Showing 25 of 3947 results
Filter by Manufacturer
| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
|---|
| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
2309414-5
TE Connectivity
|
1 | Body Features: Retention Post Material Stainless Steel | Ejector Type Locking | Latch Material High Temperature Thermoplastic | Ejector Location Both Ends | Module Key Type Offset Right | Retention Post Location Both Ends | Connector Profile High | Configuration Features: Number of Keys 1 | Number of Positions 260 | Number of Rows 2 | Module Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Memory Socket Type Memory Card | Contact Base Material Copper Allo | 2309414-5 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309407-5
TE Connectivity
|
1 | Body Features: Connector Profile Low | Retention Post Location Both Ends | Latch Material High Temperature Thermoplastic | Module Key Type Offset Left | Ejector Location Both Ends | Ejector Type Locking | Configuration Features: Number of Positions 260 | Number of Keys 1 | Module Orientation Right Angle | Number of Rows 2 | Contact Features: Memory Socket Type Memory Card | PCB Contact Termination Area Plating Material Gold Flash | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Mater | 2309407-5 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309410-4
TE Connectivity
|
1 | Body Features: Ejector Location Both Ends | Retention Post Material Copper Alloy | Connector Profile Low | Ejector Type Locking | Retention Post Location Both Ends | Latch Material High Temperature Thermoplastic | Configuration Features: Number of Keys 1 | Number of Positions 260 | Module Orientation Right Angle | Number of Positions 200 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | | 2309410-4 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309412-5
TE Connectivity
|
1 | Body Features: Module Key Type Offset Right | Connector Profile High | Retention Post Location Both Ends | Latch Material High Temperature Thermoplastic | Retention Post Material Stainless Steel | Ejector Type Locking | Ejector Location Both Ends | Configuration Features: Number of Positions 260 | Number of Rows 2 | Number of Keys 1 | Module Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Base Material Copper Alloy | PCB Contact Termination Area | 2309412-5 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309448-2
TE Connectivity
|
1 | Connector Accessory | 2309448-2 |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309411-3
TE Connectivity
|
1 | Body Features: Latch Material High Temperature Thermoplastic | Retention Post Material Stainless Steel | Ejector Type Locking | Module Key Type Offset Left | Connector Profile High | Retention Post Location Both Ends | Ejector Location Both Ends | Configuration Features: Number of Positions 260 | Module Orientation Right Angle | Number of Rows 2 | Number of Keys 1 | Contact Features: PCB Contact Termination Area Plating Material Gold Flash | Contact Base Material Copper Alloy | Contact Mating Area Plating M | 2309411-3 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309414-3
TE Connectivity
|
1 | Body Features: Ejector Location Both Ends | Retention Post Material Stainless Steel | Module Key Type Offset Right | Latch Material High Temperature Thermoplastic | Ejector Type Locking | Connector Profile High | Retention Post Location Both Ends | Configuration Features: Number of Positions 260 | Module Orientation Right Angle | Number of Keys 1 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .254 MICM | Contact Mating Area Plating Material Thickness 10 MICIN | Contact | 2309414-3 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309411-2
TE Connectivity
|
1 | Body Features: Latch Material High Temperature Thermoplastic | Ejector Type Locking | Ejector Location Both Ends | Connector Profile High | Retention Post Location Both Ends | Module Key Type Offset Left | Retention Post Material Stainless Steel | Configuration Features: Module Orientation Right Angle | Number of Rows 2 | Number of Keys 1 | Number of Positions 260 | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickn | 2309411-2 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309410-2
TE Connectivity
|
1 | Body Features: Retention Post Location Both Ends | Ejector Type Locking | Ejector Location Both Ends | Retention Post Material Copper Alloy | Latch Material High Temperature Thermoplastic | Connector Profile Low | Configuration Features: Number of Positions 260 | Module Orientation Right Angle | Number of Positions 200 | Number of Rows 2 | Number of Keys 1 | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Underplating Material Nickel | Memory Socket Type Memory Card | Contact Mating Area Pla | 2309410-2 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309411-5
TE Connectivity
|
1 | Body Features: Ejector Type Locking | Connector Profile High | Ejector Location Both Ends | Module Key Type Offset Left | Retention Post Material Stainless Steel | Retention Post Location Both Ends | Latch Material High Temperature Thermoplastic | Configuration Features: Number of Positions 260 | Number of Rows 2 | Module Orientation Right Angle | Number of Keys 1 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact U | 2309411-5 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309412-2
TE Connectivity
|
