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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	R5F562N7BDFB#V0 Renesas Electronics	1	RX62N Group microcontrollers have 100 MHz high-speed operation and enhanced communications functions. They have built-in Ethernet, CAN, and two circuits of USB 2.0 host controller. A multifunction timer (MTU2, 2 units), 10-bit or 12-bit A/D converter, DMA controller, and other peripheral functions are incorporated on a single chip. Up to 512 KB flash memory and 96 KB RAM are built in, as well as 32 KB of flash memory for data storage. Packages from 85 to 176 pins are available.	Quad Flat Packages	R5F562N7BDFB#V0	3D model available Symbol and footprint available 3	1 Download Model
	IW1799-02B Renesas Electronics	1	Supports USB PD 3.0, Qualcomm® Quick Charge™ 4+, and Direct Charge Adapters; Companion to iW657P USB PD 3.0 ControllerThe iW1799 is a 45W output, high-performance AC/DC RapidCharge™ power supply controller that supports USB Power Delivery with Programmable Power Supply (USB PD PPS) and other rapid charging protocols. The device offers high voltage and current resolution with the ability to step the voltage in 10mV increments up to 21V, ideal for USB PD PPS and Direct Charge adapters.The iW1799 is optimized	Small Outline Packages	IW1799-02B	3D model available Symbol and footprint available 3	1 Download Model
	72V273L7-5PFGI8 Renesas Electronics	1	The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	Quad Flat Packages	72V273L7-5PFGI8	3D model available Symbol and footprint available 3	1 Download Model
	R5F562N7BDLE#U0 Renesas Electronics	1	RX62N Group microcontrollers have 100 MHz high-speed operation and enhanced communications functions. They have built-in Ethernet, CAN, and two circuits of USB 2.0 host controller. A multifunction timer (MTU2, 2 units), 10-bit or 12-bit A/D converter, DMA controller, and other peripheral functions are incorporated on a single chip. Up to 512 KB flash memory and 96 KB RAM are built in, as well as 32 KB of flash memory for data storage. Packages from 85 to 176 pins are available.	Other	R5F562N7BDLE#U0	3D model available Symbol and footprint available 3	1 Download Model

	EL4543ILZ-T13 Renesas Electronics	1	The EL4543 is a high bandwidth triple differential amplifier with integrated encoding of video sync signals. The inputs are suitable for handling High-Speed video or other communications signals in either single-ended or differential form, and the common-mode input range extends all the way to the negative rail enabling ground-referenced signaling in single supply applications. The high bandwidth enables differential signaling onto standard twisted-pair or coax with very low harmonic distortion, while inter	Quad Flat No-Lead	EL4543ILZ-T13	3D model available Symbol and footprint available 3	1 Download Model
	49FCT3805BPYGI Renesas Electronics	1	The FCT3805B is a 3.3 volt, non-inverting clock driver built using advanced dual metal CMOS technology. The device consists of two banks of drivers, each with a 1:5 fanout and its own output enable control. The device has a "heartbeat" monitor for diagnostics and PLL driving. The MON output is identical to all other outputs and complies with the output specifications in this document. The FCT3805B offers low capacitance inputs with hysteresis. The FCT3805B is designed for high speed clock distribution where	Small Outline Packages	49FCT3805BPYGI	3D model available Symbol and footprint available 3	1 Download Model
	72V253L7-5BCI Renesas Electronics	1	The 72V253 8K x 9/4K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	BGA	72V253L7-5BCI	3D model not available Symbol and footprint available 2	1 Download Model
	854S036AKLFT Renesas Electronics	1	The 854S036 is a low skew, high performance Dual Differential-to-LVDS Fanout Buffer. One of the two fanout buffers has 3 LVDS outputs, the other has 6 LVDS outputs. The PCLKx, nPCLKx pairs can accept most standard differential input levels. The 854S036 is characterized to operate from a 3.3V power supply. Guaranteed output and bank skew characteristics make the 854S036 ideal for those clock distribution applications demanding well defined performance and repeatability.	Quad Flat No-Lead	854S036AKLFT	3D model available Symbol and footprint available 3	1 Download Model
	R5F56218BDFP#V0 Renesas Electronics	1	RX621 Group microcontrollers have 100 MHz high-speed operation and enhanced communications functions. They have built-in CAN and two circuits of USB 2.0 host controller. A multifunction timer (MTU2, 2 units), 10-bit or 12-bit A/D converter, DMA controller, and other peripheral functions are incorporated on a single chip. Up to 512 KB flash memory and 96 KB RAM are built in, as well as 32 KB of flash memory for data storage. Packages from 85 to 176 pins are available.	Quad Flat Packages	R5F56218BDFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R7FA6M2AF3CLK#AC0 Renesas Electronics	1	The Renesas RA6M2 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers Ethernet MAC with individual DMA, to ensure high data throughput. The RA6M2 is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M2 is suitable for IoT applications requiring Ethernet, security, large embedded RAM, and low active power c	BGA	R7FA6M2AF3CLK#AC0	3D model available Symbol and footprint available 3	1 Download Model
	72V273L7-5BCGI8 Renesas Electronics	1	The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	BGA	72V273L7-5BCGI8	3D model available Symbol and footprint available 3	1 Download Model
	R5F52315CGNE#U0 Renesas Electronics	1	The RX231 Group of devices leverages an optimal combination of a 32-bit RXv2 CPU core with improved DSP/FPU and low-power consumption technology to realize extreme power efficiency. High-performance digital filtering, floating-point operations and other processing can be performed even in environments with low current supply capacity. The RX231 Group implements the industry's top level communication security and encryption functions, high sensitivity high level of noise tolerance capacitive touch sensor cap	Quad Flat No-Lead	R5F52315CGNE#U0	3D model available Symbol and footprint available 3	1 Download Model
