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Technical Content

144-5 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2-1445099-2 TE Connectivity
1 Configuration Features: Number of Positions 2 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .76 MI 2-1445099-2
3D model available
Symbol and footprint not available
 1
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2-1445100-4 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Hou 2-1445100-4
3D model available
Symbol and footprint not available
 1
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2-1445100-8 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 8 | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Type Pin | PCB Contact Terminati 2-1445100-8
3D model available
Symbol and footprint not available
 1
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3-1445088-0 TE Connectivity
1 Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 10 | Number of Power Positions 10 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Retention Within Housing Without | Dimensions: PCB 3-1445088-0
3D model available
Symbol and footprint not available
 1
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2-1445056-4 TE Connectivity
1 Configuration Features: Number of Power Positions 4 | Number of Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Materia 2-1445056-4
3D model available
Symbol and footprint not available
 1
1 Download Model
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2-1445085-6 TE Connectivity
1 Configuration Features: Number of Positions 6 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 6 | Contact Features: Contact Mating Area Plating Material Gold | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 15 MICI 2-1445085-6
3D model available
Symbol and footprint not available
 1
1 Download Model
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2-1445095-2 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Dimensions: PCB Thic 2-1445095-2
3D model available
Symbol and footprint not available
 1
1 Download Model
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2-1445052-4 TE Connectivity
1 Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 4 | Number of Power Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating M 2-1445052-4
3D model available
Symbol and footprint not available
 1
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3-1445093-0 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 10 | Number of Power Positions 10 | Contact Features: Multiple Contact Types Without | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 80 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Th 3-1445093-0
3D model available
Symbol and footprint not available
 1
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2-1445084-3 TE Connectivity
1 Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 3 | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | PCB Contact Termination 2-1445084-3
3D model available
Symbol and footprint not available
 1
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2-1445097-8 TE Connectivity
1 Configuration Features: Number of Positions 8 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Platin 2-1445097-8
3D model available
Symbol and footprint not available
 1
1 Download Model
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2-1445091-9 TE Connectivity
1 Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 9 | Number of Positions 9 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Layout Inline | Co 2-1445091-9
3D model available
Symbol and footprint not available
 1
1 Download Model
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2-1445091-9 TE Connectivity
1 Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 9 | Number of Positions 9 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Layout Inline | Co 2-1445091-9
3D model available
Symbol and footprint not available
 1
1 Download Model
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2-1445097-4 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating A 2-1445097-4
3D model available
Symbol and footprint not available
 1
1 Download Model
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2-1445098-6 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 6 | Number of Positions 6 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB T 2-1445098-6
3D model available
Symbol and footprint not available
 1
1 Download Model
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2-1445089-3 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 3 | PCB Mount Orientation Right Angle | Number of Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Type Pin | Dimensions: PCB T 2-1445089-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1445048-5 TE Connectivity
1 Configuration Features: Number of Positions 5 | Number of Rows 1 | Contact Features: Contact Layout Inline | Contact Type Pin | Contact Retention Within Housing Without | Dimensions: Compatible Insulation Diameter (Max) 1.52 MM | Connector Height 16.89 MM | Wire Size 100.5 – 1022 CMA | Product Width 3.86 MM | Panel Thickness (Recommended) 1.57 – 2.3 MM | Wire Size 30 – 20 AWG | Wire Size .051 – .517 MMSQ | Product Length 15.85 MM | Panel Thickness (Recommended) .062 – .091 INCH | Electrical Charac 1445048-5
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2-1445100-3 TE Connectivity
1 Configuration Features: Number of Positions 3 | PCB Mount Orientation Right Angle | Number of Power Positions 3 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Type Pin | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within H 2-1445100-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2-1445089-3 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 3 | PCB Mount Orientation Right Angle | Number of Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Type Pin | Dimensions: PCB T 2-1445089-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1445048-5 TE Connectivity
1 Configuration Features: Number of Positions 5 | Number of Rows 1 | Contact Features: Contact Layout Inline | Contact Type Pin | Contact Retention Within Housing Without | Dimensions: Compatible Insulation Diameter (Max) 1.52 MM | Connector Height 16.89 MM | Wire Size 100.5 – 1022 CMA | Product Width 3.86 MM | Panel Thickness (Recommended) 1.57 – 2.3 MM | Wire Size 30 – 20 AWG | Wire Size .051 – .517 MMSQ | Product Length 15.85 MM | Panel Thickness (Recommended) .062 – .091 INCH | Electrical Charac 1445048-5
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2-1445098-6 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Power Positions 6 | Number of Positions 6 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB T 2-1445098-6
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2-1445100-3 TE Connectivity
1 Configuration Features: Number of Positions 3 | PCB Mount Orientation Right Angle | Number of Power Positions 3 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Type Pin | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within H 2-1445100-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
3-1445100-0 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Signal Positions 0 | Number of Positions 10 | Number of Power Positions 10 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickn 3-1445100-0
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2-1445088-8 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 8 | Number of Power Positions 8 | Contact Features: Multiple Contact Types Without | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | PCB Contact 2-1445088-8
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2-1445097-8 TE Connectivity
1 Configuration Features: Number of Positions 8 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Platin 2-1445097-8
3D model available
Symbol and footprint not available
 1
1 Download Model
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