21325 Model Download Search Results
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2132595-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Stackable No | Guide Location Right | Number of Ground Positions 24 | Backplane Architecture Orthogonal | Number of Rows 12 | Number of Signal Positions 48 | Number of Pairs 24 | Number of Positions 72 | Number of Columns 6 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) .75 AMP | Contact Layout Inline | Contact Base Material Copper Nickel Silico | 2132595-2 |
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2132526-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Columns 6 | Stackable No | Guide Location Left | Number of Pairs 18 | Number of Ground Positions 18 | Number of Signal Positions 36 | Number of Rows 9 | PCB Mount Orientation Vertical | Number of Positions 54 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Layout Inline | Contact Mating Area Length .217 INCH | Contact Underplating Material Nickel | Contact Type Pin | Contact Shape & Form Dual | 2132526-3 |
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2132534-1
TE Connectivity
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1 | Board Connector, 9 Row(s), Male, Straight, Press Fit Terminal, Black Insulator | 2132534-1 |
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2132530-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 36 | Guide Location Right | Number of Columns 6 | Number of Ground Positions 18 | Number of Pairs 18 | Number of Positions 54 | Stackable No | Number of Rows 9 | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Length 5.5 MM | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Mating Area Length .217 INCH | Contact L | 2132530-3 |
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2132566-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | Number of Positions 54 | Number of Pairs 18 | Number of Rows 9 | Number of Columns 6 | Guide Location Unguided | Stackable No | Number of Signal Positions 36 | PCB Mount Orientation Vertical | Number of Ground Positions 18 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Length 4.5 MM | Contact Layout Inline | Contact Current Rating (Max) .75 AMP | Cont | 2132566-1 |
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2132528-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 9 | Number of Signal Positions 36 | Stackable No | Guide Location Left | PCB Mount Orientation Vertical | Number of Ground Positions 18 | Number of Columns 6 | Number of Positions 54 | Number of Pairs 18 | Contact Features: Contact Shape & Form Dual Beam | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Underplating Material Nickel | Contact Mating Area Length .177 INCH | Contact Base Material Cop | 2132528-1 |
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2132586-1
TE Connectivity
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1 | Board Connector, 9 Row(s), Male, Straight, Press Fit Terminal, Guide Pin, Black Insulator | 2132586-1 |
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21325-60
Molex
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1 | Barrier Strip Terminal Block | 21325-60 |
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2132593-2
TE Connectivity
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1 | Board Connector, 12 Row(s), Male, Straight, Press Fit Terminal, Guide Pin, Black Insulator | 2132593-2 |
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2132533-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Stackable No | Number of Columns 6 | PCB Mount Orientation Vertical | Number of Rows 9 | Number of Signal Positions 36 | Guide Location Right | Number of Pairs 18 | Number of Positions 54 | Number of Ground Positions 18 | Contact Features: Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Materia | 2132533-2 |
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2132529-1
TE Connectivity
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1 | IMP100S,H,V3P6C,LG,REW39,4.5 | 2132529-1 |
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2132541-3
TE Connectivity
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1 | Board Connector, 9 Row(s), Male, Straight, Press Fit Terminal, Black Insulator | 2132541-3 |
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2132563-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 18 | Number of Pairs 18 | Stackable No | Number of Signal Positions 36 | Guide Location Right | Number of Positions 54 | Number of Columns 6 | PCB Mount Orientation Vertical | Number of Rows 9 | Backplane Architecture Orthogonal | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .75 AMP | Contact Base Material Copper Nickel Silicon | Contact Underplating Material Thicknes | 2132563-2 |
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2132599-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 48 | Number of Rows 12 | Number of Positions 72 | Stackable No | Number of Pairs 24 | Backplane Architecture Orthogonal | Number of Columns 6 | Guide Location Unguided | Number of Ground Positions 24 | PCB Mount Orientation Vertical | Contact Features: Contact Layout Inline | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) .75 AMP | Contact Type Pin | PCB Contact Termination | 2132599-2 |
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2132529-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 36 | Stackable No | PCB Mount Orientation Vertical | Number of Pairs 18 | Number of Columns 6 | Guide Location Left | Number of Ground Positions 18 | Number of Rows 9 | Number of Positions 54 | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Current Rating (Max) .75 AMP | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating | 2132529-3 |
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2132530-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Stackable No | Number of Columns 6 | PCB Mount Orientation Vertical | Number of Rows 9 | Number of Ground Positions 18 | Number of Positions 54 | Guide Location Right | Number of Pairs 18 | Number of Signal Positions 36 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) .75 AMP | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Finish Matte | Contact | 2132530-1 |
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2132539-3
TE Connectivity
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1 | IMP100S,H,V3P6C,UG,LEW39,5.5 | 2132539-3 |
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2132536-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 60 | Number of Ground Positions 30 | Guide Location Unguided | Number of Pairs 18 | Number of Rows 9 | PCB Mount Orientation Vertical | Number of Positions 90 | Stackable No | Number of Columns 10 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Type Pin | | 2132536-3 |
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2132596-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 24 | Number of Columns 6 | Guide Location Right | Number of Ground Positions 24 | Number of Signal Positions 48 | Backplane Architecture Orthogonal | Stackable No | PCB Mount Orientation Vertical | Number of Positions 72 | Number of Rows 12 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Gold | Contact Shape & Form Dual Beam | PCB Contact Termination Area | 2132596-1 |
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2132540-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 18 | PCB Mount Orientation Vertical | Guide Location Unguided | Number of Columns 6 | Number of Positions 54 | Number of Pairs 18 | Number of Rows 9 | Number of Signal Positions 36 | Stackable No | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 30 – 60 MICIN | Contact Underplating Material Thickness 1.27 MICM | 2132540-3 |
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2132570-2
TE Connectivity
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1 | Board Connector, 9 Row(s), Male, Straight, Press Fit Terminal, Guide Pin, Black Insulator | 2132570-2 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2132532-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Guide Location Right | Stackable No | Number of Rows 9 | Number of Positions 54 | PCB Mount Orientation Vertical | Number of Pairs 18 | Number of Columns 6 | Number of Signal Positions 36 | Number of Ground Positions 18 | Contact Features: Contact Shape & Form Dual Beam | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .75 AMP | PCB Contact Termination Area Plating Material Th | 2132532-1 |
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2132595-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Backplane Architecture Orthogonal | Number of Pairs 24 | Number of Rows 12 | Number of Columns 6 | PCB Mount Orientation Vertical | Number of Ground Positions 24 | Number of Positions 72 | Number of Signal Positions 48 | Stackable No | Guide Location Right | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Mating Area Plating M | 2132595-1 |
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2132594-2
TE Connectivity
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1 | Board Connector, 12 Row(s), Male, Straight, Press Fit Terminal, Guide Pin, Black Insulator | 2132594-2 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2132564-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Guide Location Right | Number of Columns 6 | Number of Rows 9 | Number of Signal Positions 36 | Stackable No | Backplane Architecture Orthogonal | Number of Ground Positions 18 | Number of Positions 54 | PCB Mount Orientation Vertical | Number of Pairs 18 | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Base Material Copper Nickel Silicon | Contact Mating Are | 2132564-1 |
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