16308 Model Download Search Results
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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163088-2
TE Connectivity
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1 | Contact Features: Wire Contact Termination Area Plating Thickness .076 MICM | Wire Contact Termination Area Plating Material Finish Bright | Wire Contact Termination Area Plating Thickness 3 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Mating Pin Diameter .062 INCH | Contact Underplating Material Nickel | Contact Retention Within Housing With | Contact Underplating Material Thickness 1.27 MICM | Contact Type Socket | Contact Current Rating (Ma | 163088-2 |
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163085-1
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Finish Bright | Contact Mating Area Plating Material Thickness 40 MICIN | Wire Contact Termination Area Plating Thickness 1.02 MICM | Contact Underplating Material Nickel | Contact Base Material Brass | Wire Contact Termination Area Plating Thickness 40 MICIN | Contact Retention Within Housing With | Contact Size Size 16 | Contact Orientation Straight | Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Thicknes | 163085-1 |
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163083-9
TE Connectivity
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1 | Contact Features: Contact Retention Within Housing With | Mating Pin Diameter 1.57 MM | Contact Base Material Brass | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Silver | Contact Orientation Straight | Wire Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 1.52 MICM | Contact Mating Area Plating Material Finish Matte | Wire Contact Termination Area Plating Material Silver | Wire Contac | 163083-9 |
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163087-9
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Finish Bright | Contact Mating Area Plating Material Thickness 80 MICIN | Wire Contact Termination Area Plating Thickness 80 MICIN | Contact Underplating Material Nickel | Contact Retention Within Housing With | Mating Pin Diameter 1.57 MM | Contact Size Size 16 | Wire Contact Termination Area Plating Material Finish Bright | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Orientation Straight | Mating Pin Diameter .062 INCH | Contact | 163087-9 |
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163083-1
TE Connectivity
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1 | Contact Features: Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Thickness 80 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness 80 MICIN | Mating Pin Diameter .062 INCH | Contact Size Size 16 | Wire Contact Termination Area Plating Material Finish Bright | Contact Type Socket | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Tin | Contact Underplating Material Nickel | Wire Contact T | 163083-1 |
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1630887-1
TE Connectivity
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1 | LR1 1% 47K5 | 1630887-1 |
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163088-2
TE Connectivity
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1 | Connector Accessory, 0.043in Min Cable Dia, 0.07in Max Cable Dia, Contact, Brass | 163088-2 |
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163082
Weidmüller Interface GmbH & Co. KG
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1 | Board Connector, 2 Contact(s), 1 Row(s), Male, 135 Degree, Solder Terminal | 163082 |
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1630830000
Weidmüller Interface GmbH & Co. KG
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1 | Board Connector, 3 Contact(s), 1 Row(s), Male, 135 Degree, Solder Terminal | 1630830000 |
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1630880-2
TE Connectivity
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1 | 5W, 120ohm, 5% +/-Tol, 300ppm/Cel, Through Hole Mount | 1630880-2 |
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1630820000
Weidmüller Interface GmbH & Co. KG
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1 | Board Connector, 2 Contact(s), 1 Row(s), Male, 135 Degree, Solder Terminal, | 1630820000 |
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163086
Weidmüller Interface GmbH & Co. KG
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1 | Board Connector, 6 Contact(s), 1 Row(s), Male, 135 Degree, Solder Terminal | 163086 |
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163081-7
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness 3 MICIN | Contact Mating Area Plating Material Finish Bright | Contact Underplating Material Thickness 50 MICIN | Contact Orientation Straight | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Material Gold Flash | Mating Pin Diameter 1.57 MM | Mating Pin Diamete | 163081-7 |
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163087-8
TE Connectivity
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1 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Size Size 16 | Contact Underplating Material Nickel | Contact Orientation Straight | Wire Contact Termination Area Plating Material Gold Flash | Contact Mating Area Plating Material Gold | Mating Pin Diameter 1.57 MM | Contact Type Socket | Wire Contact Termination Area Plating Thickness .076 MICM | Contact Mating Area Plating Material Finish Bright | Contact Current Rating | 163087-8 |
