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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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144-5062
RS Pro
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1 | 1.3V-5.5V, 2A, 60mΩ ULTRA-LOW LEAKAGE LOAD SWITCH | Other | 144-5062 |
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144-5018
RS Pro
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0 | 50 MHz Clock Oscillator, ±50ppm CMOS, 4-Pin SMD | Other | 144-5018 |
3
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231-445/001-000
Wago
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1 | THT male header; 1.0 x 1.0 mm solder pin; angled; Pin spacing 5 mm; 15-pole | Other | 231-445/001-000 |
3
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144-5003
RS Pro
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0 | RS PRO, 20 MHz Clock Oscillator, ±50ppm TTL, 4-Pin SMD | Other | 144-5003 |
3
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2-1445098-5
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Positions 5 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Gold | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Layout In | Other | 2-1445098-5 |
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2-1445084-5
TE Connectivity
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1 | Configuration Features: Number of Power Positions 5 | Number of Positions 5 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Retention Within | Other | 2-1445084-5 |
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2-1445057-5
TE Connectivity
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1 | Configuration Features: Number of Power Positions 5 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Are | Other | 2-1445057-5 |
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2-1445055-7
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 7 | Number of Positions 7 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Wit | Other | 2-1445055-7 |
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2-1445093-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 8 | PCB Mount Orientation Vertical | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Ter | Other | 2-1445093-8 |
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2-1445085-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB | Other | 2-1445085-2 |
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2-1445057-3
TE Connectivity
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1 | Configuration Features: Number of Power Positions 3 | PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | 2-1445057-3 |
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2-1445099-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plati | Other | 2-1445099-4 |
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2-1445088-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Contact Layout Inline | PCB Contact Terminati | Other | 2-1445088-4 |
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2-1445088-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Contact Layout Inline | PCB Contact Terminati | Other | 2-1445088-4 |
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2-1445091-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | 2-1445091-2 |
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2-1445091-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | 2-1445091-2 |
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2-1445093-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | Number of Rows 1 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Cont | Other | 2-1445093-5 |
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2-1445100-5
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Signal Positions 0 | PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Positions 5 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housi | Other | 2-1445100-5 |
3
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2-1445055-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Retention W | Other | 2-1445055-5 |
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2-1445055-9
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 9 | Number of Power Positions 9 | PCB Mount Orientation Right Angle | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Platin | Other | 2-1445055-9 |
3
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2-1445088-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Layout Inline | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Terminat | Other | 2-1445088-6 |
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2-1445096-5
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 5 | Number of Power Positions 5 | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type | Other | 2-1445096-5 |
3
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2-1445051-5
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 5 | Number of Power Positions 5 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Matin | Other | 2-1445051-5 |
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2-1445088-5
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 5 | Number of Rows 1 | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Dimensions: Produ | Other | 2-1445088-5 |
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2-1445053-5
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 5 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Surface Mount, Power, Black, Micro MATE-N-LOK | Other | 2-1445053-5 |
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