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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2-1705300-8
TE Connectivity
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1 | Body Features: Primary Product Color Black | Ejector Type Push-Pull | Configuration Features: Card Insertion Style Normal Insertion | Number of Positions 6 | Card Detection Switch Without | Number of Loaded Positions 6 | Contact Features: Contact Base Material Copper Alloy | Contact Mating Retention Without | Contact Current Rating (Max) .5 AMP | Dimensions: Profile Height from PCB .106 INCH | Profile Height from PCB 2.7 MM | Electrical Characteristics: Current Rating (Max) .5 AMP | Voltage Rating 30 VAC | | Other | 2-1705300-8 |
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2-1705300-8
TE Connectivity
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1 | Body Features: Primary Product Color Black | Ejector Type Push-Pull | Configuration Features: Card Insertion Style Normal Insertion | Number of Positions 6 | Card Detection Switch Without | Number of Loaded Positions 6 | Contact Features: Contact Base Material Copper Alloy | Contact Mating Retention Without | Contact Current Rating (Max) .5 AMP | Dimensions: Profile Height from PCB .106 INCH | Profile Height from PCB 2.7 MM | Electrical Characteristics: Current Rating (Max) .5 AMP | Voltage Rating 30 VAC | | Other | 2-1705300-8 |
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STPS2170AFN
STMicroelectronics
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1 | 170 V, 2 A Power Schottky rectifier | Small Outline Diode Flat Lead | STPS2170AFN |
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STPS2170AF
STMicroelectronics
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1 | 170 V, 2 A Power Schottky rectifier | Small Outline Diode Flat Lead | STPS2170AF |
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5442170
Phoenix Contact
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1 | Fixed Terminal Blocks BC-500X10- 2 GN 5.00 MM PITCH | Other | 5442170 |
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217063-0025
Molex
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1 | Connector Shrouded Header 2 Position 2mm Solder Straight Surface Mount Emboss T/R | Other | 217063-0025 |
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2170640021
Molex
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1 | Micro-One Wire-to-Board Header, Right-Angle, 2.00mm Pitch, Single Row, Glow-Wire Capable, 2 Circuits | Other | 2170640021 |
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2170806-5
TE Connectivity
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1 | Body Features: Heat Sink Style Pin | Heat Sink Height Class SAN | Heat Sink Height .256 INCH | Heat Sink Finish Anodized Black | Configuration Features: Number of Rear EONs per Port Column 0 | Number of Ports 2 | Port Matrix Configuration 1 x 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Cage Material Nickel Silver | Indu | Other | 2170806-5 |
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2170630027
Molex
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1 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, 2 Circuits, Black, with Potting Capability, with Cover Tape | Other | 2170630027 |
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2170286-1
TE Connectivity
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1 | Configuration Features: Number of Positions 160 | Number of Ports 8 | Port Matrix Configuration 2 x 4 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 4 GBS | Housing Features: Centerline (Pitch) .8 MM | Cage Material Nickel Silver | Centerline | Other | 2170286-1 |
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2-2170705-1
TE Connectivity
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1 | Body Features: Heat Sink Height .165 INCH | Heat Sink Style Pin | Heat Sink Height Class PCI | Heat Sink Finish Anodized Black | Configuration Features: Number of Rear EONs per Port Column 2 | Number of Ports 1 | Port Matrix Configuration 1 x 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Cage Material Nickel Silver | Indu | Other | 2-2170705-1 |
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2-2170705-2
TE Connectivity
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1 | Body Features: Heat Sink Finish Anodized Black | Heat Sink Style Pin | Heat Sink Height .256 INCH | Heat Sink Height Class SAN | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Number of Rear EONs per Port Column 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recommended) 1.57 MM | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Cage Material Nickel Silver | Indu | Other | 2-2170705-2 |
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2170129-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: EMI Finger Location Sides | EMI Finger Location Bottom | Number of Loaded Positions 8 | Status Light Type Lightpipe | Port Configuration Multiple Ports | Multiple Port Configuration Ganged | Number of Positions 8 | Port Matrix Configuration 1 x 2 | PCB Mount Orientation Right Angle | Connector Contact Density High | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Current Rating (Max) .02 AMP | Housin | Other | 2170129-1 |
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2170630055
Molex
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1 | 2.0 ST ASSY 5CKT ETP BK_GW POT-1 | Other | 2170630055 |
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GWPLLRA1.CM-M7N2-XX52-1-700-R1
ams OSRAM
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1 | High-power LED with Chip-Scale-Package (CSP) Color temperature: 2700K - 6500K CRI: 90 (min.), 93 (typ.), R9: 50 (min.) | Other | GWPLLRA1.CM-M7N2-XX52-1-700-R1 |
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LMZ21701SILT
Texas Instruments
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1 | 3V to 17V, 1A Step-Down DC/DC Power Module in 3.5mm × 3.5mm Package | Other | LMZ21701SILT |
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0217015.MXEP
LITTELFUSE
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1 | Fuses with Leads - Through Hole 250 V 15A 5x20mm Fast Acting | Other | 0217015.MXEP |
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GW CSSRM3.CM-M9N4-A232-1-700-R33
ams OSRAM
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1 | AMS OSRAM GROUP - GW CSSRM3.CM-M9N4-A232-1-700-R33 - High Brightness LED, OSLON Square Series, Cool White, 120 °, 320 lm, 5700 K, 1.8 A | Other | GW CSSRM3.CM-M9N4-A232-1-700-R33 |
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C0402C102K5RAC31217042
KEMET
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1 | Cap Ceramic 0.001uF 50V X7R 10% Pad SMD 0402 125°C | Other | C0402C102K5RAC31217042 |
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217063-0067
Molex
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1 | Headers & Wire Housings M-One 2mm VRT HDR SR 6CKT GW W/CVR Tape | Other | 217063-0067 |
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IC51-0442-1709
Yamaichi
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1 | IC Socket, TSOP44, 44 Contact(s), 1.5748mm Term Pitch, 0.2/0.646inch Row Spacing, Solder | Other | IC51-0442-1709 |
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217063-0055
Molex
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1 | Headers & Wire Housings M-One 2mm VRT HDR SR 5CKT GW W/POTNG CAP | Other | 217063-0055 |
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232-170
Wago
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1 | THT female header; straight; Pin spacing 5.08 mm; 10-pole; 0.6 x 1.0 mm solder pin | Other | 232-170 |
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250-217/000-012
Wago
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1 | PCB terminal block; push-button; 1.5 mm²; Pin spacing 3.5 mm; 17-pole; Push-in CAGE CLAMP® | Other | 250-217/000-012 |
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5962-9221702MRA
Renesas Electronics
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1 | The 5962-92217 (equivalent to IDT 54FCT373T) is an octal transparent latch with 3-state outputs and is intended for bus oriented applications. The flip-flops appear transparent to the data when Latch Enable (LE) is high. When LE is low, the data that meets the set-up time is latched. The 5962-92217 operates at -55C to +125C. (For commercial version, see 74FCT373T) | Ceramic Dual-In-Line Packages | 5962-9221702MRA |
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