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21325 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
21325 Molex
1 Barrier Strip Terminal Block, 30A, 2 Row(s), 1 Deck(s), 21325 0 Build or Request
Part Image Part Image
21325 HELUKABEL
1 Wire And Cable, 8 Conductor(s), 24AWG, 500V, Communication Cable, 21325 0 Build or Request
Part Image Part Image
0213.250 LITTELFUSE
1 Cartridge Fuses 250V .25A Slo-Blo Resistors, Axial Diameter Horizontal Mounting 0213.250 1 Download Model
Part Image Part Image 1 CONNECTOR Right Angle 21 Position 0.635 mm 2 Row cable to board Right angle PTH Other NK-2E2-021-325-TH00 1 Download Model
Part Image Part Image 1 32 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1, Parallel, SMT, High Density, High Speed, Rugged, EMC Other 405-52132-51 1 Download Model
Part Image Part Image 1 LDO Voltage Regulators 80mA uCap LDO SOT23 (5-Pin) MIC5213-2.5YC5-TR 1 Download Model
Part Image Part Image
292132-5 TE Connectivity
1 Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 5 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Mating Pin Diameter .6 MM | Contact Mating Area Length 4.2 MM | Contact Mating Area Length .165 INCH | Contact Shape & Form Round | Mating Pin Diameter .024 INCH | Contact Current Rating (Max) 4 AMP | Contact Mating Area Plating Material Thickness 1 MICM | PCB Contact Termination Area Plating Material T Header, Shrouded - Straight PTH Box 292132-5 1 Download Model
Part Image Part Image
292132-5 TE Connectivity
1 Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 5 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Mating Pin Diameter .6 MM | Contact Mating Area Length 4.2 MM | Contact Mating Area Length .165 INCH | Contact Shape & Form Round | Mating Pin Diameter .024 INCH | Contact Current Rating (Max) 4 AMP | Contact Mating Area Plating Material Thickness 1 MICM | PCB Contact Termination Area Plating Material T Header, Shrouded - Straight PTH Box 292132-5 1 Download Model
Part Image Part Image 1 32 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1, Parallel, SMT, High Density, High Speed, Rugged, EMC Other 406-52132-51 1 Download Model
Part Image Part Image
0213.250MXEP LITTELFUSE
1 Cartridge Fuses 250V .25A Slo-Blo Resistors, Axial Diameter Horizontal Mounting 0213.250MXEP 1 Download Model
Part Image Part Image 1 D-Sub MIL Spec Connectors Microminiature Series .050 Other MK-252-021-325-410S 1 Download Model
Part Image Part Image
2132572-1 TE Connectivity
1 IMP100O,HMP,V3P6C,RG,LEW46,4.9 2132572-1 0 Build or Request
Part Image Part Image
2132586-1 TE Connectivity
1 IMP100O,HMP,V3P8C,LG,REW46,4.9 2132586-1 0 Build or Request
Part Image Part Image
2132528-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Rows 9 | Number of Signal Positions 36 | Stackable No | Guide Location Left | PCB Mount Orientation Vertical | Number of Ground Positions 18 | Number of Columns 6 | Number of Positions 54 | Number of Pairs 18 | Contact Features: Contact Shape & Form Dual Beam | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Underplating Material Nickel | Contact Mating Area Length .177 INCH | Contact Base Material Cop 2132528-1 1 Download Model
Part Image Part Image
2132532-3 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Guide Location Right | Number of Signal Positions 36 | Stackable No | Number of Ground Positions 18 | Number of Pairs 18 | Number of Rows 9 | Number of Columns 6 | Number of Positions 54 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Thickness 1. 2132532-3 1 Download Model
Part Image Part Image
2132531-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 18 | Stackable No | PCB Mount Orientation Vertical | Number of Pairs 18 | Number of Columns 6 | Number of Positions 54 | Guide Location Right | Number of Rows 9 | Number of Signal Positions 36 | Contact Features: Contact Base Material Copper Alloy | Contact Shape & Form Dual Beam | Contact Mating Area Length 4.9 MM | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Ma 2132531-2 1 Download Model
Part Image Part Image
2132595-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Stackable No | Guide Location Right | Number of Ground Positions 24 | Backplane Architecture Orthogonal | Number of Rows 12 | Number of Signal Positions 48 | Number of Pairs 24 | Number of Positions 72 | Number of Columns 6 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) .75 AMP | Contact Layout Inline | Contact Base Material Copper Nickel Silico 2132595-2 1 Download Model
Part Image Part Image
2132530-3 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 36 | Guide Location Right | Number of Columns 6 | Number of Ground Positions 18 | Number of Pairs 18 | Number of Positions 54 | Stackable No | Number of Rows 9 | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Length 5.5 MM | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Mating Area Length .217 INCH | Contact L 2132530-3 1 Download Model
Part Image Part Image
2132533-1 TE Connectivity
1 IMP100S,H,V3P6C,RG,LEW39,4.5 2132533-1 1 Download Model
Part Image Part Image
2132533-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Stackable No | Number of Columns 6 | PCB Mount Orientation Vertical | Number of Rows 9 | Number of Signal Positions 36 | Guide Location Right | Number of Pairs 18 | Number of Positions 54 | Number of Ground Positions 18 | Contact Features: Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Materia 2132533-2 1 Download Model
Part Image Part Image
2132534-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 18 | PCB Mount Orientation Vertical | Number of Positions 54 | Number of Rows 9 | Number of Signal Positions 36 | Stackable No | Number of Columns 6 | Number of Ground Positions 18 | Guide Location Unguided | Contact Features: PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Terminatio 2132534-1 0 Build or Request
Part Image Part Image
2132593-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | Number of Positions 72 | PCB Mount Orientation Vertical | Number of Columns 6 | Stackable No | Number of Ground Positions 24 | Guide Location Left | Number of Signal Positions 48 | Number of Rows 12 | Number of Pairs 24 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) .75 AMP | Contact Underplating Material Nickel | PCB Contact Termination Area Pl 2132593-2 0 Build or Request
Part Image Part Image
2132566-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | Number of Positions 54 | Number of Pairs 18 | Number of Rows 9 | Number of Columns 6 | Guide Location Unguided | Stackable No | Number of Signal Positions 36 | PCB Mount Orientation Vertical | Number of Ground Positions 18 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Length 4.5 MM | Contact Layout Inline | Contact Current Rating (Max) .75 AMP | Cont 2132566-1 1 Download Model
Part Image Part Image
2132598-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Backplane Architecture Orthogonal | Number of Signal Positions 48 | Number of Columns 6 | Guide Location Unguided | Number of Ground Positions 24 | Stackable No | Number of Pairs 24 | Number of Rows 12 | Number of Positions 72 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Mating Area Platin 2132598-1 0 Build or Request
Part Image Part Image
2132539-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 36 | Number of Pairs 18 | Stackable No | PCB Mount Orientation Vertical | Number of Columns 6 | Number of Rows 9 | Number of Positions 54 | Number of Ground Positions 18 | Guide Location Unguided | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Shape & Form Dual Beam | PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Thickness 29.92 M 2132539-2 1 Download Model
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