21384 Model Download Search Results
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213843-3
TE Connectivity
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1 | Contact Features: Contact Retention Within Housing With | Contact Size Size 8 | Wire Contact Termination Area Plating Thickness 5 – 8 MICM | Contact Mating Area Plating Material Thickness 5 – 8 MICM | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Thickness 200 MICIN | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 5 – 8 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Type Socket | Wire Contact Termination Area Plating Mat | 213843-3 |
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213847-2
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Thickness 2 – 3 MICIN | Wire Contact Termination Area Plating Thickness 1 MICIN | Wire Contact Termination Area Plating Thickness .02 MICM | Contact Base Material Copper | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 2 – 3 MICM | Mating Pin Diameter 3.18 MM | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 2 – 3 MICM | Contact Current Rating (Max) 50 AMP | Wire Contact T | 213847-2 |
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213845-3
TE Connectivity
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1 | Contact Features: Contact Underplating Material Nickel | Mating Pin Diameter .125 INCH | Wire Contact Termination Area Plating Material Silver | Contact Size Size 8 | Contact Orientation Straight | Wire Contact Termination Area Plating Material Finish Semi-Bright | Contact Underplating Material Thickness 50 MICIN | Contact Current Rating (Max) 50 AMP | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 2 – 3 MICIN | Wire Contact Termination Area Plating Thickness 50 MIC | 213845-3 |
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213841-5
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Finish Semi-Bright | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Silver | Mating Pin Diameter 3.18 MM | Wire Contact Termination Area Plating Thickness 5 – 8 MICM | Contact Mating Area Plating Material Thickness 200 MICIN | Wire Contact Termination Area Plating Thickness 5 – 8 MICIN | Contact Orientation Straight | Wire Contact Termination Area Plating Material Finish Semi-Bright | Contact Retention Within Housing With | 213841-5 |
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2138495-1
TE Connectivity
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1 | Body Features: Ferrule Without | Cable Exit Angle 180° | Connector & Keying Code A | Body Material PBT GF | Cable Exit Type Fixed | Configuration Features: Snap-Lock Without | Number of Positions 1 | Contact Features: Mating Pin Diameter .48 MM | Contact Type Socket | Mating Pin Diameter .019 INCH | RF Connector Center Contact Plating Material Gold (Au) | Center Contact Without | Contact Mating Area Plating Material Gold | Dimensions: Connector Height .54 INCH | Product Length 19 MM | Product Width .455 IN | 2138495-1 |
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213845-2
TE Connectivity
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1 | Contact Features: Contact Orientation Straight | Contact Underplating Material Thickness 2 – 3 MICM | Contact Size Size 8 | Wire Contact Termination Area Plating Material Gold Flash | Contact Mating Area Plating Material Thickness 2 – 3 MICM | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Thickness 2 – 3 MICIN | Wire Contact Termination Area Plating Thickness 1 MICIN | Contact Base Material Copper | Contact Retention Within Housing With | Mating Pin Diameter 3.18 MM | Wire | 213845-2 |
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213845-8
TE Connectivity
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1 | Connector Accessory | 213845-8 |
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2138414-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Connector & Keying Code A | Configuration Features: Number of Positions 50 | Number of Rows 6 | Number of Rows 4 | Contact Features: Contact Type Tab | Mating Tab Width .047 INCH | Mating Tab Width .11 INCH | Contact Size 2.8mm | Mating Tab Width 1.2 MM | Mating Tab Width 2.8 MM | Contact Size 1.2mm | Dimensions: Product Width 2.213 INCH | Product Length 70 MM | Row-to-Row Spacing .236 INCH | Product Length 2.756 INCH | Row-to-Row Spacing 6 MM | Product Width 56. | 2138414-1 |
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213841-3
TE Connectivity
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1 | Contact Features: Wire Contact Termination Area Plating Material Silver | Contact Mating Area Plating Material Silver | Mating Pin Diameter 3.18 MM | Contact Mating Area Plating Material Thickness 5 – 8 MICM | Contact Size Size 8 | Contact Current Rating (Max) 50 AMP | Mating Pin Diameter .125 INCH | Contact Mating Area Plating Material Finish Semi-Bright | Contact Underplating Material Nickel | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 5 – 8 MICM | Contact Type Pin | 213841-3 |
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213845-1
TE Connectivity
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1 | Contact Features: Contact Current Rating (Max) 50 AMP | Contact Orientation Straight | Contact Underplating Material Nickel | Mating Pin Diameter .125 INCH | Wire Contact Termination Area Plating Material Finish Semi-Bright | Wire Contact Termination Area Plating Material Silver | Contact Mating Area Plating Material Silver | Contact Underplating Material Thickness 2 – 3 MICM | Wire Contact Termination Area Plating Thickness 1.27 MICM | Mating Pin Diameter 3.18 MM | Contact Mating Area Plating Material Th | 213845-1 |
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213843-2
TE Connectivity
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1 | Contact Features: Wire Contact Termination Area Plating Thickness 5 – 8 MICM | Contact Type Socket | Contact Size Size 8 | Contact Mating Area Plating Material Finish Semi-Bright | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Base Material Copper | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Thickness 5 – 8 MICIN | Wire Contact Termination Area Plating Material Gold Flash | Wire Contact | 213843-2 |
