08778 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Prices / Stock	Model	Action
	1-208778-3 TE Connectivity	1	CONNECTOR ACCESSORY	1-208778-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	MC008778 SPC Multicomp	1	Fixed Resistor,	MC008778	3D model not available Symbol and footprint not available 0	0 Build or Request
	5961-00-877-8614 Motorola Mobility LLC	1	ZENER DIODE,SINGLE, TWO TERMINAL,12V V(Z),5%,TO-3VAR	5961-00-877-8614	3D model not available Symbol and footprint not available 0	0 Build or Request
	SI5338C-B08778-GMR Skyworks Solutions Inc	1	Processor Specific Clock Generator, 200MHz, CMOS, QFN-24	SI5338C-B08778-GMR	3D model not available Symbol and footprint not available 0	0 Build or Request

	SI5338C-B08778-GMR Silicon Laboratories Inc	1	Processor Specific Clock Generator,	SI5338C-B08778-GMR	3D model not available Symbol and footprint not available 0	0 Build or Request
	SI5338C-B08778-GM Silicon Laboratories Inc	1	Processor Specific Clock Generator,	SI5338C-B08778-GM	3D model not available Symbol and footprint not available 0	0 Build or Request
	RSRK 50-877/8M LUMBERG	0		RSRK 50-877/8M	3D model not available Symbol and footprint not available 0	0 Build or Request
	5961-00-877-8285 Microsemi Corporation	1	Zener Diode, 4.3V V(Z), 10%, 0.4W	5961-00-877-8285	3D model not available Symbol and footprint not available 0	0 Build or Request
	208778-1 TE Connectivity	1	Connector Accessory, Contact	208778-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-208778-1 TE Connectivity	1	Body Features: Socket Hood Material Stainless Steel \| Socket Hood Finish Passivated \| Contact Features: Contact Current Rating (Max) 5 AMP \| Contact Type Socket \| Contact Size Size 20 \| Contact Mating Area Plating Material Thickness 50 MICIN \| Contact Base Material Copper Alloy \| Contact Underplating Material Copper \| Contact Mating Area Plating Material Gold \| Mechanical Attachment: Wire Insulation Support With \| Operation/Application: Circuit Application Signal \| Packaging Features: Packaging Quantity 100	1-208778-1	3D model available Symbol and footprint not available 1	1 Download Model
	ZPF000000000008778 TE Connectivity	1	Body Features: Circular Connector Insulation Material Type Thermoset \| Shell Base Material Stainless Steel \| Hermetically Sealed No \| Shell Plating Material Passivated Stainless Steel Firewall \| Configuration Features: Number of Power Positions 0 \| Factory Installed Backshell Without \| Number of Signal Positions 3 \| Number of Positions 3 \| Contacts Preloaded No \| Keying Keyway Polarization 8 \| Contact Features: Reverse Gender No \| Contact Layout Arrangement 12 â€“ 3 \| Circular Connector Contact Type Less Pi	ZPF000000000008778	3D model not available Symbol and footprint not available 0	0 Build or Request
	SI5338C-B08778-GM Skyworks Solutions Inc	1	Processor Specific Clock Generator, 200MHz, CMOS, QFN-24	SI5338C-B08778-GM	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-208778-0 TE Connectivity	1	Body Features: Socket Hood Material Stainless Steel \| Socket Hood Finish Passivated \| Contact Features: Contact Current Rating (Max) 5 AMP \| Contact Mating Area Plating Material Gold \| Contact Underplating Material Copper \| Contact Type Socket \| Contact Mating Area Plating Material Thickness 50 MICIN \| Contact Size Size 20 \| Contact Base Material Copper Alloy \| Mechanical Attachment: Wire Insulation Support With \| Operation/Application: Circuit Application Signal \| Packaging Features: Packaging Quantity 100	1-208778-0	3D model available Symbol and footprint not available 1	1 Download Model
	CL541-0877-8-01 Hirose Electric Co Ltd	1	Board Connector	CL541-0877-8-01	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL541-0877-8-05 Hirose Electric Co Ltd	1	Board Connector	CL541-0877-8-05	3D model not available Symbol and footprint not available 0	0 Build or Request

	5961-00-877-8614 Motorola Semiconductor Products	1	Zener Diode	5961-00-877-8614	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-208778-5 TE Connectivity	1	CONNECTOR ACCESSORY	1-208778-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-208778-4 TE Connectivity	1	CONNECTOR ACCESSORY	1-208778-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-208778-2 TE Connectivity	1	Body Features: Socket Hood Finish Passivated \| Socket Hood Material Stainless Steel \| Contact Features: Contact Type Socket \| Contact Underplating Material Copper \| Contact Size Size 20 \| Contact Mating Area Plating Material Thickness 50 MICIN \| Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) 5 AMP \| Contact Base Material Copper Alloy \| Operation/Application: Circuit Application Signal \| Packaging Features: Packaging Quantity 1000 \| Packaging Method Package \| Termination Features: T	1-208778-2	3D model available Symbol and footprint not available 1	1 Download Model
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