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Technical Content

2-198 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2198318-1 TE Connectivity
1 Configuration Features: Number of Positions 40 | Number of Ports 2 | Port Matrix Configuration 2 x 1 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
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1-2198318-7 TE Connectivity
1 Configuration Features: Lightpipe Style Standard | Port Matrix Configuration 2 x 1 | Number of Ports 2 | Number of Positions 40 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
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2198318-7 TE Connectivity
1 Configuration Features: Number of Positions 40 | Number of Ports 2 | Lightpipe Style Standard | Port Matrix Configuration 2 x 1 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
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2198325-1 TE Connectivity
1 Configuration Features: Port Matrix Configuration 2 x 2 | Number of Ports 4 | Lightpipe Style Standard | Number of Positions 80 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
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2198325-5 TE Connectivity
1 Configuration Features: Number of Ports 4 | Number of Positions 80 | Lightpipe Style Standard | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
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2-2198318-0 TE Connectivity
1 Configuration Features: Number of Ports 2 | Port Matrix Configuration 2 x 1 | Lightpipe Style Standard | Number of Positions 40 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
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2198231-3 TE Connectivity
1 Body Features: Heat Sink Height Class Networking Short | Heat Sink Style Pin | Heat Sink Height .358 INCH | Heat Sink Height 9.1 MM | Configuration Features: Lightpipe Style Reduced Length | Port Matrix Configuration 1 x 2 | Number of Ports 2 | Dimensions: PCB Thickness (Recommended) 2.25 MM | PCB Thickness (Recommended) .089 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Pluggable I/O Applications SFP+ Enhanced | Heat Sink Check Price & Stock
3D model available
Symbol and footprint not available
 1
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2198483-1 TE Connectivity
1 Configuration Features: Number of Positions 72 | Port Matrix Configuration 1 x 2 | Number of Ports 2 | Contact Features: Contact Base Material Copper Alloy | Dimensions: PCB Thickness (Recommended) .97 MM | Profile Height from PCB .647 INCH | Profile Height from PCB 16.44 MM | PCB Thickness (Recommended) .038 INCH | Electrical Characteristics: Data Rate (Max) 12 GBS | Housing Features: Centerline (Pitch) .75 INCH | Centerline (Pitch) .03 MM | Housing Material LCP (Liquid Crystal Polymer) | Industry Standard Check Price & Stock
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Symbol and footprint not available
 1
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2198225-4 TE Connectivity
1 Body Features: Heat Sink Height 13.5 MM | Heat Sink Height Class Networking Tall | Heat Sink Style Pin | Heat Sink Height .531 INCH | Configuration Features: Port Matrix Configuration 1 x 2 | Number of Ports 2 | Lightpipe Style Reduced Length | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible Yes | Pluggable I/O Applications Check Price & Stock
3D model available
Symbol and footprint not available
 1
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2198325-2 TE Connectivity
1 Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Positions 80 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
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2198226-1 TE Connectivity
1 Body Features: Heat Sink Height .165 INCH | Heat Sink Height Class PCI | Heat Sink Style Pin | Configuration Features: Number of Ports 2 | Lightpipe Style Reduced Length | Port Matrix Configuration 1 x 2 | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible Yes | Pluggable I/O Applications SFP+ Enhanced | Circuit Application Sig Check Price & Stock
3D model available
Symbol and footprint not available
 1
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2198325-4 TE Connectivity
1 Configuration Features: Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Ports 4 | Number of Positions 80 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
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2198325-4 TE Connectivity
1 Configuration Features: Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Ports 4 | Number of Positions 80 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
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2198318-8 TE Connectivity
1 Configuration Features: Lightpipe Style Standard | Number of Ports 2 | Port Matrix Configuration 2 x 1 | Number of Positions 40 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2198226-4 TE Connectivity
1 Body Features: Heat Sink Style Pin | Heat Sink Height 13.5 MM | Heat Sink Height Class Networking Tall | Heat Sink Height .531 INCH | Configuration Features: Port Matrix Configuration 1 x 2 | Lightpipe Style Reduced Length | Number of Ports 2 | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Pluggable I/O Applications SFP+ Enhanced | Heat Sink C Check Price & Stock
3D model available
Symbol and footprint not available
 1
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2198720-1 TE Connectivity
1 Configuration Features: Number of Ports 2 | Port Matrix Configuration 1 x 2 | Dimensions: PCB Thickness (Recommended) 3 MM | PCB Thickness (Recommended) .118 INCH | Electrical Characteristics: Data Rate (Max) 28 GBS | Housing Features: Cage Material Nickel Silver Alloy | Operation/Application: Pluggable I/O Applications EMI Enhanced | Heat Sink Compatible No | Circuit Application Signal | Other: Included Lightpipe No | EMI Containment Feature Type Elastomeric Gasket | Packaging Features: Packaging Method Tr Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
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2198318-3 TE Connectivity
1 Configuration Features: Lightpipe Style Standard | Number of Positions 40 | Port Matrix Configuration 2 x 1 | Number of Ports 2 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2198318-1 TE Connectivity
1 Configuration Features: Number of Positions 40 | Number of Ports 2 | Port Matrix Configuration 2 x 1 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2198232-3 TE Connectivity
1 Body Features: Heat Sink Height Class Networking Short | Heat Sink Style Pin | Heat Sink Height 9.1 MM | Heat Sink Height .358 INCH | Configuration Features: Number of Ports 2 | Lightpipe Style Standard | Port Matrix Configuration 1 x 2 | Dimensions: PCB Thickness (Recommended) 2.25 MM | PCB Thickness (Recommended) .089 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Pluggable I/O Applications SFP+ Enhanced | Circuit Applicat Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2198318-7 TE Connectivity
1 Configuration Features: Number of Positions 40 | Number of Ports 2 | Lightpipe Style Standard | Port Matrix Configuration 2 x 1 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2198224-4 TE Connectivity
1 Body Features: Heat Sink Height .531 INCH | Heat Sink Height 13.5 MM | Heat Sink Height Class Networking Tall | Heat Sink Style Pin | Configuration Features: Port Matrix Configuration 1 x 2 | Number of Ports 2 | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Pluggable I/O Applications SFP+ Enhanced | Heat Sink Compa Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2198325-2 TE Connectivity
1 Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Positions 80 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1-2198325-8 TE Connectivity
1 Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Positions 80 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2198325-8 TE Connectivity
1 Configuration Features: Number of Positions 80 | Lightpipe Style Standard | Number of Ports 4 | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1-2198325-7 TE Connectivity
1 Configuration Features: Port Matrix Configuration 2 x 2 | Number of Positions 80 | Lightpipe Style Standard | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G Check Price & Stock
3D model available
Symbol and footprint not available
 1
1 Download Model
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