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PS-16 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image 0 PS-16PE-D4LT2-M3E 0 Build or Request
Part Image Part Image 1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | Contact Current Rating (Max) 2 AMP | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Length .157 INCH | Contact Mating Area Plating Material 2MM-HSP-S16-VT-02-H-TRP 0 Build or Request
Part Image Part Image
2MM-HSP-S16-HT-01-H-TB TE Connectivity
1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Pin | Mating Square Post Dimension .02 INCH | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Length .157 INCH | PCB Contact Termination Area Plating Material Thickness 100 – 200 2MM-HSP-S16-HT-01-H-TB 0 Build or Request
Part Image Part Image
2MM-HSP-S16-VT-01-M-TB TE Connectivity
1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 16 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Base Material Phosphor Bronze | Mating Square Post Dimension .02 INCH | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Mating Square Post Dimension .5 MM | PCB Contact Termination Area Plating Material Thicknes 2MM-HSP-S16-VT-01-M-TB 0 Build or Request
Part Image Part Image
2MM-HSP-S16-HT-02-H-TR TE Connectivity
1 Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Positions 16 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Length 4 MM | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 1.27 MICM | Contact Type Pi 2MM-HSP-S16-HT-02-H-TR 0 Build or Request
Part Image Part Image
80HCPS1616RMI Renesas Electronics
1 The IDT CPS-1616 provides a full, non-blocking bandwidth of 80 Gbps for up to 16 ports. The device uses a 5th generation switch fabric, building upon Gen1 CPS and Tsi switching architectures. This new switch uses patent pending features to minimize latency, ensure scheduling fairness, and provide superior multicast throughput. The CPS-1616's 6.25 Gbaud SerDes is ideal for doing both local interconnect with low power, while also driving backplane links. This performance is realized over twice the transmissio 80HCPS1616RMI 0 Build or Request
Part Image Part Image 1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 16 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Mating Square Post Dimension .5 MM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Shape & Form Square | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Tin | Contact 2MM-HSP-S16-VT-01-H-TBP 0 Build or Request
Part Image Part Image 1 Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 16 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Shape & Form Square | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness .38 MIC 2MM-HSP-S16-VT-01-M-TBP 0 Build or Request
Part Image Part Image
2MM-HSP-S16-HT-01-M-TB TE Connectivity
1 Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Layout Inline | Contact Mating Area Length .157 2MM-HSP-S16-HT-01-M-TB 0 Build or Request
Part Image Part Image
2MM-HSP-S16-HT-02-M-TB TE Connectivity
1 Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 16 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Length .157 INCH | Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | Mating Square Post Dimension .5 MM | PCB Contact Termination Area 2MM-HSP-S16-HT-02-M-TB 0 Build or Request
Part Image Part Image
80HCPS1616RM Renesas Electronics
1 The IDT CPS-1616 provides a full, non-blocking bandwidth of 80 Gbps for up to 16 ports. The device uses a 5th generation switch fabric, building upon Gen1 CPS and Tsi switching architectures. This new switch uses patent pending features to minimize latency, ensure scheduling fairness, and provide superior multicast throughput. The CPS-1616's 6.25 Gbaud SerDes is ideal for doing both local interconnect with low power, while also driving backplane links. This performance is realized over twice the transmissio 80HCPS1616RM 0 Build or Request
Part Image Part Image 1 Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | PCB Contact Termination Area Plating Material Finish Matte | Contact Shape & Form Square | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Materia 2MM-HSP-S16-VT-01-H-TRP 0 Build or Request
Part Image Part Image
2MM-HSP-S16-HT-01-H-TR TE Connectivity
1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 16 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Length .157 INCH | Contact Shape & Form Square | Contact Underplating Material Thickness 1.27 MICM | Mating Square Post Dimension .5 MM | Contact Layout In 2MM-HSP-S16-HT-01-H-TR 0 Build or Request
Part Image Part Image
2MM-HSP-S16-HT-02-M-TR TE Connectivity
