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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2-1445053-5
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 5 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Surface Mount, Power, Black, Micro MATE-N-LOK | Other | 2-1445053-5 |
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SLW-1478144-5A-S-D
Same Sky
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1 | Slide Switches 14.7 x 8.1 x 4.4 mm, 5 mm Raised Slide Actuator, Through Hole | Other | SLW-1478144-5A-S-D |
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2-1445053-3
TE Connectivity
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1 | Configuration Features: Number of Power Positions 3 | Number of Rows 1 | Number of Positions 3 | PCB Mount Orientation Vertical | Contact Features: Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area | Other | 2-1445053-3 |
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2-1445087-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Rows 1 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Mater | Other | 2-1445087-6 |
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2-1445085-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB | Other | 2-1445085-2 |
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2-1445054-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 6 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 MICM | | Other | 2-1445054-6 |
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2-1445093-6
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Contact Mating Area Plating Material Gold | Contact Layout Inline | Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Conta | Other | 2-1445093-6 |
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2-1445057-3
TE Connectivity
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1 | Configuration Features: Number of Power Positions 3 | PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | 2-1445057-3 |
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2-1445052-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contac | Other | 2-1445052-2 |
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2-1445099-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plati | Other | 2-1445099-4 |
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2-1445053-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Multiple Contact Types Without | Contact Layout Inline | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating M | Other | 2-1445053-2 |
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2-1445084-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Positions 2 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material T | Other | 2-1445084-2 |
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2-1445091-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 3 | Number of Positions 3 | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thic | Other | 2-1445091-3 |
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2-1445050-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Layout Inline | PCB Contact Termination Area Plating Material Ti | Other | 2-1445050-4 |
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2-1445050-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Th | Other | 2-1445050-8 |
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2-1445055-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 3 | Number of Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating M | Other | 2-1445055-3 |
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2-1445093-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Pla | Other | 2-1445093-2 |
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2-1445057-7
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 7 | Number of Power Positions 7 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material | Other | 2-1445057-7 |
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2-1445056-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Layout Inline | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Mul | Other | 2-1445056-2 |
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2-1445050-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Th | Other | 2-1445050-8 |
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2-1445050-9
TE Connectivity
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1 | Configuration Features: Number of Power Positions 9 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 9 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 3 | Other | 2-1445050-9 |
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2-1445055-9
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 9 | Number of Power Positions 9 | PCB Mount Orientation Right Angle | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Platin | Other | 2-1445055-9 |
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2-1445057-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Ar | Other | 2-1445057-4 |
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2-1445057-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Ar | Other | 2-1445057-4 |
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2-1445100-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Rows 1 | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Gold | Contact Layout Inline | Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Re | Other | 2-1445100-6 |
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