Vdc, 5 A, Horizontal, Mid Mount SMT Mounting Style, Surface Mount COntact Pin Type, Gold Plated 1 µin,Dip Shell, 12 Pins, USB Plug Connector | Other | UP20-C-F-G-FL-1-P12-TR |
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UJ2-BH-W1-TH
Same Sky
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1 | Type B, USB 2.0, 480 Mbps, 30 Vac, 1 A, Right Angle, Through Hole Mounting Style, Through Hole Contact Pin Type, 3 µin Plating Thickness, White Insulator, USB Receptacle | Other | UJ2-BH-W1-TH |
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UJ2-BH-4-TH
Same Sky
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1 | Type B, USB 2.0, 480 Mbps, 30 Vac, 1 A, Right Angle, Through Hole Mounting Style, Through Hole Contact Pin Type, 30 µin Plating Thickness, Black Insulator, USB Receptacle | Other | UJ2-BH-4-TH |
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UJ2-BH-W4-TH
Same Sky
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1 | Type B, USB 2.0, 480 Mbps, 30 Vac, 1 A, Right Angle, Through Hole Mounting Style, Through Hole Contact Pin Type, 30 µin Plating Thickness, White Insulator, USB Receptacle | Other | UJ2-BH-W4-TH |
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UJ2-B-HR-G-TH
Same Sky
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1 | Type B, USB 2.0, 480 Mbps, 5 Vdc, 1.5 A, Right Angle, Through Hole Mounting Style, Through Hole Contact Pin Type, Board Lock, 0.6 µin Plating Thickness, Black Insulator, Pick & Place, USB Receptacle | Other | UJ2-B-HR-G-TH |
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R413R32200000M
Yageo Group
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1 | R41, Film, Metallized Polypropylene, Safety, 0.22 uF, 20%, 300 VAC, 300 VAC (Y2), 300 VAC, 1000 VDC, 110°C, -40°C, 110°C, 0.2 % , 100 GOhms, 400 V/us, 2, 8.82 g, 32mm, 22mm, 13mm, Lead Spacing = 27.5mm, 480 | Other | R413R32200000M |
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ERB-RD0R75X
Panasonic
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1 | Micro Chip Fuse, Size [L×W] (EIA) (mm): 1.0×0.5 (EIA:0402), Rated Current (A): 0.75, Internal R [at 25℃ max.] (mΩ): 190, Rated Voltage (Open Circuit Voltage) [DC] (V): 32, Interrupting Rating (A): 35, Category Temp. Range (°C): -40 to +125 | Other | ERB-RD0R75X |
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C052G300J2G5CR
Yageo Group
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1 | LDD Mil C0G PRF20, Ceramic, 30 pF, 5%, 200 VDC, 500 VDC, 125°C, -55°C, C0G, 0.15 % , R (0.01%/1000 Hrs), 100 GOhms, 4.83mm, 4.83mm, 2.29mm, Lead Spacing = 5.08mm, 31.75mm, 0.64mm, 100, 120 | Other | C052G300J2G5CR |
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ERBRE0R50V
Panasonic
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1 | Micro Chip Fuse, Size [L×W] (EIA) (mm): 1.6×0.8 (EIA:0603), Rated Current (A): 0.5, Internal R [at 25℃ max.] (mΩ): 330, Rated Voltage (Open Circuit Voltage) [DC] (V): 32, Interrupting Rating (A): 50, Category Temp. Range (°C): -40 to +125 | Other | ERBRE0R50V |
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3613C4R7K
TE Connectivity
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1 | ■ High Reliability■ Small Versatile Size -3.2 x 4.5 mm■ Temperature Range-30°C to +100°C■ Supplied in StandardCarrier Tape■ Suitable for Dip and WaveSolder■ Insulation 1000M R min■ Available from Stock | Inductor Moulded | 3613C4R7K |
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R5S72681P266FP#VS
Renesas Electronics
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1 | The SH7268, SH7269 Group are high-performance microcontrollers incorporating SH2A-FPU cores. The SH7268, SH7269 Group share the following features: (1) large-capacity 2.5 megabyte (MB) on-chip SRAM that is 1.7 times the capacity of the Renesas Electronics' existing MCU (SH7266) allowing display of WVGA size (800 x 480 pixel) images without any external SRAM. (2) Increased maximum CPU operating frequency by approximately 1.8 times (266 MHz), which provides increased performance for device control and digital | Quad Flat Packages | R5S72681P266FP#VS |
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R7FA8D1BFECFC#BA0
Renesas Electronics
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1 | The Renesas RA8D1 MCU group features the industry’s first 32-bit graphics-enabled microcontrollers (MCUs) based on the Arm® Cortex®-M85 (CM85) core, delivering breakthrough performance of over 3000 CoreMark points at 480 MHz and superior graphics capabilities that enable high resolutions display and Vision AI applications. These are general-purpose MCU devices and address diverse high-performance and compute-intensive applications in Industrial Automation, Home Appliances, Smart Home, Consumer, Building/Hom | Quad Flat Packages | R7FA8D1BFECFC#BA0 |
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R5S72680RW266FP#V0
Renesas Electronics
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1 | The SH7268, SH7269 Group are high-performance microcontrollers incorporating SH2A-FPU cores. The SH7268, SH7269 Group share the following features: (1) large-capacity 2.5 megabyte (MB) on-chip SRAM that is 1.7 times the capacity of the Renesas Electronics' existing MCU (SH7266) allowing display of WVGA size (800 x 480 pixel) images without any external SRAM. (2) Increased maximum CPU operating frequency by approximately 1.8 times (266 MHz), which provides increased performance for device control and digital | Quad Flat Packages | R5S72680RW266FP#V0 |
