2-767 Model Download Search Results
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2-767004-2
TE Connectivity
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1 | Board to Board & Mezzanine Connectors 38P RECEPT ASSY | Other | 2-767004-2 |
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5227673-1
TE Connectivity
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1 | Body Features: Body Plating Material Nickel | Body Material Zinc | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 1 | Number of Coaxial Contacts 1 | Contact Features: RF Connector Center Contact Plating Material Gold | RF Connector Center Contact Material Phosphor Bronze | RF Connector Center Contact Plating Thickness 889 MICIN | RF Connector Center Contact Underplating Material Nickel | Dimensions: Mounting Post Length 3.48 MM | Mounting Post Length .137 INCH | Profile Height | Other | 5227673-1 |
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B82767S4263N030
TDK
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1 | Power Line Chokes, L=0.43mH Rated current=26A, LxWxT:60mmx60mmx33mm | Other | B82767S4263N030 |
3
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1027676
Phoenix Contact
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1 | Device connector, rear mounting, 5-position, Pin, straight, M12-Push-Pull, coding: A, Rear mounting, M16, Wave soldering, Item is lead-free in accordance with RoHS II without Exemption 6c (Pb <0.1%) | Other | 1027676 |
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227673-1
TE Connectivity
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1 | Body Features: Body Material Zinc | Body Plating Material Nickel | Configuration Features: Number of Positions 1 | Number of Coaxial Contacts 1 | PCB Mount Orientation Vertical | Contact Features: RF Connector Center Contact Material Phosphor Bronze | RF Connector Center Contact Underplating Material Nickel | RF Connector Center Contact Plating Thickness 889 MICIN | RF Connector Center Contact Plating Material Gold | Dimensions: Profile Height from PCB 34.93 MM | Mounting Post Length 3.48 MM | Profile Heigh | Other | 227673-1 |
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TLP2767(E(O
Toshiba
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1 | Optocoupler Logic-Out Totem-Pole DC-IN 1-CH 6-Pin SOIC | Small Outline Packages | TLP2767(E(O |
3
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LM2767M5X/NOPB
Texas Instruments
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1 | 11kHz switched capacitor voltage converter | SOT23 (5-Pin) | LM2767M5X/NOPB |
3
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232-767/039-000
Wago
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1 | THT female header; straight; Pin spacing 7.62 mm; 7-pole; Locking lever; 0.6 x 1.0 mm solder pin | Other | 232-767/039-000 |
3
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227676-1
TE Connectivity
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1 | Body Features: Body Material Zinc | Body Plating Material Nickel | Configuration Features: Number of Coaxial Contacts 1 | PCB Mount Orientation Right Angle | Number of Positions 1 | Contact Features: RF Connector Center Contact Underplating Material Nickel | RF Connector Center Contact Plating Material Gold | RF Connector Center Contact Material Phosphor Bronze | RF Connector Center Contact Plating Thickness 30 MICIN | Dimensions: RF Connector Mated Outer Diameter (Approximate) .572 INCH | RF Connector Mate | Other | 227676-1 |
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2327670-3
TE Connectivity
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1 | Configuration Features: Number of Positions 140 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .762 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Current Rating (Max) 1.1 AMP | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitc | Other | 2327670-3 |
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LM2767M5/NOPB
Texas Instruments
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1 | Texas Instruments LM2767M5/NOPB, Charge Pump 15mA 25 kHz, 5-Pin, SOT-23 | SOT23 (5-Pin) | LM2767M5/NOPB |
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232-767/031-000
Wago
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1 | THT female header; straight; Pin spacing 7.62 mm; 7-pole; clamping collar; 0.6 x 1.0 mm solder pin | Other | 232-767/031-000 |
3
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5227677-1
TE Connectivity
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1 | Body Features: Body Plating Material Nickel | Body Material Zinc | Configuration Features: Number of Positions 1 | PCB Mount Orientation Right Angle | Number of Coaxial Contacts 1 | Contact Features: RF Connector Center Contact Plating Material Gold | RF Connector Center Contact Plating Thickness 30 MICIN | RF Connector Center Contact Underplating Material Nickel | RF Connector Center Contact Material Phosphor Bronze | Dimensions: Profile Height from PCB 15.88 MM | Mounting Post Length .137 INCH | RF Connec | Other | 5227677-1 |
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232-767/045-000
Wago
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1 | THT female header; straight; Pin spacing 7.62 mm; 7-pole; 0.6 x 1.0 mm solder pin | Other | 232-767/045-000 |
3
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232-767/047-000
Wago
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1 | THT female header; straight; Pin spacing 7.62 mm; 7-pole; Spacer flange; 0.6 x 1.0 mm solder pin | Other | 232-767/047-000 |
3
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TLP2767(TP,E
Toshiba
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1 | Photocouplers GaA ℓAs Infrared LED & Photo IC, | Small Outline Packages | TLP2767(TP,E |
3
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LM2767M5
Texas Instruments
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1 | Switched Capacitor Voltage Converter | SOT23 (5-Pin) | LM2767M5 |
3
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LM2767M5X
Texas Instruments
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1 | IC REG SWITCHD CAP 2VIN SOT23 | SOT23 (5-Pin) | LM2767M5X |
3
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1762767
Phoenix Contact
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1 | Phoenix Contact PC Series, 15mm Pitch 4 Way Printed Circuit Board Connector, Solder Termination, 125A | Other | 1762767 |
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TLP2767
Toshiba
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1 | Photocoupler (photo-IC output), High-speed, 50 Mbps, 5000 Vrms, SO6L | Small Outline Packages | TLP2767 |
3
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1827676
Phoenix Contact
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1 | PCB header, nominal cross section: 2.5 mm?, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 16, Number of rows: 1, Number of positions per row: 16, number of connections: 16, product range: CCA 2,5/..-G, pitch: 5.08 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, Stecksystem: CLASSIC COMBICON, Locking: without, type of packaging: packed in cardboard | Other | 1827676 |
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B82767S4193N030
TDK
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1 | Power Line Chokes, L=1mH Rated current=19A, LxWxT:60mmx60mmx33mm | Other | B82767S4193N030 |
3
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232-767
Wago
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1 | THT female header; straight; Pin spacing 7.62 mm; 7-pole; 0.6 x 1.0 mm solder pin | Other | 232-767 |
3
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B82767S4123N030
TDK
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1 | Power Line Chokes, L=1.45mH Rated current=12A, LxWxT:60mmx60mmx33mm | Other | B82767S4123N030 |
3
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5227671-1
TE Connectivity
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1 | Body Features: Body Plating Material Nickel | Body Material Zinc | Configuration Features: Number of Positions 1 | PCB Mount Orientation Vertical | Number of Coaxial Contacts 1 | Contact Features: RF Connector Center Contact Material Phosphor Bronze | RF Connector Center Contact Plating Thickness 5080 MICIN | RF Connector Center Contact Underplating Material Nickel | RF Connector Center Contact Plating Material Tin | Dimensions: Profile Height from PCB 1.375 INCH | RF Connector Mated Outer Diameter (Approxi | Other | 5227671-1 |
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