14628 Model Download Search Results
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TSW-146-28-YY-S
SAMTEC
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1 | 46 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-146-28-YY-S |
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5-146285-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 3 | Connector Contact Load Condition Fully Loaded | Number of Rows 1 | Board-to-Board Configuration Parallel | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thick | Header, Vertical | 5-146285-3 |
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MAX14628ETA+
Analog Devices
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1 | IC HEADSET DETECTOR 3.5MM TDFN | Small Outline No-lead | MAX14628ETA+ |
3
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TSW-146-28-T-S
SAMTEC
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1 | 46 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-146-28-T-S |
2
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5-146285-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 4 | Connector Contact Load Condition Fully Loaded | Board-to-Board Configuration Parallel | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Square | Contact Current Rating (Max) 3 AMP | Mating Square Post Dimension .025 INCH | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Thickness 100 †| Header, Vertical | 5-146285-4 |
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MAX14628ETA+T
Analog Devices
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1 | Low-Power Headset Detectors with SEND/END Button Support, TDFN8 | Small Outline No-lead | MAX14628ETA+T |
3
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TSW-146-28-FM-S
SAMTEC
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1 | 46 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-146-28-FM-S |
2
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9-146281-0
TE Connectivity
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1 | Headers & Wire Housings 40 P HEADER GOLD | Header, Vertical | 9-146281-0 |
3
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5-146281-3
TE Connectivity
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1 | Header,Breakaway,0.100in.,PCBoard,Single | Header, Vertical | 5-146281-3 |
3
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MCP14628-E/MF
Microchip
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1 | Gate Drivers 4A Hi-Side MOSFET Drvr | Small Outline No-lead | MCP14628-E/MF |
3
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MCP14628-E/SN
Microchip
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1 | MOSFET Driver 2A Synch Buck 5V SOIC8 | Small Outline Packages | MCP14628-E/SN |
3
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5-146280-8
TE Connectivity
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1 | Headers & Wire Housings 08P HDR SRST B/A | Header, Vertical | 5-146280-8 |
3
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9-146282-0-08
TE Connectivity
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1 | CONN HEADER VERT 40POS 2.54MM | Header, Vertical | 9-146282-0-08 |
3
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5-146285-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Connector Contact Load Condition Fully Loaded | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 2 | Board-to-Board Configuration Parallel | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Contact Shape & Form Square | Mating Square Post Dimension .025 INCH | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Mating | Header, Vertical | 5-146285-2 |
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SIT3808AI-D3-33EE-14.628500
SiTime
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1 | 1 MHz to 80 MHz High Performance MEMS VCXO, 7 x 5mm, 6-Pin Package | Other | SIT3808AI-D3-33EE-14.628500 |
3
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5-146281-4
TE Connectivity
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1 | 04 MODII HDR SRST B/A LF | Header, Vertical | 5-146281-4 |
3
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5-146283-6
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | Connector Contact Load Condition Fully Loaded | Number of Positions 6 | Board-to-Board Configuration Parallel | PCB Mount Orientation Vertical | Contact Features: Contact Shape & Form Square | Contact Mating Area Plating Material Thickness 5 MICIN | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Header, Vertical | 5-146283-6 |
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TSW-146-28-H-S
SAMTEC
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1 | 46 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-146-28-H-S |
2
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5-146281-1
TE Connectivity
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1 | Headers & Wire Housings HDR VT 1X01P .1" 230/110 30AU | Other | 5-146281-1 |
3
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5-146280-1
TE Connectivity
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1 | AMP - TE CONNECTIVITY - 5-146280-1 - 01 MODII HDR SRST B/A LF | Header, Vertical | 5-146280-1 |
3
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5-146281-5
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 5 | Board-to-Board Configuration Parallel | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 1.27 MICM | Contact Shape & Form Square | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Finish Matte | Contact Unde | Header, Vertical | 5-146281-5 |
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5-146282-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 1 | PCB Mount Orientation Vertical | Connector Contact Load Condition Fully Loaded | Board-to-Board Configuration Parallel | Contact Features: Contact Current Rating (Max) 3 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Base Material Copper Alloy | Contact Shape & Form Square | PCB Contact Termination Area Plating Material Thickness | Header, Vertical | 5-146282-1 |
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TSW-146-28-SM-S
SAMTEC
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1 | 46 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-146-28-SM-S |
2
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TSW-146-28-L-S
SAMTEC
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1 | 46 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-146-28-L-S |
2
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TSW-146-28-F-S
SAMTEC
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1 | 46 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-146-28-F-S |
2
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![Part Image](["https://samtec-cdn.azureedge.net/kineticimages/images/product/series/tsw_thumb.png","https://samtec-cdn.azureedge.net/kineticimages/images/product/series/tsw_thumb.png",null])
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