23318 Model Download Search Results
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2331813-5
TE Connectivity
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1 | Configuration Features: Number of Positions 84 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .381 MICM | Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 15 MICIN | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitc | 2331813-5 |
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233186-3
TE's AMP
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1 | INTERCONNECTION DEVICE | 233186-3 |
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2331814-6
TE Connectivity
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1 | Configuration Features: Number of Positions 84 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .762 MICM | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1.1 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Housing Features: Centerline (Pitch) .023 INCH | Centerline (P | 2331814-6 |
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2331814-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 84 | Contact Features: Contact Current Rating (Max) 1.1 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pi | 2331814-1 |
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2331822-1
TE Connectivity
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1 | Connector Accessory | 2331822-1 |
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2331821-1
TE Connectivity
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1 | Connector Accessory | 2331821-1 |
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233186-5
TE Connectivity
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1 | Interconnection Device | 233186-5 |
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2331814-7
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 84 | Contact Features: Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Base Material Copper Alloy | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) | 2331814-7 |
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2331814-3
TE Connectivity
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1 | Configuration Features: Number of Positions 84 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .762 MICM | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Housing Features: Centerline (Pitch) .023 INCH | Centerline (P | 2331814-3 |
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2331813-2
TE Connectivity
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1 | Configuration Features: Number of Positions 84 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .381 MICM | Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitc | 2331813-2 |
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2331851-1
TE Connectivity
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1 | Connector Accessory | 2331851-1 |
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2331813-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 84 | Number of Rows 2 | Contact Features: Contact Base Material Copper Alloy | Contact Current Rating (Max) 1.1 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Mating Area Plating Material Thickness .076 MICM | PCB Contact Termination Area Plating Material Tin | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitch | 2331813-4 |
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2331813-7
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 84 | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .076 MICM | Contact Current Rating (Max) 1.1 AMP | Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitch | 2331813-7 |
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2331813-9
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 84 | Contact Features: Contact Mating Area Plating Material Thickness .762 MICM | Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1.1 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) . | 2331813-9 |
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2331814-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 84 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 3 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Current Rating (Max) 1.1 AMP | Contact Base Material Copper Alloy | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pi | 2331814-4 |
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2331814-5
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 84 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .381 MICM | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch | 2331814-5 |
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233186-1
TE's AMP
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1 | INTERCONNECTION DEVICE | 233186-1 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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233186-3
TE Connectivity
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1 | Interconnection Device | 233186-3 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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233186-5
TE's AMP
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1 | Interconnection Device | 233186-5 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2331849-1
TE Connectivity
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1 | Connector Accessory | 2331849-1 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2331813-1
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 84 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1.1 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 3 MICIN | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitch | 2331813-1 |
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MOPC-123318137
Laser Components USA Inc
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1 | Splitter/Coupler, 1270nm Min, 1350nm Max, 1X2 Port, LC Connector, Unspecified Mount | MOPC-123318137 |
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60-233-1811-MC
ECS
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1 | Board Euro Connector | 60-233-1811-MC |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GSP2.3318.25
Schurter Electronic Components
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1 | Mains Power Connector, 15A, 250VAC, Male, Screw Terminal | GSP2.3318.25 |
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WCTA23318001C
Vishay Electro-Films
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1 | Array/Network Resistor, Divider, Thin Film, 0.125W, 18000ohm, 100V, 0.2% +/-Tol, 10ppm/Cel, Surface Mount, 0303 | WCTA23318001C |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/023/318/131/2331813-1-t1.jpg/jcr:content/renditions/product-details.png",null,null])
![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/023/318/149/2331814-9-t1.jpg/jcr:content/renditions/product-details.png",null,null])
![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/023/318/141/2331814-1-t1.jpg/jcr:content/renditions/product-details.png",null,null])
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