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R5S72681P266FP#VZ
Renesas Electronics
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1 | The SH7268, SH7269 Group are high-performance microcontrollers incorporating SH2A-FPU cores. The SH7268, SH7269 Group share the following features: (1) large-capacity 2.5 megabyte (MB) on-chip SRAM that is 1.7 times the capacity of the Renesas Electronics' existing MCU (SH7266) allowing display of WVGA size (800 x 480 pixel) images without any external SRAM. (2) Increased maximum CPU operating frequency by approximately 1.8 times (266 MHz), which provides increased performance for device control and digital | Quad Flat Packages | R5S72681P266FP#VZ |
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R5S72690P266FP#VZ
Renesas Electronics
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1 | The SH7268, SH7269 Group are high-performance microcontrollers incorporating SH2A-FPU cores. The SH7268, SH7269 Group share the following features: (1) large-capacity 2.5 megabyte (MB) on-chip SRAM that is 1.7 times the capacity of the Renesas Electronics' existing MCU (SH7266) allowing display of WVGA size (800 x 480 pixel) images without any external SRAM. (2) Increased maximum CPU operating frequency by approximately 1.8 times (266 MHz), which provides increased performance for device control and digital | Quad Flat Packages | R5S72690P266FP#VZ |
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R7FA8D1AFECBD#UC0
Renesas Electronics
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1 | The Renesas RA8D1 MCU group features the industry’s first 32-bit graphics-enabled microcontrollers (MCUs) based on the Arm® Cortex®-M85 (CM85) core, delivering breakthrough performance of over 3000 CoreMark points at 480 MHz and superior graphics capabilities that enable high resolutions display and Vision AI applications. These are general-purpose MCU devices and address diverse high-performance and compute-intensive applications in Industrial Automation, Home Appliances, Smart Home, Consumer, Building/Hom | BGA | R7FA8D1AFECBD#UC0 |
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R7FA8M1AHECFB#BA0
Renesas Electronics
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1 | The RA8M1 MCU Group features the industry’s first 32-bit microcontrollers (MCU) based on the Arm® Cortex®-M85 (CM85) core, delivering breakthrough performance of over 3000 CoreMark points at 480 MHz, with fully deterministic, low latency, real-time operation that enables customers’ most demanding application needs. These are general-purpose MCU devices and address diverse high-performance and compute-intensive applications in Industrial Automation, Home Appliances, Smart Home, Consumer, Building/Home Automa | Quad Flat Packages | R7FA8M1AHECFB#BA0 |
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R7FS124773A01CNB#AC1
Renesas Electronics
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1 | Uniquely suited for simple battery-operated sensing applications that require low power operation modes and fast wake-up times, the S124 MCU Group has 128 KB of flash memory and 16 KB of SRAM. It includes a 14-bit A/D Converter, 12-bit D/A Converter, and a Capacitive Touch Sensing Unit, in addition to safety and security features.Synergy Software Package (SSP)Commercial software worth over $100K which is available to developers using the Synergy Platform for no charge and with unlimited production license r | Quad Flat No-Lead | R7FS124773A01CNB#AC1 |
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PESD2CANFD27VU-QX
Nexperia
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1 | Reverse stand-off voltage: VRWM = 27 V• Low clamping voltage: VCL= 33 V at IPP = 1 A• ESD protection up to 20 kV (IEC 61000-4-2)• Low capacitance: Cd = 6 pF• ESD protection up to 20 kV (ISO 10605; C = 150 pF; R = 330 Ω)• High temperature capability: Tj = 175 °C• Qualified according to AEC-Q101 and recommended for use in automotive applications | SOT23 (3-Pin) | PESD2CANFD27VU-QX |
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ISL3176EIBZ-T
Renesas Electronics
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1 | The Renesas ISL317xE are ±15kV IEC61000 ESD protected, 3. 3V powered single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. These devices have very low bus currents (+125µA/-100µA), so they present a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification's 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are r | Small Outline Packages | ISL3176EIBZ-T |
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T4041037031-000
TE Connectivity
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1 | Body Features: Shell Plating Material Nickel | Environmental Protection Type Sealed | Circular Connector Insulation Material Type Polyamide 67 GF30 | Environmental Protection IP67 | O-Ring Material Silicone | Shell Base Material Brass | Peripheral Seal Material Silicone | Configuration Features: Number of Power Positions 0 | Contacts Preloaded Yes | Keying A | Keying & Polarized Position Locations A | Number of Positions 3 | Factory Installed Backshell No | Number of Signal Positions 3 | Contact Features: R | Other | T4041037031-000 |
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