Showing 25 of 53765 results
Filter by Manufacturer
Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
---|
Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
0 | PS-16PE-D4LT2-M3E |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VT-02-H-TRP
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | Contact Current Rating (Max) 2 AMP | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Length .157 INCH | Contact Mating Area Plating Material | 2MM-HSP-S16-VT-02-H-TRP |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-HT-01-H-TB
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Pin | Mating Square Post Dimension .02 INCH | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Length .157 INCH | PCB Contact Termination Area Plating Material Thickness 100 – 200 | 2MM-HSP-S16-HT-01-H-TB |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VT-01-M-TB
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 16 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Base Material Phosphor Bronze | Mating Square Post Dimension .02 INCH | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Mating Square Post Dimension .5 MM | PCB Contact Termination Area Plating Material Thicknes | 2MM-HSP-S16-VT-01-M-TB |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-HT-02-H-TR
TE Connectivity
|
1 | Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Positions 16 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Length 4 MM | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 1.27 MICM | Contact Type Pi | 2MM-HSP-S16-HT-02-H-TR |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
80HCPS1616RMI
Renesas Electronics
|
1 | The IDT CPS-1616 provides a full, non-blocking bandwidth of 80 Gbps for up to 16 ports. The device uses a 5th generation switch fabric, building upon Gen1 CPS and Tsi switching architectures. This new switch uses patent pending features to minimize latency, ensure scheduling fairness, and provide superior multicast throughput. The CPS-1616's 6.25 Gbaud SerDes is ideal for doing both local interconnect with low power, while also driving backplane links. This performance is realized over twice the transmissio | 80HCPS1616RMI |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VT-01-H-TBP
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 16 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Mating Square Post Dimension .5 MM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Shape & Form Square | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Tin | Contact | 2MM-HSP-S16-VT-01-H-TBP |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VT-01-M-TBP
TE Connectivity
|
1 | Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 16 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Shape & Form Square | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness .38 MIC | 2MM-HSP-S16-VT-01-M-TBP |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-HT-01-M-TB
TE Connectivity
|
1 | Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Layout Inline | Contact Mating Area Length .157 | 2MM-HSP-S16-HT-01-M-TB |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-HT-02-M-TB
TE Connectivity
|
1 | Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 16 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Length .157 INCH | Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | Mating Square Post Dimension .5 MM | PCB Contact Termination Area | 2MM-HSP-S16-HT-02-M-TB |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
80HCPS1616RM
Renesas Electronics
|
1 | The IDT CPS-1616 provides a full, non-blocking bandwidth of 80 Gbps for up to 16 ports. The device uses a 5th generation switch fabric, building upon Gen1 CPS and Tsi switching architectures. This new switch uses patent pending features to minimize latency, ensure scheduling fairness, and provide superior multicast throughput. The CPS-1616's 6.25 Gbaud SerDes is ideal for doing both local interconnect with low power, while also driving backplane links. This performance is realized over twice the transmissio | 80HCPS1616RM |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VT-01-H-TRP
TE Connectivity
|
1 | Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | PCB Contact Termination Area Plating Material Finish Matte | Contact Shape & Form Square | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Materia | 2MM-HSP-S16-VT-01-H-TRP |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-HT-01-H-TR
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 16 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Length .157 INCH | Contact Shape & Form Square | Contact Underplating Material Thickness 1.27 MICM | Mating Square Post Dimension .5 MM | Contact Layout In | 2MM-HSP-S16-HT-01-H-TR |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-HT-02-M-TR
TE Connectivity
|
1 | Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Positions 16 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Length .157 INCH | Contact Shape & Form Square | Contact Mating Area Plating Material Thickness .38 MICM | Contact Underplating Material Nickel | Contact Current Rating (Max) 2 AMP | PCB Contact Termination Area Plating Material Finish Matte | Mating Square Post Dimension .5 MM | Contact Mating | 2MM-HSP-S16-HT-02-M-TR |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VT-02-T-TBP
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: Contact Mating Area Length 4 MM | Mating Square Post Dimension .02 INCH | Contact Base Material Phosphor Bronze | Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Mating Square | 2MM-HSP-S16-VT-02-T-TBP |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-HT-02-H-TB
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Right Angle | Contact Features: Contact Shape & Form Square | Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Mating Square Post Dimension .5 MM | Mating Square Post Dimension .02 INCH | Contact Current Rating (Max) 2 AMP | Conta | 2MM-HSP-S16-HT-02-H-TB |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-HT-02-T-TB
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Right Angle | Contact Features: Contact Layout Inline | Contact Shape & Form Square | Contact Underplating Material Nickel | Contact Mating Area Length 4 MM | Contact Mating Area Plating Material Finish Matte | Contact Mating Area Plating Material Tin | Mating Square Post Dimension .02 INCH | PCB Contact Termination Area Plating Material Thicknes | 2MM-HSP-S16-HT-02-T-TB |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VT-01-H-TB
TE Connectivity
|
1 | Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Type Pin | Contact Shape & Form Square | Contact Layout Inline | PCB Contact Termination Area Plating Material Finish Matte | Mating Square Post Dimension .025 INCH | Contact Mating Area Plating Material Thickness .76 M | 2MM-HSP-S16-VT-01-H-TB |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
80HCPS1616CRMI
Renesas Electronics
|
1 | The IDT CPS-1616 provides a full, non-blocking bandwidth of 80 Gbps for up to 16 ports. The device uses a 5th generation switch fabric, building upon Gen1 CPS and Tsi switching architectures. This new switch uses patent pending features to minimize latency, ensure scheduling fairness, and provide superior multicast throughput. The CPS-1616's 6.25 Gbaud SerDes is ideal for doing both local interconnect with low power, while also driving backplane links. This performance is realized over twice the transmissio | 80HCPS1616CRMI |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VT-02-M-TRP
TE Connectivity
|
1 | Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Length .157 INCH | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 2 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | Contact Layout Inline | Contact Underplating Material Thickness 1.27 MICM | 2MM-HSP-S16-VT-02-M-TRP |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VT-02-M-TB
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | Contact Underplating Material Thickness 1.27 MICM | Mating Square Post Dimension .02 INCH | Contact Mating Area Plating Mate | 2MM-HSP-S16-VT-02-M-TB |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VS-00-T-TBP
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 16 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Mating Square Post Dimension .02 INCH | Contact Type Pin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | Contact Shape & Form Square | Contact Underplating Material Thickness 1.27 MICM | Con | 2MM-HSP-S16-VS-00-T-TBP |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VT-02-H-TB
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Mating Square Post Dimension .02 INCH | Contact Mating Area Length 4 MM | Contact Mating Area Plating Material Thickness .76 MICM | C | 2MM-HSP-S16-VT-02-H-TB |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
80HCPS1616CRM
Renesas Electronics
|
1 | The IDT CPS-1616 provides a full, non-blocking bandwidth of 80 Gbps for up to 16 ports. The device uses a 5th generation switch fabric, building upon Gen1 CPS and Tsi switching architectures. This new switch uses patent pending features to minimize latency, ensure scheduling fairness, and provide superior multicast throughput. The CPS-1616's 6.25 Gbaud SerDes is ideal for doing both local interconnect with low power, while also driving backplane links. This performance is realized over twice the transmissio | 80HCPS1616CRM |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
2MM-HSP-S16-VT-01-T-TRP
TE Connectivity
|
1 | Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 16 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 3 – 5 MICM | Contact Mating Area Plating Material Thickness 100 – 200 MICIN | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plati | 2MM-HSP-S16-VT-01-T-TRP |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||