50508 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	50508 ARK-LES Connectors	1	Wire Terminal		Check Price & Stock	3D model not available Symbol and footprint not available 0	0 Build or Request
	50508 Pulse Electronics Corporation	1	General Purpose Inductor, 2700uH, 20%, 1 Element,		Check Price & Stock	3D model not available Symbol and footprint not available 0	0 Build or Request
	5050864-5 TE Connectivity	1	Body Features: Sleeve Plating Material Tin \| Sleeve Material Copper \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Spring Plating Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Current Rating (Max) 5 AMP \| Contact Spring Plating Thickness .762 MICM \| Contact Base Material Beryllium Copper \| Contact Spring Plating Material Gold \| Dimensions: PCB Hole Diameter	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	5050865-5 TE Connectivity	1	Body Features: Sleeve Plating Material Tin \| Sleeve Material Copper \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Mating Area Plating Material Thickness 30 MICM \| Contact Base Material Beryllium Copper \| Contact Current Rating (Max) 6.5 AMP \| Contact Spring Plating Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Spring Plating Thickness .762 MICM \| Contact Spring Plating Material Gold \| Dimensions: Mating Pin Diam	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model

	5050865-3 TE Connectivity	1	Body Features: Sleeve Material Copper \| Sleeve Plating Material Tin \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Current Rating (Max) 6.5 AMP \| Contact Spring Plating Thickness 30 MICIN \| Contact Spring Plating Thickness .762 MICM \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Spring Plating Material Gold \| Contact Base Material Beryllium Copper \| Dimensions: Socket Length 6	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	5050871-1 TE Connectivity	1	Body Features: Sleeve Plating Material Tin \| Sleeve Material Copper \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Spring Plating Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Current Rating (Max) 7.5 AMP \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Base Material Beryllium Copper \| Contact Spring Plating Material Gold \| Contact Spring Plating Thickness .762 MICM \| Dimensions: Socket Length 7	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	SM150508-7 DB Unlimited	1	Speakers & Transducers 15x11x3, 8 Ohm SPRING CONTACTS	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	1-5050871-9 TE Connectivity	1	Discrete PCB socket, open bottom, 7.32mm	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2-5050871-3 TE Connectivity	1	Body Features: Sleeve Plating Material Tin \| Sleeve Material Copper \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Spring Plating Thickness .762 MICM \| Contact Base Material Beryllium Copper \| Contact Spring Plating Material Gold \| Contact Spring Plating Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Current Rating (Max) 7.5 AMP \| Dimensions: Wire Size 1.31	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2250508-1 TRP Connector	1	Modular Connectors / Ethernet Connectors RJ45,1X1,10G BASE-T TAB UP	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	IRSM505-084DA Infineon	1	Motor / Motion / Ignition Controllers & Drivers MICRO MCM	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	250-508/000-012 Wago	1	PCB terminal block; push-button; 1.5 mm²; Pin spacing 5 mm; 8-pole; Push-in CAGE CLAMP®	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2-1445050-8 TE Connectivity	1	Configuration Features: Number of Rows 1 \| Number of Power Positions 8 \| PCB Mount Orientation Vertical \| Number of Positions 8 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Multiple Contact Types Without \| Contact Current Rating (Max) 5 AMP \| Contact Mating Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 2.54 â€“ 7.62 MICM \| PCB Contact Termination Area Plating Material Thickness 100 MICIN \| Contact Layout Inline \| Contact Mating Area Plating Material Th	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	2-1445050-8 TE Connectivity	1	Configuration Features: Number of Rows 1 \| Number of Power Positions 8 \| PCB Mount Orientation Vertical \| Number of Positions 8 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Multiple Contact Types Without \| Contact Current Rating (Max) 5 AMP \| Contact Mating Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 2.54 â€“ 7.62 MICM \| PCB Contact Termination Area Plating Material Thickness 100 MICIN \| Contact Layout Inline \| Contact Mating Area Plating Material Th	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	XAL5050-822MEC COILCRAFT	1	Fixed Inductors 8.2uH 20% 6.1A 34.95mOhms AEC-Q200	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model