1 Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Positions 16 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Length .157 INCH | Contact Shape & Form Square | Contact Mating Area Plating Material Thickness .38 MICM | Contact Underplating Material Nickel | Contact Current Rating (Max) 2 AMP | PCB Contact Termination Area Plating Material Finish Matte | Mating Square Post Dimension .5 MM | Contact Mating 2MM-HSP-S16-HT-02-M-TR 0 Build or Request
Part Image Part Image 1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: Contact Mating Area Length 4 MM | Mating Square Post Dimension .02 INCH | Contact Base Material Phosphor Bronze | Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Mating Square 2MM-HSP-S16-VT-02-T-TBP 0 Build or Request
Part Image Part Image
2MM-HSP-S16-HT-02-H-TB TE Connectivity
1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Right Angle | Contact Features: Contact Shape & Form Square | Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Mating Square Post Dimension .5 MM | Mating Square Post Dimension .02 INCH | Contact Current Rating (Max) 2 AMP | Conta 2MM-HSP-S16-HT-02-H-TB 0 Build or Request
Part Image Part Image
2MM-HSP-S16-HT-02-T-TB TE Connectivity
1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Right Angle | Contact Features: Contact Layout Inline | Contact Shape & Form Square | Contact Underplating Material Nickel | Contact Mating Area Length 4 MM | Contact Mating Area Plating Material Finish Matte | Contact Mating Area Plating Material Tin | Mating Square Post Dimension .02 INCH | PCB Contact Termination Area Plating Material Thicknes 2MM-HSP-S16-HT-02-T-TB 0 Build or Request
Part Image Part Image
2MM-HSP-S16-VT-01-H-TB TE Connectivity
1 Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Type Pin | Contact Shape & Form Square | Contact Layout Inline | PCB Contact Termination Area Plating Material Finish Matte | Mating Square Post Dimension .025 INCH | Contact Mating Area Plating Material Thickness .76 M 2MM-HSP-S16-VT-01-H-TB 0 Build or Request
Part Image Part Image
80HCPS1616CRMI Renesas Electronics
1 The IDT CPS-1616 provides a full, non-blocking bandwidth of 80 Gbps for up to 16 ports. The device uses a 5th generation switch fabric, building upon Gen1 CPS and Tsi switching architectures. This new switch uses patent pending features to minimize latency, ensure scheduling fairness, and provide superior multicast throughput. The CPS-1616's 6.25 Gbaud SerDes is ideal for doing both local interconnect with low power, while also driving backplane links. This performance is realized over twice the transmissio 80HCPS1616CRMI 0 Build or Request
Part Image Part Image 1 Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Length .157 INCH | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 2 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | Contact Layout Inline | Contact Underplating Material Thickness 1.27 MICM 2MM-HSP-S16-VT-02-M-TRP 0 Build or Request
Part Image Part Image
2MM-HSP-S16-VT-02-M-TB TE Connectivity
1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | Contact Underplating Material Thickness 1.27 MICM | Mating Square Post Dimension .02 INCH | Contact Mating Area Plating Mate 2MM-HSP-S16-VT-02-M-TB 0 Build or Request
Part Image Part Image 1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 16 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Mating Square Post Dimension .02 INCH | Contact Type Pin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | Contact Shape & Form Square | Contact Underplating Material Thickness 1.27 MICM | Con 2MM-HSP-S16-VS-00-T-TBP 0 Build or Request
Part Image Part Image
2MM-HSP-S16-VT-02-H-TB TE Connectivity
1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 1 | Number of Positions 16 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Mating Square Post Dimension .02 INCH | Contact Mating Area Length 4 MM | Contact Mating Area Plating Material Thickness .76 MICM | C 2MM-HSP-S16-VT-02-H-TB 0 Build or Request
Part Image Part Image
80HCPS1616CRM Renesas Electronics
1 The IDT CPS-1616 provides a full, non-blocking bandwidth of 80 Gbps for up to 16 ports. The device uses a 5th generation switch fabric, building upon Gen1 CPS and Tsi switching architectures. This new switch uses patent pending features to minimize latency, ensure scheduling fairness, and provide superior multicast throughput. The CPS-1616's 6.25 Gbaud SerDes is ideal for doing both local interconnect with low power, while also driving backplane links. This performance is realized over twice the transmissio 80HCPS1616CRM 0 Build or Request
Part Image Part Image 1 Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 16 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 3 – 5 MICM | Contact Mating Area Plating Material Thickness 100 – 200 MICIN | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plati 2MM-HSP-S16-VT-01-T-TRP 0 Build or Request
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