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1-2825272-6
TE Connectivity
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0 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Contacts Preloaded Yes | Number of Positions 16 | Number of Signal Positions 16 | Contact Features: Contact Mating Area Plating Material Tin | Contact Layout Matrix | Contact Type Pin | Contact Retention Within Housing With | Contact Current Rating (Max) 13 AMP | PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) .063 INCH | Connector Height 12.8 MM | Row-to-Row Spacing 4.2 MM | Wire Size .12 | 1-2825272-6 |
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2-2825272-2
TE Connectivity
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0 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Contacts Preloaded Yes | Number of Signal Positions 22 | Number of Positions 22 | Contact Features: Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Layout Matrix | Contact Retention Within Housing With | Dimensions: Compatible Insulation Diameter (Max) 2.39 MM | Wire Size .12 – 1.4 MMSQ | Compatible Insulation Diameter R | 2-2825272-2 |
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2825274-6
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 6 | Number of Positions 6 | Number of Rows 2 | Number of Power Positions 0 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Type Pin | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types With | Contact Retention Within Housing Without | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plati | 2825274-6 |
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2825272-8
TE Connectivity
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0 | Configuration Features: PCB Mount Orientation Vertical | Number of Signal Positions 8 | Number of Rows 2 | Number of Positions 8 | Contacts Preloaded Yes | Contact Features: Contact Retention Within Housing With | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 13 AMP | Contact Layout Matrix | Dimensions: Product Width .383 INCH | Row-to-Row Spacing .165 INCH | Product Width 9.75 MM | Compatible Insulation Diamete | 2825272-8 |
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1-2825353-4
TE Connectivity
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0 | Body Features: Primary Product Color Natural | Configuration Features: Card Entry Style Side | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Insulation Displacement Slots 4 | Connector Contact Load Condition Fully Loaded | Compatible With Wire & Cable Type Discrete Wire | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 3 – 6 MICM | Contact Current Rating (Max) 2 AMP | Contact Mating Area Plating Material Tin | Contact Type Socket | PCB Contact Te | 1-2825353-4 |
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2825274-4
TE Connectivity
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0 | Configuration Features: Number of Signal Positions 4 | Number of Power Positions 0 | Number of Rows 2 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Type Pin | Multiple Contact Types With | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Tin | Contact Layout Inline | Dimensions | 2825274-4 |
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2825272-4
TE Connectivity
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0 | Configuration Features: Number of Positions 4 | Number of Rows 2 | Number of Signal Positions 4 | Number of Power Positions 0 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Matrix | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Base Material Brass | Contact Current Rating (Max) 13 AMP | Contact Layout Square Grid | Contact Mating Area Plating Material Thickness 2.032 MICM | | 2825272-4 |
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1-2825261-0
TE Connectivity
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1 | Configuration Features: Number of Positions 10 | Number of Power Positions 0 | PCB Mount Orientation Vertical | Number of Signal Positions 10 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.032 MICM | Contact Type Pin | Contact Current Rating (Max) 13 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing With | 1-2825261-0 |
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2825313-1
TE Connectivity
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1 | Body Features: Interlock Without | Configuration Features: Number of Positions 9 | Wire Entry Angle Side | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Tin | Contact Base Material Phosphor Bronze | Dimensions: Wire Size 30 – 12 AWG | Wire Size .05 – 2 MMSQ | Electrical Characteristics: Current Rating (Max) 12 AMP | Housing Features: Centerline (Pitch) 5 MM | Centerline (Pitch) .197 INCH | Housing Material PA 66 | Housing Color Green | Identi | 2825313-1 |
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RA16328.25K-B-NC-T5
Susumu Co Ltd
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1 | RESISTOR, NETWORK, FILM, ISOLATED, 0.12W, SURFACE MOUNT, 1206, CHIP, ROHS COMPLIANT | RA16328.25K-B-NC-T5 |
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PCF-W2512-02-8252-T-E-LT
TT Electronics Resistors
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1 | Fixed Resistor, Thin Film, 0.5W, 82500ohm, 150V, 0.01% +/-Tol, -50,50ppm/Cel, 2512, | PCF-W2512-02-8252-T-E-LT |
0
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5-828259-0
TE Connectivity
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1 | CONNECTOR, 50 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER | 5-828259-0 |
0
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HVCS2010T2825K1%R
SEI Stackpole Electronics Inc
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1 | RESISTOR, METAL GLAZE/THICK FILM, 0.5W, 1%, 50ppm, 825000ohm, SURFACE MOUNT, 2010, CHIP | HVCS2010T2825K1%R |
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PCF0805-02-825RFT1
TT Electronics Resistors
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1 | Fixed Resistor, Thin Film, 0.1W, 825ohm, 100V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 0805, CHIP | PCF0805-02-825RFT1 |
0
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ASTMLPE-28-25.000625MHZ-EC-EL
Abracon Corporation
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1 | LVCMOS Output Clock Oscillator, 25.000625MHz Nom, SMD, 4 PIN | ASTMLPE-28-25.000625MHZ-EC-EL |
0
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10121750-1528257LF
Amphenol FCi
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1 | Board Connector | 10121750-1528257LF |
0
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SS8ALF-02-8250-DB
TT Electronics Resistors
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1 | Array/Network Resistor, Isolated, 0.8W, 100V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 1539, SOIC, LEAD FREE | SS8ALF-02-8250-DB |
0
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CAR2512825OHMS1%15PPMHP
Riedon
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1 | Fixed Resistor, Thin Film, 0.75W, 825ohm, 200V, 1% +/-Tol, -15,15ppm/Cel, 2512, | CAR2512825OHMS1%15PPMHP |
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HHV-50FBG52-825K
YAGEO Corporation
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1 | Fixed Resistor, Metal Glaze/thick Film, 0.5W, 825000ohm, 3500V, 1% +/-Tol, -200,200ppm/Cel, | HHV-50FBG52-825K |
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MC202825233DE
Ohmite Mfg Co
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1 | Fixed Resistor, Metal Glaze/thick Film, 2.5W, 523000ohm, 5000V, 0.5% +/-Tol, 50ppm/Cel, 5050, | MC202825233DE |
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ASTMLPV-28-25.000MHZ-LR-EB-T
Abracon Corporation
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1 | LVCMOS Output Clock Oscillator, 25MHz Nom, SMD, 4 PIN | ASTMLPV-28-25.000MHZ-LR-EB-T |
0
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GUS-QS8A-028251-DA
TT Electronics Resistors
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1 | Array/Network Resistor, Isolated, Tantalum Nitride/nickel Chrome, 0.1W, 8250ohm, 100V, 0.5% +/-Tol, -50,50ppm/Cel, 1915, | GUS-QS8A-028251-DA |
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UP1/2T282.5K0.1%F
SEI Stackpole Electronics Inc
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1 | Fixed Resistor, Metal Film, 0.5W, 82500ohm, 350V, 0.1% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED | UP1/2T282.5K0.1%F |
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UB-28.25OHM0.01%
Riedon
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1 | Fixed Resistor, 1.5W, 8.25ohm, 42V, 0.01% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED | UB-28.25OHM0.01% |
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10121750-2825203LF
Amphenol FCi
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1 | Board Connector | 10121750-2825203LF |
0
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