164S5 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Prices / Stock	Model	Action
	V58C365164S5L Mosel Vitelic Corporation	1	DDR1 DRAM, 4MX16, 0.1ns, CMOS, PDSO66	V58C365164S5L	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT4-1206Y164S500TF3 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, Y5V, -80/+30ppm/Cel TC, 0.16uF, 2215,	CT4-1206Y164S500TF3	3D model not available Symbol and footprint not available 0	0 Build or Request
	IDT7164S55L28B8 Renesas Electronics Corporation	1	Standard SRAM, 8KX8, 55ns, CMOS, CQCC28	IDT7164S55L28B8	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT4-1206B164S500PF4 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.16uF, 2215,	CT4-1206B164S500PF4	3D model not available Symbol and footprint not available 0	0 Build or Request

	CT4-1206B164S500PF1 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.16uF, 2215,	CT4-1206B164S500PF1	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT4-1210Y164S500F4 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, Y5V, -80/+30ppm/Cel TC, 0.16uF, 2215,	CT4-1210Y164S500F4	3D model not available Symbol and footprint not available 0	0 Build or Request
	7164S55D Integrated Device Technology Inc	1	Standard SRAM, 8KX8, 55ns, CMOS, CDIP28	7164S55D	3D model not available Symbol and footprint not available 0	0 Build or Request
	7164S55TDGB8 Integrated Device Technology Inc	1	Standard SRAM, 8KX8, 55ns, CMOS, CDIP28	7164S55TDGB8	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT4-1206B164S500F4 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.16uF, 2215,	CT4-1206B164S500F4	3D model not available Symbol and footprint not available 0	0 Build or Request
	7164S55TC Integrated Device Technology Inc	1	Standard SRAM, 8KX8, 55ns, CMOS, CDIP28	7164S55TC	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT4-1812Y164S500PF2 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, Y5V, -80/+30ppm/Cel TC, 0.16uF, 3315,	CT4-1812Y164S500PF2	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT4-1812Y164S500F2 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, Y5V, -80/+30ppm/Cel TC, 0.16uF, 3315,	CT4-1812Y164S500F2	3D model not available Symbol and footprint not available 0	0 Build or Request
	7164S55TDGB8 Renesas Electronics Corporation	1	Standard SRAM, 8KX8, 55ns, CMOS, CDIP28	7164S55TDGB8	3D model not available Symbol and footprint not available 0	0 Build or Request
	M212164S-50.000MHZ MtronPTI	1	Oscillator	M212164S-50.000MHZ	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT4-0805Y164S500F4 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, Y5V, -80/+30ppm/Cel TC, 0.16uF, 1715,	CT4-0805Y164S500F4	3D model not available Symbol and footprint not available 0	0 Build or Request

	CT4-1206B164S500TF3 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.16uF, 2215,	CT4-1206B164S500TF3	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT4-1209Y164S500TF4 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, Y5V, -80/+30ppm/Cel TC, 0.16uF, 2215,	CT4-1209Y164S500TF4	3D model not available Symbol and footprint not available 0	0 Build or Request
	IDT7164S55L28B Integrated Device Technology Inc	1	Standard SRAM, 8KX8, 55ns, CMOS, CQCC28	IDT7164S55L28B	3D model not available Symbol and footprint not available 0	0 Build or Request
	MSM164S-55 APTA Group Inc	1	Standard SRAM, 64KX1, 55ns, CMOS, CDIP22	MSM164S-55	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT4-0805B164S500TF3 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.16uF, 1715,	CT4-0805B164S500TF3	3D model not available Symbol and footprint not available 0	0 Build or Request
	IDT7164S55L32B Integrated Device Technology Inc	1	Standard SRAM, 8KX8, 55ns, CMOS, CQCC32	IDT7164S55L32B	3D model not available Symbol and footprint not available 0	0 Build or Request
	2M804-004-00Z16-4S-501 Amphenol Corporation	1	MIL Series Connector, 4 Contact(s), Stainless Steel, Female, Crimp Terminal, Receptacle	2M804-004-00Z16-4S-501	3D model not available Symbol and footprint not available 0	0 Build or Request
	IDT7164S55LI Integrated Device Technology Inc	1	Standard SRAM, 8KX8, 55ns, CMOS, CQCC32	IDT7164S55LI	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT4-0805Y164S500PF3 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, Y5V, -80/+30ppm/Cel TC, 0.16uF, 1715,	CT4-0805Y164S500PF3	3D model not available Symbol and footprint not available 0	0 Build or Request
	CT4-0805B164S500TF4 Fenghua (HK) Electronics Ltd	1	Ceramic Capacitor, Multilayer, Ceramic, 50V, 50% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.16uF, 1715,	CT4-0805B164S500TF4	3D model not available Symbol and footprint not available 0	0 Build or Request
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