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Technical Content

21325 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2132583-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | Guide Location Unguided | Number of Rows 9 | Stackable No | Number of Positions 72 | Number of Signal Positions 48 | Number of Columns 8 | PCB Mount Orientation Vertical | Number of Ground Positions 24 | Number of Pairs 24 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 30 – 60 MICIN | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Ma 2132583-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132526-3 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Columns 6 | Stackable No | Guide Location Left | Number of Pairs 18 | Number of Ground Positions 18 | Number of Signal Positions 36 | Number of Rows 9 | PCB Mount Orientation Vertical | Number of Positions 54 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Layout Inline | Contact Mating Area Length .217 INCH | Contact Underplating Material Nickel | Contact Type Pin | Contact Shape & Form Dual 2132526-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132583-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Unguided | Backplane Architecture Orthogonal | Number of Columns 8 | Number of Rows 9 | Number of Ground Positions 24 | PCB Mount Orientation Vertical | Stackable No | Number of Pairs 24 | Number of Signal Positions 48 | Number of Positions 72 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 30 – 60 MICIN | Contact Mating 2132583-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132562-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Stackable No | Guide Location Left | Number of Positions 54 | Backplane Architecture Orthogonal | PCB Mount Orientation Vertical | Number of Signal Positions 36 | Number of Ground Positions 18 | Number of Rows 9 | Number of Pairs 18 | Number of Columns 6 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Length .217 INCH | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 2132562-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132570-2 TE Connectivity
1 IMP100O,HMP,V3P6C,LG,REW46,5.5 2132570-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132541-3 TE Connectivity
1 IMP100S,H,V3P6C,UG,REW39,5.5 2132541-3
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132530-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Stackable No | Number of Columns 6 | PCB Mount Orientation Vertical | Number of Rows 9 | Number of Ground Positions 18 | Number of Positions 54 | Guide Location Right | Number of Pairs 18 | Number of Signal Positions 36 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) .75 AMP | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Finish Matte | Contact 2132530-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132529-3 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 36 | Stackable No | PCB Mount Orientation Vertical | Number of Pairs 18 | Number of Columns 6 | Guide Location Left | Number of Ground Positions 18 | Number of Rows 9 | Number of Positions 54 | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Current Rating (Max) .75 AMP | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating 2132529-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132532-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Right | Stackable No | Number of Rows 9 | Number of Positions 54 | PCB Mount Orientation Vertical | Number of Pairs 18 | Number of Columns 6 | Number of Signal Positions 36 | Number of Ground Positions 18 | Contact Features: Contact Shape & Form Dual Beam | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .75 AMP | PCB Contact Termination Area Plating Material Th 2132532-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132563-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 18 | Number of Pairs 18 | Stackable No | Number of Signal Positions 36 | Guide Location Right | Number of Positions 54 | Number of Columns 6 | PCB Mount Orientation Vertical | Number of Rows 9 | Backplane Architecture Orthogonal | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .75 AMP | Contact Base Material Copper Nickel Silicon | Contact Underplating Material Thicknes 2132563-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132596-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 24 | Number of Columns 6 | Guide Location Right | Number of Ground Positions 24 | Number of Signal Positions 48 | Backplane Architecture Orthogonal | Stackable No | PCB Mount Orientation Vertical | Number of Positions 72 | Number of Rows 12 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Gold | Contact Shape & Form Dual Beam | PCB Contact Termination Area 2132596-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132594-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | PCB Mount Orientation Vertical | Number of Columns 6 | Number of Signal Positions 48 | Number of Ground Positions 24 | Stackable No | Number of Rows 12 | Number of Pairs 24 | Guide Location Left | Number of Positions 72 | Contact Features: Contact Shape & Form Dual Beam | Contact Mating Area Length 5.5 MM | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Mat 2132594-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132595-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | Number of Pairs 24 | Number of Rows 12 | Number of Columns 6 | PCB Mount Orientation Vertical | Number of Ground Positions 24 | Number of Positions 72 | Number of Signal Positions 48 | Stackable No | Guide Location Right | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Mating Area Plating M 2132595-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132599-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 48 | Number of Rows 12 | Number of Positions 72 | Stackable No | Number of Pairs 24 | Backplane Architecture Orthogonal | Number of Columns 6 | Guide Location Unguided | Number of Ground Positions 24 | PCB Mount Orientation Vertical | Contact Features: Contact Layout Inline | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) .75 AMP | Contact Type Pin | PCB Contact Termination 2132599-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132536-3 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 60 | Number of Ground Positions 30 | Guide Location Unguided | Number of Pairs 18 | Number of Rows 9 | PCB Mount Orientation Vertical | Number of Positions 90 | Stackable No | Number of Columns 10 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Type Pin | 2132536-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132529-1 TE Connectivity
1 IMP100S,H,V3P6C,LG,REW39,4.5 2132529-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132539-3 TE Connectivity
1 IMP100S,H,V3P6C,UG,LEW39,5.5 2132539-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132540-3 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 18 | PCB Mount Orientation Vertical | Guide Location Unguided | Number of Columns 6 | Number of Positions 54 | Number of Pairs 18 | Number of Rows 9 | Number of Signal Positions 36 | Stackable No | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 30 – 60 MICIN | Contact Underplating Material Thickness 1.27 MICM 2132540-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132585-2 TE Connectivity
1 IMP100O,HMP,V3P8C,LG,OEW46,5.5 2132585-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132588-1 TE Connectivity
1 IMP100O,HMP,V3P8C,RG,LEW46,4.9 2132588-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132529-2 TE Connectivity
1 IMP100S,H,V3P6C,LG,REW39,4.9 2132529-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132565-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 36 | Number of Positions 54 | Number of Columns 6 | PCB Mount Orientation Vertical | Backplane Architecture Orthogonal | Guide Location Unguided | Stackable No | Number of Ground Positions 18 | Number of Pairs 18 | Number of Rows 9 | Contact Features: PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 30 – 6 2132565-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132564-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Right | Number of Columns 6 | Number of Rows 9 | Number of Signal Positions 36 | Stackable No | Backplane Architecture Orthogonal | Number of Ground Positions 18 | Number of Positions 54 | PCB Mount Orientation Vertical | Number of Pairs 18 | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Base Material Copper Nickel Silicon | Contact Mating Are 2132564-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132570-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Left | Number of Ground Positions 18 | PCB Mount Orientation Vertical | Backplane Architecture Orthogonal | Number of Positions 54 | Stackable No | Number of Signal Positions 36 | Number of Columns 6 | Number of Pairs 18 | Number of Rows 9 | Contact Features: Contact Type Pin | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) .75 AMP 2132570-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132536-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Stackable No | PCB Mount Orientation Vertical | Number of Signal Positions 36 | Number of Ground Positions 18 | Guide Location Unguided | Number of Columns 6 | Number of Pairs 18 | Number of Positions 54 | Number of Rows 9 | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Current Rating (Max) .75 AMP | Contact Underplating Material Nickel | Contact Layout Inline | PCB Contact Termination Area Plating Material T 2132536-1
3D model available
Symbol and footprint not available
 1
1 Download Model
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