1 | Body Features: Retention Post Location Both Ends | Retention Post Material Stainless Steel | Latch Material High Temperature Thermoplastic | Ejector Location Both Ends | Module Key Type Offset Right | Connector Profile High | Ejector Type Locking | Configuration Features: Number of Keys 1 | Number of Rows 2 | Number of Positions 260 | Module Orientation Right Angle | Contact Features: Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Gold Flash | Contact Mating Area Plating | 2309412-2 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309407-4
TE Connectivity
|
1 | Body Features: Module Key Type Offset Left | Latch Material High Temperature Thermoplastic | Ejector Type Locking | Connector Profile Low | Ejector Location Both Ends | Retention Post Location Both Ends | Configuration Features: Number of Positions 260 | Number of Rows 2 | Number of Keys 1 | Module Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness .381 MICM | Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | PCB Contact Termination Area | 2309407-4 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309410-5
TE Connectivity
|
1 | Body Features: Ejector Type Locking | Retention Post Material Copper Alloy | Latch Material High Temperature Thermoplastic | Retention Post Location Both Ends | Connector Profile Low | Ejector Location Both Ends | Configuration Features: Number of Rows 2 | Module Orientation Right Angle | Number of Positions 200 | Number of Positions 260 | Number of Keys 1 | Contact Features: Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Current Rating (Max) .5 AMP | Contact Mating Area | 2309410-5 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309413-2
TE Connectivity
|
1 | Body Features: Retention Post Material Stainless Steel | Connector Profile High | Module Key Type Offset Left | Ejector Type Locking | Retention Post Location Both Ends | Ejector Location Both Ends | Latch Material High Temperature Thermoplastic | Configuration Features: Number of Positions 260 | Number of Rows 2 | Number of Keys 1 | Module Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 5 MICIN | Memory Socket Type Memory Card | PCB Contact Termination Area Platin | 2309413-2 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309408-4
TE Connectivity
|
1 | Body Features: Connector Profile Low | Ejector Type Locking | Latch Material High Temperature Thermoplastic | Retention Post Location Both Ends | Ejector Location Both Ends | Configuration Features: Module Orientation Right Angle | Number of Positions 260 | Number of Rows 2 | Number of Keys 1 | Contact Features: Memory Socket Type Memory Card | Contact Mating Area Plating Material Thickness .381 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Go | 2309408-4 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309409-4
TE Connectivity
|
1 | Body Features: Ejector Location Both Ends | Retention Post Location Both Ends | Module Key Type Offset Left | Latch Material High Temperature Thermoplastic | Ejector Type Locking | Connector Profile Low | Configuration Features: Number of Positions 260 | Number of Rows 2 | Number of Keys 1 | Module Orientation Right Angle | Contact Features: Contact Base Material Copper Alloy | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .381 MICM | PCB Contact Termination Area Plati | 2309409-4 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309408-3
TE Connectivity
|
1 | Body Features: Ejector Location Both Ends | Retention Post Location Both Ends | Latch Material High Temperature Thermoplastic | Connector Profile Low | Ejector Type Locking | Configuration Features: Number of Positions 260 | Module Orientation Right Angle | Number of Rows 2 | Number of Keys 1 | Contact Features: Memory Socket Type Memory Card | Contact Mating Area Plating Material Thickness 10 MICIN | PCB Contact Termination Area Plating Material Gold Flash | Contact Mating Area Plating Material Gold | Cont | 2309408-3 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
2309408-2
TE Connectivity
|
1 | Body Features: Latch Material High Temperature Thermoplastic | Retention Post Location Both Ends | Ejector Type Locking | Connector Profile Low | Ejector Location Both Ends | Configuration Features: Number of Rows 2 | Number of Keys 1 | Module Orientation Right Angle | Number of Positions 260 | Contact Features: Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .127 MICM | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold Flash | Conta | 2309408-2 |
1
|
Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
713HM394ZW2309-4PKT
Glenair Inc
|
1 | Connector Accessory, Backshell, Stainless Steel | 713HM394ZW2309-4PKT |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
713FS394M2309-4CPTS
Glenair Inc
|
1 | Connector Accessory, Backshell, Aluminum Alloy | 713FS394M2309-4CPTS |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
SM532023094X4G8
SMART Modular Technology Inc
|
1 | EDO DRAM Module, 2MX32, 80ns, CMOS | SM532023094X4G8 |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
70H1-23-09-4-J-DB
TE Connectivity
|
1 | Connector Accessory, Backshell, Stainless Steel | 70H1-23-09-4-J-DB |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
713FN394ZM2309-4PK
Glenair Inc
|
1 | Connector Accessory, Backshell, Stainless Steel | 713FN394ZM2309-4PK |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
713AN394NF2309-4S
Glenair Inc
|
1 | Connector Accessory, Backshell, Aluminum Alloy | 713AN394NF2309-4S |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
713AS394MT2309-4BPKT
Glenair Inc
|
1 | Connector Accessory, Backshell, Aluminum Alloy | 713AS394MT2309-4BPKT |
0
|
Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||