04406 Model Download Search Results
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0440672401
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits, Tin (Sn) Plating | 0440672401 |
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0440680045
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, for 1.60mm PCB, 4 Circuits, Tin (Sn) Plating, with Solderable Retention Clip | 0440680045 |
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0440680013
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, for 1.60mm PCB, 6 Circuits, Gold (Au) Plating, with Solderable Retention Clip | 0440680013 |
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0440680011
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, for 1.60mm PCB, 24 Circuits, Tin (Sn) Plating, with Solderable Retention Clip | 0440680011 |
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0440670201
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 2 Circuits, Tin (Sn) Plating | 0440670201 |
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0440680061
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, for 1.60mm PCB, 14 Circuits, Gold (Au) Plating, with Solderable Retention Clip | 0440680061 |
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0440672201
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 22 Circuits, Tin (Sn) Plating | 0440672201 |
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0440680271
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, 14 Circuits, 6.35mm PCB Thickness, with Snap-In Metal Pins, PA Polyamide Nylon 4/6, UL 94V-0, with Tin (Sn) Over Nickel (Ni) Plating | 0440680271 |
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0440680284
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, 18 Circuits, 6.35mm PCB Thickness, with Snap-In Metal Pins, PA Polyamide Nylon 4/6, UL 94V-0, with Gold (Au) Over Nickel (Ni) Plating | 0440680284 |
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0440671402
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 14 Circuits, 0.38µm Gold (Au) Selective Plating | 0440671402 |
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0440671401
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 14 Circuits, Tin (Sn) Plating | 0440671401 |
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0440680282
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, 14 Circuits, 6.35mm PCB Thickness, with Snap-In Metal Pins, PA Polyamide Nylon 4/6, UL 94V-0, with Gold (Au) Over Nickel (Ni) Plating | 0440680282 |
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0440681003
Molex
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1 | Rectangular Power Connector | 0440681003 |
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0440672403
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits, 0.76µm Gold (Au) Selective Plating | 0440672403 |
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0440680034
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, for 1.60mm PCB, 4 Circuits, Gold (Au) Plating, without Solderable Retention Clip | 0440680034 |
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0440680089
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, for 1.60mm PCB, 4 Circuits, Tin (Sn) Plating, with Solderable Retention Clip | 0440680089 |
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0440680105
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, for 1.60mm PCB, 14 Circuits, Gold (Au) Plating, with Solderable Retention Clip | 0440680105 |
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0440680094
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, for 1.60mm PCB, 14 Circuits, Tin (Sn) Plating, with Solderable Retention Clip | 0440680094 |
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0440680006
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, for 1.60mm PCB, 14 Circuits, Tin (Sn) Plating, with Solderable Retention Clip | 0440680006 |
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0440680103
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, for 1.60mm PCB, 10 Circuits, Gold (Au) Plating, with Solderable Retention Clip | 0440680103 |
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0440680276
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, 24 Circuits, 6.35mm PCB Thickness, with Snap-In Metal Pins, PA Polyamide Nylon 4/6, UL 94V-0, with Tin (Sn) Over Nickel (Ni) Plating | 0440680276 |
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0440671803
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 18 Circuits, 0.76µm Gold (Au) Selective Plating | 0440671803 |
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0440680244
Molex
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1 | Mini-Fit BMI, 260C Wave Solderable, 4.20mm Pitch, Dual Row, Vertical, 4 Circuits, 6.35mm PCB Thickness, with Snap-In Metal Pins, PA Polyamide Nylon 4/6, UL 94V-0, with Gold (Au) Over Nickel (Ni) Plating, without Solderable Rete | 0440680244 |
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0440672402
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 24 Circuits, 0.38µm Gold (Au) Selective Plating | 0440672402 |
1
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0440671601
Molex
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1 | Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 16 Circuits, Tin (Sn) Plating | 0440671601 |
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