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ALD212900ASAL
Advanced Linear Devices Inc.
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1 | MOSFET Dual N-Ch EPAD FET Array VGS=0.0V | Small Outline Packages | ALD212900ASAL |
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G2129BAJ1U
Global Mixed-Mode Technology
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1 | 1-2-4-Bit Bidirectional Voltage-Level TranslatorFor Open-Drain Applications | Small Outline No-lead | G2129BAJ1U |
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2129320-3
AB Connectors
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1 | DisplayPort Connectors, Right Angle, Top, Through Hole - Solder, Gold, Cable-to-Board, 20 Position, .6 mm [.02 in] Centerline, Printed Circuit Board | Other | 2129320-3 |
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2129260-1
TE Connectivity
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1 | Body Features: Shell Base Material Stainless Steel | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 3 | Number of Signal Positions 40 | Number of Power Positions 0 | Number of Positions 40 | Contact Features: Contact Current Rating (Max) 1 AMP | Number of Utility Contacts 0 | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Housing Features: Housing Colo | Other | 2129260-1 |
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TSW-121-29-TM-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-TM-S |
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TSW-121-29-T-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-T-S |
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MK2129ECO
Fischer Elektronik GmbH & Co. KG
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1 | female header | Other | MK2129ECO |
3
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R5F21292SDSP#U0
Renesas Electronics
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1 | The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Small Outline Packages | R5F21292SDSP#U0 |
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R5F21292SNSP#U0
Renesas Electronics
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1 | The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Small Outline Packages | R5F21292SNSP#U0 |
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TSW-121-29-F-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-F-S |
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TSW-121-29-G-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-G-S |
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2129115-1
TE Connectivity
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1 | 31 Position, SATA, Plug, Right Angle, 6P + 7P + 18P, Cable-to-Board, Slimline Profile, Surface Mount / Through Hole - Solder, 2 Row, 2 Port, Top Mount | Other | 2129115-1 |
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ABMM2-12.9000MHZ-E2-T
ABRACON
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1 | Crystals / Oscillators / Resonators +/- 20PPM 12.9 MHZ | Other | ABMM2-12.9000MHZ-E2-T |
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R5F21292SDSP#W4
Renesas Electronics
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1 | The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Small Outline Packages | R5F21292SDSP#W4 |
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R5F21296KSP#W4
Renesas Electronics
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1 | The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Small Outline Packages | R5F21296KSP#W4 |
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LFSPXO021292BULK
IQD
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1 | Standard Clock Oscillators 8.0MHz 7.0 x 5.0 x 1.4mm | Other | LFSPXO021292BULK |
3
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LFXTAL082129
IQD
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1 | 32 MHz ±10ppm Crystal 8pF 100 Ohms 4-SMD, No Lead , -40°C ~ 85°C | Other | LFXTAL082129 |
3
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BWCU00201212900Y03
Yageo Group
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1 | 2 Line Common Mode Choke Surface Mount 90 Ohms @ 100 MHz 500mA DCR 300mOhm | Other | BWCU00201212900Y03 |
3
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009296002212906
Kyocera AVX
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1 | Headers & Wire Housings 2Way 20-26AWG 300V Horizontal White | Other | 009296002212906 |
3
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RM372-035-321-2900
Molex
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1 | RM37, Rugged Rectangular Connector, 1.91mm Pitch, Right Angle Board Mount Plug, PTH, without Mounting Ears. 3-Row, Size: 035. | Other | RM372-035-321-2900 |
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RM312-011-121-2900
Molex
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1 | 3 Row Straight PTH PCB Connector with Mounting Ears (PLUG) | Other | RM312-011-121-2900 |
2
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ALD212900PAL
Advanced Linear Devices Inc.
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1 | MOSFET 2N-CH 10.6V 0.08A 8DIP | Dual-In-Line Packages | ALD212900PAL |
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PCF2129AT
NXP
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1 | NXP Semiconductors Accurate RTC with integrated quartz crystal for industrial applications | Small Outline Packages | PCF2129AT |
3
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AWCU00201212900M02
Yageo Group
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1 | 2 Line Common Mode Choke Surface Mount 90 Ohms @ 100 MHz 330mA DCR 350mOhm | Other | AWCU00201212900M02 |
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TSW-121-29-YY-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-YY-S |
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