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21326 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2132619-1 TE Connectivity
1 IMP100O,HMP,V4P8C,RG,OEW46,4.9 2132619-1 0 Build or Request
Part Image Part Image
2132612-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 12 | Backplane Architecture Orthogonal | Stackable No | Number of Ground Positions 32 | Number of Signal Positions 64 | Guide Location Right | Number of Pairs 32 | Number of Positions 96 | Number of Columns 8 | Contact Features: Contact Type Pin | Contact Base Material Copper Nickel Silicon | Contact Mating Area Length .193 INCH | Contact Mating Area Plating Material Gold | PCB Contact Termin 2132612-1 0 Build or Request
Part Image Part Image
2132636-2 TE Connectivity
1 IMP100O,HMP,V4P10C,RG,LEW46,5.5 2132636-2 0 Build or Request
Part Image Part Image
2132631-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Unguided | Stackable No | PCB Mount Orientation Vertical | Number of Signal Positions 80 | Number of Ground Positions 40 | Backplane Architecture Orthogonal | Number of Columns 10 | Number of Rows 12 | Number of Positions 120 | Number of Pairs 40 | Contact Features: Contact Shape & Form Dual Beam | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Length 4.9 MM | Contact Current Rating (Max) .75 A 2132631-1 0 Build or Request
Part Image Part Image
2132640-2 TE Connectivity
1 IMP100O,HMP,V4P10C,UG,REW46,5.5 2132640-2 0 Build or Request
Part Image Part Image
2132621-2 TE Connectivity
1 IMP100O,HMP,V4P8C,UG,OEW46,5.5 2132621-2 1 Download Model
Part Image Part Image
2132614-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Rows 12 | Backplane Architecture Orthogonal | Stackable No | Number of Pairs 32 | Guide Location Unguided | Number of Positions 96 | Number of Columns 8 | PCB Mount Orientation Vertical | Number of Signal Positions 64 | Number of Ground Positions 32 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Finish 2132614-2 0 Build or Request
Part Image Part Image
2132638-2 TE Connectivity
1 IMP100O,HMP,V4P10C,UG,LEW46,5.5 2132638-2 0 Build or Request
Part Image Part Image
2132614-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Stackable No | PCB Mount Orientation Vertical | Guide Location Unguided | Number of Signal Positions 64 | Number of Positions 96 | Backplane Architecture Orthogonal | Number of Ground Positions 32 | Number of Columns 8 | Number of Pairs 32 | Number of Rows 12 | Contact Features: PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Current Rating (Max) .75 AMP | PCB Contact Termination Area Plating Material Fi 2132614-1 0 Build or Request
Part Image Part Image
2132609-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Rows 12 | Guide Location Left | PCB Mount Orientation Vertical | Stackable No | Number of Positions 96 | Backplane Architecture Orthogonal | Number of Columns 8 | Number of Signal Positions 64 | Number of Ground Positions 32 | Number of Pairs 32 | Contact Features: PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Underplating Material Nickel | Contact Base Material Copper Nickel Silicon | PCB Co 2132609-2 0 Build or Request
Part Image Part Image
2132616-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 32 | Number of Signal Positions 64 | Stackable No | Number of Rows 12 | Guide Location Unguided | Number of Columns 8 | Backplane Architecture Orthogonal | Number of Positions 96 | PCB Mount Orientation Vertical | Number of Pairs 32 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | PCB Contact Termination A 2132616-2 1 Download Model
Part Image Part Image
2132616-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Stackable No | Number of Columns 8 | Backplane Architecture Orthogonal | PCB Mount Orientation Vertical | Number of Positions 96 | Number of Pairs 32 | Number of Ground Positions 32 | Number of Rows 12 | Number of Signal Positions 64 | Guide Location Unguided | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 30 â 2132616-1 0 Build or Request
Part Image Part Image
2132622-2 TE Connectivity
1 IMP100O,HMP,V4P8C,UG,LEW46,5.5 2132622-2 0 Build or Request
Part Image Part Image
2132625-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Left | Backplane Architecture Orthogonal | Stackable No | Number of Pairs 40 | PCB Mount Orientation Vertical | Number of Ground Positions 40 | Number of Signal Positions 80 | Number of Columns 10 | Number of Positions 120 | Number of Rows 12 | Contact Features: Contact Mating Area Length 5.5 MM | Contact Current Rating (Max) .75 AMP | Contact Underplating Material Nickel | Contact Type Pin | PCB Contact Termination Area Pla 2132625-2 0 Build or Request
Part Image Part Image
2132619-2 TE Connectivity
1 IMP100O,HMP,V4P8C,RG,OEW46,5.5 2132619-2 0 Build or Request
Part Image Part Image
2132640-1 TE Connectivity
1 IMP100O,HMP,V4P10C,UG,REW46,4.9 2132640-1 0 Build or Request
Part Image Part Image
2132650-1 TE Connectivity
1 IMP100S,R,RA2P6C,UG,39 2132650-1 0 Build or Request
Part Image Part Image
2132620-2 TE Connectivity
1 IMP100O,HMP,V4P8C,RG,LEW46,5.5 2132620-2 0 Build or Request
Part Image Part Image
2132608-2 TE Connectivity
1 IMP100O,HMP,V4P6C,UG,REW46,5.5 2132608-2 0 Build or Request
Part Image Part Image
2132648-1 TE Connectivity
1 IMP100S,R,RA2P6C,LG,39 2132648-1 0 Build or Request
Part Image Part Image
2132624-1 TE Connectivity
1 IMP100O,HMP,V4P8C,UG,REW46,4.9 2132624-1 0 Build or Request
Part Image Part Image
2132623-1 TE Connectivity
1 IMP100O,HMP,V4P8C,UG,DEW46,4.9 2132623-1 1 Download Model
Part Image Part Image
2132634-2 TE Connectivity
1 IMP,R/A,H4PR16C,GL,REW0.39 2132634-2 0 Build or Request
Part Image Part Image
2132611-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 32 | Guide Location Right | Backplane Architecture Orthogonal | Number of Rows 12 | PCB Mount Orientation Vertical | Stackable No | Number of Positions 96 | Number of Columns 8 | Number of Pairs 32 | Number of Signal Positions 64 | Contact Features: Contact Shape & Form Dual Beam | Contact Mating Area Length .193 INCH | PCB Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Nic 2132611-1 0 Build or Request
Part Image Part Image
2132606-1 TE Connectivity
1 IMP100O,HMP,V4P6C,UG,LEW46,4.9 2132606-1 0 Build or Request
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