22276 Model Download Search Results
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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2227671-9
TE Connectivity
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1 | SFP Connector, 228 Contact(s), Female, Right Angle, Press Fit Terminal, Locking, Receptacle | 2227671-9 |
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2227666-2
TE Connectivity
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1 | Configuration Features: Number of Positions 76 | Port Matrix Configuration 2 x 1 | Number of Ports 2 | Contact Features: Contact Underplating Material Tin | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Electrical Cha | 2227666-2 |
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2227644-6
TE Connectivity
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1 | HEAT SINK CLIP, QSFP28 | 2227644-6 |
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2227669-3
TE Connectivity
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1 | SFP Connector, 38+38 Contact(s), Female, Right Angle, Press Fit Terminal, Locking, Receptacle | 2227669-3 |
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2227670-5
TE Connectivity
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1 | SFP Connector, 76+76 Contact(s), Female, Right Angle, Press Fit Terminal, Mounting Flange, Receptacle | 2227670-5 |
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2227668-3
TE Connectivity
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1 | Telecom and Datacom Connector, 228 Contact(s), Press Fit Terminal | 2227668-3 |
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2227669-1
TE Connectivity
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1 | SFP Connector, 38+38 Contact(s), Female, Right Angle, Press Fit Terminal, Locking, Receptacle | 2227669-1 |
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2227666-2
TE Connectivity
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1 | Telecom and Datacom Connector, 76 Contact(s), Press Fit Terminal | 2227666-2 |
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2227666-1
TE Connectivity
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1 | Telecom and Datacom Connector, 76 Contact(s), Press Fit Terminal | 2227666-1 |
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2227666-1
TE Connectivity
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1 | Configuration Features: Number of Positions 76 | Number of Ports 2 | Port Matrix Configuration 2 x 1 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recommended) 1.57 MM | Electrical Cha | 2227666-1 |
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2227668-1
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 3 | Number of Ports 6 | Number of Positions 228 | Number of Rear EONs per Port Column 0 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne | 2227668-1 |
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2227670-3
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Rear EONs per Port Column 3 | Number of Positions 152 | Number of Ports 4 | Contact Features: Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2227670-3 |
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2227671-8
TE Connectivity
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1 | SFP Connector, 228 Contact(s), Female, Right Angle, Press Fit Terminal, Locking, Receptacle | 2227671-8 |
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2227667-1
TE Connectivity
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1 | Telecom and Datacom Connector, 152 Contact(s), Press Fit Terminal | 2227667-1 |
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2227671-7
TE Connectivity
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1 | SFP Connector, 228 Contact(s), Female, Right Angle, Press Fit Terminal, Locking, Receptacle | 2227671-7 |
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2227669-3
TE Connectivity
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1 | Configuration Features: Number of Positions 76 | Port Matrix Configuration 2 x 1 | Number of Rear EONs per Port Column 3 | Number of Ports 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Underplating Material Tin | PCB Contact Termination Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2227669-3 |
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2227670-7
TE Connectivity
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1 | Configuration Features: Number of Rear EONs per Port Column 3 | Port Matrix Configuration 2 x 2 | Number of Ports 4 | Number of Positions 152 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) .5 AMP | Electrical Characteristics: Data Rate (Max) 25 GBS | Housing Features: Centerline (Pitch) .8 MM | Centerline (Pitch) .032 INCH | Operation/Application: Circuit Application Signal | Other: Included Lightpipe No | EMI Containment Feature Type Internal/External E | 2227670-7 |
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2227668-2
TE Connectivity
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1 | Telecom and Datacom Connector, 228 Contact(s), Press Fit Terminal | 2227668-2 |
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2227670-2
TE Connectivity
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1 | SFP Connector, 76+76 Contact(s), Female, Right Angle, Press Fit Terminal, Mounting Flange, Receptacle | 2227670-2 |
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2227671-3
TE Connectivity
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1 | SFP Connector, 228 Contact(s), Female, Right Angle, Press Fit Terminal, Locking, Receptacle | 2227671-3 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2227647-1
TE Connectivity
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1 | Configuration Features: Lightpipe Style Standard | Port Matrix Configuration 1 x 2 | Number of Ports 2 | Dimensions: PCB Thickness (Recommended) 2.25 MM | PCB Thickness (Recommended) .089 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) 14.25 MM | Centerline (Pitch) .56 INCH | Operation/Application: Heat Sink Compatible No | Pluggable I/O Applications SFP+ | Circuit Application Signal | Other: Included Lightpipe Yes | EMI Containm | 2227647-1 |
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2227667-3
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Ports 4 | Number of Rear EONs per Port Column 0 | Number of Positions 152 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2227667-3 |
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2227669-6
TE Connectivity
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1 | SFP Connector | 2227669-6 |
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2227669-2
TE Connectivity
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1 | SFP Connector, 38+38 Contact(s), Female, Right Angle, Press Fit Terminal, Locking, Receptacle | 2227669-2 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2227667-1
TE Connectivity
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1 | Configuration Features: Number of Positions 152 | Port Matrix Configuration 2 x 2 | Number of Rear EONs per Port Column 0 | Number of Ports 4 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne | 2227667-1 |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/022/276/662/2227666-2-t1.jpg/jcr:content/renditions/product-details.png",null,null])
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