	1-5050871-0 TE Connectivity	1	SOCKET,MIN-SPR W/H SN-AU SER-5	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	250-508 Wago	1	PCB terminal block; push-button; 1.5 mm²; Pin spacing 5 mm; 8-pole; Push-in CAGE CLAMP®	Other	Check Price & Stock	3D model available Symbol and footprint available 3	1 Download Model
	5050864-1 TE Connectivity	1	Body Features: Sleeve Material Copper \| Sleeve Plating Material Tin \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Base Material Beryllium Copper \| Contact Spring Plating Thickness .762 MICM \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Spring Plating Material Gold \| Contact Spring Plating Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Current Rating (Max) 5 AMP \| Dimensions: PCB Thickness (Re		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	5050863-8 TE Connectivity	1	Body Features: Sleeve Material Copper \| Sleeve Plating Material Tin \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM \| Contact Spring Plating Thickness 30 MICIN \| Contact Spring Plating Material Tin \| Contact Current Rating (Max) 4 AMP \| Contact Base Material Beryllium Copper \| Contact Spring Plating Thickness 2.54 MICM \| Dimensions: Wire Size .081 â€“ .326 MMSQ \| PCB Hole Diameter 1.32 MM \| PCB Thickness (		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	5050863-6 TE Connectivity	1	Body Features: Sleeve Material Copper \| Sleeve Plating Material Tin \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Spring Plating Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness 2.54 MICM \| Contact Base Material Beryllium Copper \| Contact Current Rating (Max) 4 AMP \| Contact Spring Plating Thickness 2.54 MICM \| Contact Spring Plating Material Tin \| Dimensions: Socket Length .26 INCH \| Wire Size 28 â€“ 22 AWG \| Mating Pin Diameter Ran		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	50508-8 ARK-LES Connectors	1	Wire Terminal		Check Price & Stock	3D model not available Symbol and footprint not available 0	0 Build or Request
	5050863-7 TE Connectivity	1	Interconnect Device:Other, INTERCONNECTION DEVICE, INTERCONNECTION DEVICE		Check Price & Stock	3D model not available Symbol and footprint not available 0	0 Build or Request
	5050863-1 TE Connectivity	1	Body Features: Sleeve Material Copper \| Sleeve Plating Material Tin \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Mating Area Plating Material Thickness 30 MICM \| Contact Spring Plating Thickness .762 MICM \| Contact Current Rating (Max) 4 AMP \| Contact Spring Plating Material Gold \| Contact Base Material Beryllium Copper \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Spring Plating Thickness 30 MICIN \| Dimensions: Wire Size .081 â€		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	5050865-6 TE Connectivity	1	Body Features: Sleeve Plating Material Tin \| Sleeve Material Copper \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Base Material Beryllium Copper \| Contact Mating Area Plating Material Thickness 2.54 MICM \| Contact Spring Plating Thickness 30 MICIN \| Contact Spring Plating Material Tin \| Contact Spring Plating Thickness 2.54 MICM \| Contact Current Rating (Max) 6.5 AMP \| Dimensions: Socket Length .26 INCH \| Wire Size 20 â€“ 18 AWG \| PCB Hole Diameter 1.8		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
	5050863-5 TE Connectivity	1	Body Features: Sleeve Material Copper \| Sleeve Plating Material Tin \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Mating Area Plating Material Thickness 30 MICM \| Contact Current Rating (Max) 4 AMP \| Contact Spring Plating Thickness .762 MICM \| Contact Spring Plating Material Gold \| Contact Spring Plating Thickness 30 MICIN \| Contact Base Material Beryllium Copper \| Contact Mating Area Plating Material Thickness 30 MICIN \| Dimensions: Wire Size .081 â€		Check Price & Stock	3D model available Symbol and footprint not available 1	1 Download Model
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