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163085-8
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Precious Metal | Contact Underplating Material Thickness 1.27 MICM | Wire Contact Termination Area Plating Thickness .076 MICM | Mating Pin Diameter .062 INCH | Wire Contact Termination Area Plating Thickness 3 MICIN | Contact Retention Within Housing With | Mating Pin Diameter 1.57 MM | Contact Mating Area Plating Material Finish Bright | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating | 163085-8 |
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163089-8
TE Connectivity
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1 | Contact Features: Contact Size Size 16 | Contact Underplating Material Thickness 1.27 MICM | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Gold Flash | Contact Current Rating (Max) 13 AMP | Contact Base Material Brass | Wire Contact Termination Area Plating Thickness 3 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Pin | Contact Mating Area Plating Material Precious Metal | Contact Underplating Material Thickness 50 MICIN | Wire Contac | 163089-8 |
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163-08
Semitronics Corp
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1 | Transistor | 163-08 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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1630840000
Weidmüller Interface GmbH & Co. KG
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1 | Board Connector, 4 Contact(s), 1 Row(s), Male, 135 Degree, Solder Terminal | 1630840000 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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163083
Weidmüller Interface GmbH & Co. KG
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1 | Board Connector, 3 Contact(s), 1 Row(s), Male, 135 Degree, Solder Terminal | 163083 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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163088-1
TE Connectivity
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1 | Contact Features: Contact Size Size 16 | Contact Orientation Straight | Wire Contact Termination Area Plating Material Finish Bright | Contact Base Material Brass | Contact Mating Area Plating Material Finish Bright | Wire Contact Termination Area Plating Thickness 80 MICIN | Mating Pin Diameter 1.57 MM | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Tin | Contact Type Socket | Contact Underplating Material T | 163088-1 |
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163086-1
TE Connectivity
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1 | Contact Features: Contact Type Pin | Wire Contact Termination Area Plating Thickness 40 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Finish Bright | Mating Pin Diameter .062 INCH | Contact Retention Within Housing With | Contact Underplating Material Nickel | Mating Pin Diameter 1.57 MM | Wire Contact Termination Area Plating Material Finish Bright | Contact Mating Area Plating Material Tin | Contact Mating Area Plating | 163086-1 |
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163085-2
TE Connectivity
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1 | Contact Features: Wire Contact Termination Area Plating Thickness .076 MICM | Contact Mating Area Plating Material Precious Metal | Contact Mating Area Plating Material Thickness .76 MICM | Mating Pin Diameter .062 INCH | Contact Underplating Material Thickness 50 MICIN | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Thickness 1.27 MICM | Contact Orientation Straight | Mating Pin Diameter 1.57 MM | Contact Underplating Mate | 163085-2 |
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163081-8
TE Connectivity
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1 | Contact Features: Mating Pin Diameter .062 INCH | Contact Orientation Straight | Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Thickness 1.97 MICIN | Contact Base Material Brass | Contact Mating Area Plating Material Finish Bright | Contact Mating Area Plating Material Thickness 197 MICIN | Mating Pin Diameter 1.57 MM | Contact Mating Area Plating Material Thickness 5 MICM | Contact Retention Within Hou | 163081-8 |
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163082-1
TE Connectivity
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1 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Orientation Straight | Contact Type Pin | Mating Pin Diameter .062 INCH | Contact Mating Area Plating Material Thickness 5 MICM | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Thickness .197 MICIN | Contact Base Material Brass | Wire Contact Termination Area Plating Thickness .197 MICIN | Wire Contact Termination Area Plating Thickness 5 MICM | Contact Underplating Material Thickness 50 MICIN | Wire Co | 163082-1 |
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163085-9
TE Connectivity
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1 | Contact Features: Contact Size Size 16 | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Finish Bright | Contact Type Pin | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness 40 MICIN | Mating Pin Diameter .062 INCH | Contact Orientation Straight | Mating Pin Diameter 1.57 MM | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 40 MICIN | Wire Co | 163085-9 |
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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