18278 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Prices / Stock	Model	Action
	E1SNA18-27.810MTR Ecliptek Corporation	1	QUARTZ CRYSTAL RESONATOR, 27.81 MHz	E1SNA18-27.810MTR	3D model not available Symbol and footprint not available 0	0 Build or Request
	E1SBA18-27.810MTR Ecliptek Corporation	1	QUARTZ CRYSTAL RESONATOR, 27.81 MHz	E1SBA18-27.810MTR	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1417AV18-278BZXC Cypress Semiconductor	1	DDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	CY7C1417AV18-278BZXC	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-827873-2 TE's AMP	1	12 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER	1-827873-2	3D model not available Symbol and footprint not available 0	0 Build or Request

	CY7C1510V18-278BZXC Cypress Semiconductor	1	QDR SRAM, 8MX8, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	CY7C1510V18-278BZXC	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1393BV18-278BZXC Cypress Semiconductor	1	DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	CY7C1393BV18-278BZXC	3D model not available Symbol and footprint not available 0	0 Build or Request
	M39003/018278E KEMET Corporation	1	Tantalum Capacitor, Tantalum (dry/solid)	M39003/018278E	3D model not available Symbol and footprint not available 0	0 Build or Request
	MC101827875FE Ohmite Mfg Co	1	Fixed Resistor, Metal Glaze/thick Film, 0.75W, 78700000ohm, 2000V, 1% +/-Tol, 50ppm/Cel, 2525,	MC101827875FE	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1413BV18-278BZI Cypress Semiconductor	1	QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, M0-216, FBGA-165	CY7C1413BV18-278BZI	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1518AV18-278BZC Cypress Semiconductor	1	DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	CY7C1518AV18-278BZC	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1422AV18-278BZXI Cypress Semiconductor	1	DDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	CY7C1422AV18-278BZXI	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1318BV18-278BZI Cypress Semiconductor	1	DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	CY7C1318BV18-278BZI	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1417AV18-278BZXI Cypress Semiconductor	1	DDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	CY7C1417AV18-278BZXI	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1529AV18-278BZI Cypress Semiconductor	1	DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	CY7C1529AV18-278BZI	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1423AV18-278BZXI Cypress Semiconductor	1	DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	CY7C1423AV18-278BZXI	3D model not available Symbol and footprint not available 0	0 Build or Request

	CY7C1415BV18-278BZXC Cypress Semiconductor	1	QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, M0-216, FBGA-165	CY7C1415BV18-278BZXC	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1393BV18-278BZC Cypress Semiconductor	1	DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	CY7C1393BV18-278BZC	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1415BV18-278BZXI Cypress Semiconductor	1	QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, M0-216, FBGA-165	CY7C1415BV18-278BZXI	3D model not available Symbol and footprint not available 0	0 Build or Request
	RJASE-J381-8278R Amphenol Corporation	1	Telecom and Datacom Connector,	RJASE-J381-8278R	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-827871-8 TE Connectivity	1	CONNECTOR, 18 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER	1-827871-8	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1418AV18-278BZXC Cypress Semiconductor	1	DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	CY7C1418AV18-278BZXC	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-1618278-8 TE Connectivity	1	POWER/SIGNAL RELAY, SPST, MOMENTARY, 12VDC (COIL), 30A (CONTACT), PANEL MOUNT-THREADED	1-1618278-8	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-1827862-9 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: Number of Positions 18 \| Number of Rows 2 \| Dimensions: Row-to-Row Spacing .129 INCH \| Row-to-Row Spacing 3.3 MM \| Housing Features: Centerline (Pitch) .079 INCH \| Centerline (Pitch) 2 MM \| Mechanical Attachment: Mating Retention With \| Connector Mounting Type Cable Mount (Free-Hanging) \| Operation/Application: Circuit Application Signal \| Product Type Features: Connector & Housing Type Receptacle \| Connector & Contact Terminates To Wire &	1-1827862-9	3D model not available Symbol and footprint not available 0	0 Build or Request
	2-1827876-6 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: Number of Positions 12 \| Number of Rows 2 \| PCB Mount Orientation Horizontal \| Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN \| Contact Mating Area Plating Material Thickness .38 MICM \| Contact Current Rating (Max) 5 AMP \| Contact Mating Area Plating Material Gold \| Contact Type Pin \| Housing Features: Centerline (Pitch) 2.5 MM \| Centerline (Pitch) .099 INCH \| Housing Material Polyester GF \| Industry Standards: U	2-1827876-6	3D model not available Symbol and footprint not available 0	0 Build or Request
	2-1827872-7 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: PCB Mount Orientation Vertical \| Number of Positions 34 \| Number of Rows 2 \| Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN \| Contact Current Rating (Max) 3 AMP \| Contact Mating Area Plating Material Thickness .38 MICM \| Contact Mating Area Plating Material Gold \| Contact Type Pin \| Housing Features: Centerline (Pitch) 2 MM \| Centerline (Pitch) .079 INCH \| Housing Material Polyester GF \| Industry Standards: UL Fl	2-1827872-7	3D model not available Symbol and footprint not available 0	0 Build or Request
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