40672 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	860240672002 Würth Elektronik	1	Wurth Elektronik 10μF 50 V dc Aluminium Electrolytic Capacitor, WCAP-AT1H Series 5000h 5 (Dia.) x 11mm	Capacitor, Polarized Radial Diameter	860240672002	3D model available Symbol and footprint available 3	1 Download Model
	44067-2201 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits	Other	44067-2201	3D model available Symbol and footprint available 3	1 Download Model
	44067-2001 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits	Other	44067-2001	3D model available Symbol and footprint available 3	1 Download Model
	5406721-3 TE Connectivity	1	Body Features: PCB Retention Feature Material Phosphor Bronze \| Connector Profile Low \| Modular Jack Latch Orientation Inverted - Latch Up \| Configuration Features: PCB Mount Orientation Right Angle \| Connector Contact Density Standard \| Status Light Type Not Illuminated \| Port Configuration Single Port \| Number of Loaded Positions 8 \| Port Matrix Configuration 1 x 1 \| Number of Positions 8 \| Contact Features: Contact Underplating Material Nickel \| PCB Contact Termination Area Plating Material Tin \| Contact	Other	5406721-3	3D model available Symbol and footprint available 3	1 Download Model

	440672003 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits, Tin (Sn) Plating	Other	440672003	3D model available Symbol and footprint available 3	1 Download Model
	440672201 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits, Tin (Sn) Plating	Other	440672201	3D model available Symbol and footprint available 3	1 Download Model
	44067-2401 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits	Other	44067-2401	3D model available Symbol and footprint available 3	1 Download Model
	5406721-2 TE Connectivity	1	Body Features: PCB Retention Feature Material Phosphor Bronze \| Connector Profile Low \| Modular Jack Latch Orientation Inverted - Latch Up \| Configuration Features: Port Matrix Configuration 1 x 1 \| Number of Loaded Positions 8 \| Number of Positions 8 \| Status Light Type Not Illuminated \| PCB Mount Orientation Right Angle \| Port Configuration Single Port \| Connector Contact Density Standard \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Contact Underplating Material Nickel \| Contact	Other	5406721-2	3D model available Symbol and footprint available 3	1 Download Model
	440672002 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits, Tin (Sn) Plating	Other	440672002	3D model available Symbol and footprint available 3	1 Download Model
	440672202 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits, Tin (Sn) Plating	Other	440672202	3D model available Symbol and footprint available 3	1 Download Model
	44067-2002 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits	Other	44067-2002	3D model available Symbol and footprint available 3	1 Download Model
	44067-2402 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits	Other	44067-2402	3D model available Symbol and footprint available 3	1 Download Model
	44067-2203 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits	Other	44067-2203	3D model available Symbol and footprint available 3	1 Download Model
	44067-2202 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits	Other	44067-2202	3D model available Symbol and footprint available 3	1 Download Model
	44067-2003 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits	Other	44067-2003	3D model available Symbol and footprint available 3	1 Download Model

	440672402 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits, Tin (Sn) Plating	Other	440672402	3D model available Symbol and footprint available 3	1 Download Model
	5406721-1 TE Connectivity	1	Body Features: Connector Profile Low \| PCB Retention Feature Material Phosphor Bronze \| Modular Jack Latch Orientation Inverted - Latch Up \| Configuration Features: PCB Mount Orientation Right Angle \| Number of Loaded Positions 8 \| Port Configuration Single Port \| Number of Positions 8 \| Status Light Type Not Illuminated \| Connector Contact Density Standard \| Port Matrix Configuration 1 x 1 \| Contact Features: Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness 30 MICI	Other	5406721-1	3D model available Symbol and footprint available 3	1 Download Model
	44067-2403 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits	Other	44067-2403	3D model available Symbol and footprint available 3	1 Download Model
	5406721-2 TE Connectivity	1	Body Features: PCB Retention Feature Material Phosphor Bronze \| Connector Profile Low \| Modular Jack Latch Orientation Inverted - Latch Up \| Configuration Features: Port Matrix Configuration 1 x 1 \| Number of Loaded Positions 8 \| Number of Positions 8 \| Status Light Type Not Illuminated \| PCB Mount Orientation Right Angle \| Port Configuration Single Port \| Connector Contact Density Standard \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Contact Underplating Material Nickel \| Contact	Other	5406721-2	3D model available Symbol and footprint available 3	1 Download Model
	440672403 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits, Tin (Sn) Plating	Other	440672403	3D model available Symbol and footprint available 3	1 Download Model
	440672401 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits, Tin (Sn) Plating	Other	440672401	3D model available Symbol and footprint available 3	1 Download Model
	440672203 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits, Tin (Sn) Plating	Other	440672203	3D model available Symbol and footprint available 3	1 Download Model
	440672001 Molex	1	Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 20 Circuits, Tin (Sn) Plating	Other	440672001	3D model available Symbol and footprint available 3	1 Download Model
	406721-3 TE's AMP	1	8 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SURFACE MOUNT, JACK		406721-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	406725-1 TE Connectivity	1	TELECOM AND DATACOM CONNECTOR		406725-1	3D model not available Symbol and footprint not available 0	0 Build or Request
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