22891 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2289129-2 TE Connectivity	1	Configuration Features: Number of Positions 152 \| Port Matrix Configuration 2 x 2 \| Number of Ports 4 \| Number of Rear EONs per Port Column 3 \| Contact Features: Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| PCB Contact Termination Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Underplating Material Tin \| Contact Mating Area Plating Material Thickness 30 MICIN \| Dimensions: PCB Thickness (Recommended) 1.57 MM \| PCB Thickness	Other	2289129-2	3D model available Symbol and footprint available 3	1 Download Model
	1822891 Phoenix Contact	1	PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 160 V, nominal cross section: 1.5 mm?, Number of potentials: 5, Number of rows: 1, Number of positions per row: 5, product range: SPT 1,5/..-H-THR, pitch: 3.81 mm, connection method: Push-in spring connection, mounting: THR soldering, conductor/PCB connection direction: 0 ?, color: black, Pin layout: Linear double pinning, Solder pin [P]: 2.6 mm, type of packaging: packed in cardboard	Other	1822891	3D model available Symbol and footprint available 3	1 Download Model
	22-28-9152 Molex	1	Header Connector,PCB Mount,RECEPT,15 Contacts,PIN,0.1 Pitch,PC TAIL W/RETNN Terminal	Header, Unshrouded - Right Angle PTH Pin	22-28-9152	3D model available Symbol and footprint available 3	1 Download Model
	2289129-5 TE Connectivity	1	Configuration Features: Number of Ports 4 \| Number of Positions 152 \| Number of Rear EONs per Port Column 3 \| Port Matrix Configuration 2 x 2 \| Contact Features: PCB Contact Termination Area Plating Material Gold \| Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Contact Underplating Material Tin \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 30 MICIN \| Dimensions: PCB Thickness (Recommended) 1.57 MM \| PCB Thickness		2289129-5	3D model available Symbol and footprint not available 1	1 Download Model

	2289129-3 TE Connectivity	1	Configuration Features: Port Matrix Configuration 2 x 2 \| Number of Rear EONs per Port Column 3 \| Number of Positions 152 \| Number of Ports 4 \| Contact Features: Contact Underplating Material Tin \| PCB Contact Termination Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Thickness 30 MICIN \| Dimensions: PCB Thickness (Recommended) 1.57 MM \| PCB Thickness		2289129-3	3D model available Symbol and footprint not available 1	1 Download Model
	2289129-4 TE Connectivity	1	Configuration Features: Port Matrix Configuration 2 x 2 \| Number of Positions 152 \| Number of Rear EONs per Port Column 3 \| Number of Ports 4 \| Contact Features: PCB Contact Termination Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Current Rating (Max) .5 AMP \| Contact Underplating Material Tin \| Dimensions: PCB Thickness (Recommended) 1.57 MM \| Electrical Ch		2289129-4	3D model available Symbol and footprint not available 1	1 Download Model
	2289129-8 TE Connectivity	1	Configuration Features: Port Matrix Configuration 2 x 2 \| Number of Ports 4 \| Number of Rear EONs per Port Column 3 \| Number of Positions 152 \| Contact Features: Contact Current Rating (Max) .5 AMP \| Electrical Characteristics: Data Rate (Max) 28 GBS \| Housing Features: Cage Material Nickel Silver Alloy \| Centerline (Pitch) .8 MM \| Centerline (Pitch) .031 INCH \| Operation/Application: Circuit Application Signal \| Other: EMI Containment Feature Type Internal/External EMI Springs \| Included Lightpipe Yes \| Pa		2289129-8	3D model not available Symbol and footprint not available 0	0 Build or Request
	2289129-1 TE Connectivity	1	Configuration Features: Number of Rear EONs per Port Column 3 \| Port Matrix Configuration 2 x 2 \| Number of Positions 152 \| Number of Ports 4 \| Contact Features: Contact Underplating Material Tin \| Contact Mating Area Plating Material Gold \| PCB Contact Termination Area Plating Material Gold \| Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 30 MICIN \| Dimensions: PCB Thickness (Recommended) 1.57 MM \| Electrical Ch		2289129-1	3D model available Symbol and footprint not available 1	1 Download Model
	2289104 Phoenix Contact	1	Interconnection Device, ROHS COMPLIANT		2289104	3D model not available Symbol and footprint not available 0	0 Build or Request