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2138417-1
TE Connectivity
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1 | Connector Accessory | 2138417-1 |
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2138420-1
TE Connectivity
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1 | Combination Line Connector | 2138420-1 |
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213847-3
TE Connectivity
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1 | Contact Features: Contact Current Rating (Max) 50 AMP | Wire Contact Termination Area Plating Material Silver | Contact Base Material Copper | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 2 – 3 MICM | Mating Pin Diameter 3.18 MM | Contact Orientation Straight | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Nickel | Contact Mating Area Plating Material Silver | Contact Type Socket | Wire Contact Termination Area Plating Thickness | 213847-3 |
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213847-4
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Thickness 2 – 3 MICM | Mating Pin Diameter .125 INCH | Contact Retention Within Housing With | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness 1 MICIN | Contact Orientation Straight | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 2 – 3 MICIN | Mating Pin Diameter 3.18 MM | Contact Underplating Material Thickness 2 – 3 MICM | Wire Contact Termination Area Pla | 213847-4 |
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213843-1
TE Connectivity
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1 | Contact Features: Mating Pin Diameter 3.18 MM | Contact Retention Within Housing With | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness 5 – 8 MICIN | Wire Contact Termination Area Plating Material Silver | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Finish Semi-Bright | Contact Mating Area Plating Material Thickness 200 MICIN | Contact Size Size 8 | Contact Mating Area Plating Material Thickness 5 – 8 MICM | Contact Underplating Mater | 213843-1 |
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213843-4
TE Connectivity
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1 | Contact Features: Contact Mating Area Plating Material Gold | Wire Contact Termination Area Plating Thickness 5 – 8 MICM | Mating Pin Diameter .125 INCH | Contact Size Size 8 | Contact Retention Within Housing With | Mating Pin Diameter 3.18 MM | Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Material Gold Flash | Contact Mating Area Plating Material Finish Semi-Bright | Con | 213843-4 |
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213847-1
TE Connectivity
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1 | Contact Features: Mating Pin Diameter 3.18 MM | Contact Base Material Copper | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Thickness 2 – 3 MICIN | Contact Mating Area Plating Material Finish Semi-Bright | Contact Retention Within Housing With | Contact Size Size 8 | Contact Underplating Material Thickness 2 – 3 MICM | Contact Orientation Straight | Wire Contact Termination Area Plating Material Silver | Wire Contact Termination Area Plating Material Finish Semi-Bright | Wi | 213847-1 |
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213841-4
TE Connectivity
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1 | Contact Features: Contact Underplating Material Nickel | Mating Pin Diameter .125 INCH | Wire Contact Termination Area Plating Thickness 5 – 8 MICIN | Wire Contact Termination Area Plating Material Finish Semi-Bright | Contact Base Material Copper | Mating Pin Diameter 3.18 MM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing With | Wire Contact Termination Area Plating Thickness 5 – 8 MICM | Contact Orientation Straight | Contact Mating Area Plating Material T | 213841-4 |
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213848-1
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 37 | Reverse Numbering With | Number of Power Positions 0 | Number of Positions 37 | Contact Features: Reverse Gender No | Contact Type Socket | Contact Protection With | Electrical Characteristics: Operating Voltage 600 VAC | Operating Voltage 600 VDC | Housing Features: Housing Material Thermoplastic | Body Orientation Straight | Housing Color Black | Circular Connector Shell Size 23 | Industry Standards: UL Flammability Rating UL 94V-0 | Mechanical Attac | 213848-1 |
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213845-7
TE Connectivity
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1 | Connector Accessory | 213845-7 |
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213841-8
TE Connectivity
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1 | Contact Features: Wire Contact Termination Area Plating Material Finish Semi-Bright | Contact Current Rating (Max) 50 AMP | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Finish Semi-Bright | Contact Type Pin | Contact Underplating Material Nickel | Mating Pin Diameter .125 INCH | Contact Mating Area Plating Material Thickness 5 – 8 MICM | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 5 – 8 MICIN | Contact Mating Area Plating Mate | 213841-8 |
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WBDDSS8-A-02-1384-B-A
TT Electronics Resistors
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1 | Array/Network Resistor, Isolated, 0.1W, 1380000ohm, 100V, 0.1% +/-Tol, -50,50ppm/Cel, 1408, | WBDDSS8-A-02-1384-B-A |
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C4530F508SV033RFSA2138.4MHZ
Microchip Technology Inc
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1 | Sine Output Oscillator | C4530F508SV033RFSA2138.4MHZ |
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4779792138470
Wurth Elektronik
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1 | Board Connector, 38 Contact(s), 1 Row(s), Female, Straight, Solder Terminal | 4779792138470 |
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