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54242-126123800LF
Amphenol Communications Solutions
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1 | 12 Position Header Spacer Connector 0.100" (2.54mm) Gold, GXT™ Surface Mount | Other | 54242-126123800LF |
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V62/12620-01XE
Texas Instruments
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1 | 16-bit Microcontrollers - MCU EP 16B Ultra-Low-Pwr Mixed Signal MCU | Small Outline Packages | V62/12620-01XE |
3
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SF2126E
Murata Electronics
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1 | Signal Conditioning 725MHz, Wimax RF SAW Filter | Other | SF2126E |
3
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HT7M2126
Holtek
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1 | PIR Detector Miniaturized Module | Other | HT7M2126 |
3
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HPX2126
COILCRAFT
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0 | Isolation Transformer | Other | HPX2126 |
3
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721-264/001-040
Wago
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1 | THT male header; 1.2 x 1.2 mm solder pin; straight; 100% protected against mismating; Preceding ground contact; Pin spacing 7.5 mm; 4-pole | Other | 721-264/001-040 |
3
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721-263/001-040
Wago
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1 | THT male header; 1.2 x 1.2 mm solder pin; straight; 100% protected against mismating; Preceding ground contact; Pin spacing 7.5 mm; 3-pole | Other | 721-263/001-040 |
3
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09662126601
HARTING
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1 | D-Sub 15pin female angled 2.54mm pitch, stamped, w/o board locks, M3, PL2 | Other | 09662126601 |
3
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TS14-1212-65-BK-160-SCR-D
Same Sky
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1 | 12 x 12 mm, 6.5 mm Actuator Height Off PCB, 160 gf, Short Crimped, Black, Through Hole, SPST, Tactile Switch | Other | TS14-1212-65-BK-160-SCR-D |
3
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R5F21266JFP#U0
Renesas Electronics
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1 | The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu | Quad Flat Packages | R5F21266JFP#U0 |
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R5F21265SNFP#V2
Renesas Electronics
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1 | The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu | Quad Flat Packages | R5F21265SNFP#V2 |
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R5F21264SNFP#V2
Renesas Electronics
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1 | The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu | Quad Flat Packages | R5F21264SNFP#V2 |
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R5F21264SNFP#X6
Renesas Electronics
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1 | The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu | Quad Flat Packages | R5F21264SNFP#X6 |
3
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MK22126
Fischer Elektronik GmbH & Co. KG
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1 | female header | Other | MK22126 |
3
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B32778M2126K000
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 12uF, 1400V DC, 35mm(W) x 50mm(H) x 57.5mm(L) | Other | B32778M2126K000 |
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TS14-1212-65-BK-260-SCR-D
Same Sky
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1 | 12 x 12 mm, 6.5 mm Actuator Height Off PCB, 260 gf, Short Crimped, Black, Through Hole, SPST, Tactile Switch | Other | TS14-1212-65-BK-260-SCR-D |
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2SA2126-TL-H
onsemi
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1 | Obsolete - Bipolar Transistor, -50V, -10A, Low VCE(sat), (PNP)NPN Single TP/TP-FA | Other | 2SA2126-TL-H |
2
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INA2126E/2K5
Texas Instruments
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1 | Instrumentation Amplifiers Micropower Single & Dual Versions | Small Outline Packages | INA2126E/2K5 |
3
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INA2126EA/250
Texas Instruments
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1 | Texas Instruments INA2126EA/250 Dual Instrumentation Amplifier, 0.5mV Offset, CMMR 74dB, 3 to 28V, 16-Pin SSOP | Small Outline Packages | INA2126EA/250 |
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V62/12603-01XE
Texas Instruments
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1 | Switching Voltage Regulators Boost Converter with 5.5 A Quiescnt Crrnt | SOT23 (6-Pin) | V62/12603-01XE |
3
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721-265/001-040
Wago
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1 | THT male header; 1.2 x 1.2 mm solder pin; straight; 100% protected against mismating; Preceding ground contact; Pin spacing 7.5 mm; 5-pole | Other | 721-265/001-040 |
3
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721-263/001-000
Wago
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1 | THT male header; 1.2 x 1.2 mm solder pin; straight; 100% protected against mismating; Pin spacing 7.5 mm; 3-pole | Other | 721-263/001-000 |
3
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HPX2126LD
COILCRAFT
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1 | Audio Transformers / Signal Transformers PoE Plus 850uH DCR=0.24mOhms 1.9A | Other | HPX2126LD |
3
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HPX2126LB
COILCRAFT
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1 | High Power PoE Signal Path Magnetics Transformer | Other | HPX2126LB |
3
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1332126
Phoenix Contact
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1 | FS 0,635/ 60-MV-R- 8,0 - SMD male connector, nominal current: 0.5 A, test voltage: 500 V AC, number of positions: 60, pitch: 0.635 mm, color: black, contact surface: Au, contact connection type: Pin, mounting: SMD soldering | Other | 1332126 |
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![Part Image](["https://componentsearchengine.com/2D/0T/21448885.1.1.png",null,null])
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![Part Image](["https://fischer.incony.de/pim/upload/fischerData/image/web/MK22126.jpg","https://fischer.incony.de/pim/upload/fischerData/image/web/MK22126.jpg",null])
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