	2289129-9 TE Connectivity	1	Configuration Features: Number of Ports 4 \| Number of Rear EONs per Port Column 3 \| Port Matrix Configuration 2 x 2 \| Number of Positions 152 \| Contact Features: Contact Current Rating (Max) .5 AMP \| Housing Features: Centerline (Pitch) .8 MM \| Centerline (Pitch) .031 INCH \| Operation/Application: Circuit Application Signal \| Other: Included Lightpipe Yes \| EMI Containment Feature Type Internal/External EMI Springs \| Product Type Features: Cage Type Stacked \| Sealable No \| Form Factor zQSFP+ \| Pluggable I/O		2289129-9	3D model not available Symbol and footprint not available 0	0 Build or Request
	2289129-7 TE Connectivity	1	Configuration Features: Number of Rear EONs per Port Column 3 \| Number of Positions 152 \| Number of Ports 4 \| Port Matrix Configuration 2 x 2 \| Contact Features: Contact Current Rating (Max) .5 AMP \| PCB Contact Termination Area Plating Material Tin \| Electrical Characteristics: Data Rate (Max) 28 GBS \| Housing Features: Centerline (Pitch) .8 MM \| Centerline (Pitch) .031 INCH \| Cage Material Nickel Silver Alloy \| Operation/Application: Circuit Application Signal \| Other: EMI Containment Feature Type Interna		2289129-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	2289120-2 TE Connectivity	0	Contact Features: Contact Size 1.5mm \| Terminal Type Tab \| Interface Plating Tin (Sn) \| Dimensions: Tab Length .72 INCH \| Tab Length 18.39 MM \| Other: Terminal Transmits 0 â€“ 24 A (Low Power) \| Product Type Features: Sealable No \| Termination Features: Product Terminates To Printed Circuit Board \|		2289120-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	2289129-6 TE Connectivity	1	Configuration Features: Number of Rear EONs per Port Column 3 \| Number of Ports 4 \| Port Matrix Configuration 2 x 2 \| Number of Positions 152 \| Contact Features: Contact Current Rating (Max) .5 AMP \| Contact Underplating Material Tin \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness 30 MICIN \| PCB Contact Termination Area Plating Material Gold \| Dimensions: PCB Thickness (Recommended) 1.57 MM \| PCB Thickness		2289129-6	3D model not available Symbol and footprint not available 0	0 Build or Request
	90228-919LF Amphenol Communications Solutions	1	Board Stacking Connector, 19 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, LEAD FREE		90228-919LF	3D model not available Symbol and footprint not available 0	0 Build or Request
	22-28-9163 Molex	1	Board Connector, 16 Contact(s), 1 Row(s), Male, Right Angle, 0.1 inch Pitch, Solder Terminal, Receptacle, ROHS COMPLIANT		22-28-9163	3D model available Symbol and footprint not available 1	1 Download Model

	702-289-17A-LC-L Cooper Industries	1	PGA SOCKET,289 CONTACTS,17X17,0.1 ROW SPACING,PC TAIL TERMINAL		702-289-17A-LC-L	3D model not available Symbol and footprint not available 0	0 Build or Request
	702-289-17A-LC-L Eaton Corporation	1	IC Socket, PGA289, 289 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder		702-289-17A-LC-L	3D model not available Symbol and footprint not available 0	0 Build or Request
	702-289-17A-LA-D Eaton Corporation	1	IC Socket, PGA289, 289 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Wire Wrap		702-289-17A-LA-D	3D model not available Symbol and footprint not available 0	0 Build or Request
	22-28-9127 Molex	1	Headers and Edge Type Connector,		22-28-9127	3D model not available Symbol and footprint not available 0	0 Build or Request
	702-289-17A-LA-B Eaton Corporation	1	IC Socket, PGA289, 289 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Wire Wrap		702-289-17A-LA-B	3D model not available Symbol and footprint not available 0	0 Build or Request
	2-1102289-1 TE Connectivity	1	Connector Accessory		2-1102289-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	22-28-9128 Molex	1	Board Connector, 12 Contact(s), 1 Row(s), Male, Right Angle, Solder Terminal,		22-28-9128	3D model not available Symbol and footprint not available 0	0 Build or Request
	702-289-17A-LS-S Cooper Industries	1	PGA SOCKET,289 CONTACTS,17X17,0.1 ROW SPACING,PC TAIL TERMINAL		702-289-17A-LS-S	3D model not available Symbol and footprint not available 0	0 Build or Request
	90228-910LF Amphenol FCi	1	Board Stacking Connector, 10 Contact(s), 1 Row(s), Male, Straight, Solder Terminal, LEAD FREE		90228-910LF	3D model not available Symbol and footprint not available 0	0 Build or Request
	70228-912LF Amphenol FCi	1	Board Connector, 48 Contact(s), 4 Row(s), Female, Right Angle, Solder Terminal, LEAD FREE		70228-912LF	3D model not available Symbol and footprint not available 0	0 Build or Request
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