	72V273L7-5PFGI Renesas Electronics	1	The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	Quad Flat Packages	72V273L7-5PFGI	3D model available Symbol and footprint available 3	1 Download Model
	R5F5110JADNF#20 Renesas Electronics	1	RX110 Group microcontrollers have the simplest lineup of the RX100 Series. They have a small-capacity, low pin count lineup from 8 KB/8 KB to 128 KB/16 KB ROM/RAM, and 36 to 64 pins. A 12-bit A/D converter, timer, serial interface, and more are built into a small 4 × 4 mm package. The RX110 is suitable for sensor hub and other applications where small size and processing performance are demanded.	Quad Flat No-Lead	R5F5110JADNF#20	3D model available Symbol and footprint available 3	1 Download Model
	72V273L7-5BCGI Renesas Electronics	1	The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	BGA	72V273L7-5BCGI	3D model available Symbol and footprint available 3	1 Download Model

	R5F52305ADFM#50 Renesas Electronics	1	The RX230 Group of devices leverages an optimal combination of a 32-bit RXv2 CPU core with improved DSP/FPU and low-power consumption technology to realize extreme power efficiency. High-performance digital filtering, floating-point operations, and other processing can be performed even in environments with low current supply capacity. The RX230 Group is optimized for the general market requiring 5V power supply support, external bus, high DSP/FPU operational performance at low power consumption or high sen	Quad Flat Packages	R5F52305ADFM#50	3D model available Symbol and footprint available 3	1 Download Model
	R5F51103AGFM#30 Renesas Electronics	1	RX110 Group microcontrollers have the simplest lineup of the RX100 Series. They have a small-capacity, low pin count lineup from 8 KB/8 KB to 128 KB/16 KB ROM/RAM, and 36 to 64 pins. A 12-bit A/D converter, timer, serial interface, and more are built into a small 4 × 4 mm package. The RX110 is suitable for sensor hub and other applications where small size and processing performance are demanded.	Quad Flat Packages	R5F51103AGFM#30	3D model available Symbol and footprint available 3	1 Download Model
	72T18125L10BB Renesas Electronics	1	The 72T18125 is a 512K x 18 / 1M x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.	BGA	72T18125L10BB	3D model available Symbol and footprint available 3	1 Download Model
	R7FA4M1AB2CLJ#AC0 Renesas Electronics	1	The Renesas RA4M1 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a segment LCD controller and a capacitive touch sensing unit input for intensive HMI designs. The RA4M1 MCU is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M1 is suitable for applications where a large amount of capacitive touc	BGA	R7FA4M1AB2CLJ#AC0	3D model available Symbol and footprint available 3	1 Download Model
	411MLF Renesas Electronics	1	The IDT411 is a cost-effective clock synthesizer developed to optimize component count for PC motherboard and peripheral applications. The device supports a common, low cost 14.31818 MHz crystal. The device locks all output frequencies to enhance system performance. By supporting common PC peripheral interface frequencies including 25 MHz for Ethernet and 24.576 MHz for audio and other applications, the device lowers chip count enhancing system cost and reliability. The IDT411 utilizes a low pin count 8-pin	Small Outline Packages	411MLF	3D model available Symbol and footprint available 3	1 Download Model
	72V275L10TFG Renesas Electronics	1	The 72V275 is a 32K x 18 SuperSync FIFO memory with clocked read and write controls. It's a functionally compatible version of the 72275 designed to run off a 3.3V supply for very low power consumption. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. SuperSync FIFOs are particularly appropriate for networking, video, telecommunications, data communications and other applications that nee	Quad Flat Packages	72V275L10TFG	3D model available Symbol and footprint available 3	1 Download Model
	R5F51105AGFL#30 Renesas Electronics	1	RX110 Group microcontrollers have the simplest lineup of the RX100 Series. They have a small-capacity, low pin count lineup from 8 KB/8 KB to 128 KB/16 KB ROM/RAM, and 36 to 64 pins. A 12-bit A/D converter, timer, serial interface, and more are built into a small 4 × 4 mm package. The RX110 is suitable for sensor hub and other applications where small size and processing performance are demanded.	Quad Flat Packages	R5F51105AGFL#30	3D model available Symbol and footprint available 3	1 Download Model
	70V7519S133BFI Renesas Electronics	1	The 70V7519 is a high-speed 256K x 36 (9Mbit) synchronous Bank-Switchable Dual-Ported SRAM is organized into 64 independent 4Kx36 banks and has two independent ports with separate control, address, and I/O pins for each port, allowing each port to access any 4Kx36 memory block not already accessed by the other port. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode.	BGA	70V7519S133BFI	3D model available Symbol and footprint available 3	1 Download Model
	72V2103L6PFG8 Renesas Electronics	1	The 72V2103 256K x 9/128K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.	Quad Flat Packages	72V2103L6PFG8	3D model available Symbol and footprint available 3	1 Download Model
	R7FA4M1AB3CNE#AC0 Renesas Electronics	1	The Renesas RA4M1 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a segment LCD controller and a capacitive touch sensing unit input for intensive HMI designs. The RA4M1 MCU is built on a highly efficient low power process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA4M1 is suitable for applications where a large amount of capacitive touc	Quad Flat No-Lead	R7FA4M1AB3CNE#AC0	3D model available Symbol and footprint available 3	1 Download Model
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