3-185 Model Download Search Results
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1318574-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 7 | Contact Features: Contact Current Rating (Max) 6 AMP | Electrical Characteristics: Operating Voltage 30 VDC | Housing Features: Centerline (Pitch) 2.5 MM | Centerline (Pitch) .098 INCH | Mechanical Attachment: PCB Mount Retention Type Locating Post | Connector Mounting Type Board Mount | PCB Mount Retention With | Operation/Application: Circuit Application Power & Signal | Packaging Features: Packaging Method Tube | Packaging Q | Other | 1318574-4 |
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1731857
Phoenix Contact
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1 | MKKDSNH 1,5/ 4-5,08 - Printed circuit board terminal, nominal current: 13.5 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm2, number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: MKKDSNH 1,5, pitch: 5.08 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins | Other | 1731857 |
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MAX31855TASA+T
Analog Devices
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1 | Cold-Junction Compensated Thermocouple-to-Digital Converter Voltage,3.0 3.3 3.6 V, | Small Outline Packages | MAX31855TASA+T |
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6318548-7
TE Connectivity
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1 | PACKING, PLUG ASSY. 10POS.,2.5MM PITCH B | Other | 6318548-7 |
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B32924P3185K000
TDK
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1 | EMI Suppression Capacitors | Other | B32924P3185K000 |
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203185
TE Connectivity
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1 | 1x4, 8P-8C, LED, solder | Other | 203185 |
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77313-185R08LF
Amphenol Communications Solutions
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1 | BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions | Other | 77313-185R08LF |
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2318582-2
TE Connectivity
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1 | Body Features: Product Orientation Right Angle | Configuration Features: Number of Rows 1 | Stacking Configuration Side Stackable | Wire Entry Angle 90° | Wire Entry Location Side | Number of Positions 2 | Contact Features: Contact Current Rating (Max) 5 AMP | Dimensions: Wire Size 24 – 18 AWG | Electrical Characteristics: Operating Voltage 250 VAC | Housing Features: Centerline (Pitch) 8 MM | Operation/Application: Circuit Application Power | Product Type Features: Connector System Wire-to-Component | T | Other | 2318582-2 |
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2318582-6
TE Connectivity
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1 | Body Features: Product Orientation Right Angle | Configuration Features: Wire Entry Angle 90° | Stacking Configuration Side Stackable | Number of Rows 1 | Number of Positions 6 | Wire Entry Location Side | Contact Features: Contact Current Rating (Max) 5 AMP | Dimensions: Wire Size 24 – 18 AWG | Electrical Characteristics: Operating Voltage 250 VAC | Housing Features: Centerline (Pitch) 8 MM | Operation/Application: Circuit Application Power | Product Type Features: Terminal Block Connector Type Receptac | Other | 2318582-6 |
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AP7343-185W5-7
Diodes Incorporated
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1 | DiodesZetex AP7343-185W5-7, LDO Regulator, 300mA, 1.85 V, ±1%, 1.7 → 5.25 Vin, SOT-25 5-Pin | SOT23 (5-Pin) | AP7343-185W5-7 |
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2131850609
Molex
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1 | DuraStack Board-to-Board Plug, 0.35mm Pitch, 0.80mm Mated Height, 2.00mm Mated Width, 60 Circuits, 2 Reels/Carton | Other | 2131850609 |
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2131850429
Molex
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1 | DuraStack Board-to-Board Plug, 0.35mm Pitch, 0.80mm Mated Height, 2.00mm Mated Width, 42 Circuits, 2 Reels/Carton, 0.3A, 5.0A, Maximum 50V AC (RMS)/DC, -40° to +85°C | Other | 2131850429 |
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1 | CRYSTAL 4.0320MHZ 18PF SMD | Other | ECS-40.3-18-5PXEN |
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0031.8515
SCHURTER
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1 | OGN-SMD;HOLDER;FUSE;FTT;C | Other | 0031.8515 |
3
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RT8531-85-1M8
TE Connectivity
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1 | 450 VDC, 85 A, PCB Terminal, PD2 Pollution Degree, IP00, Vertical, UL 94V-0, Board Mount, Schaffner RT-Series, EMC Chokes | Other | RT8531-85-1M8 |
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B32923P3185M000
TDK
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1 | EMI Suppression Capacitors | Other | B32923P3185M000 |
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B32924P3185M189
TDK
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1 | EMI Suppression Capacitors | Other | B32924P3185M189 |
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1843185
Phoenix Contact
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1 | MCD 1,5/13-G1-3,81 - PCB headers, nominal cross section: 1.5 mm2, color: green, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 26, number of rows: 2, number of positions: 13, number of connections: 26, product range: MCD 1,5/..-G1, pitch: 3.81 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern al | Other | 1843185 |
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TLV713185PDBVR
Texas Instruments
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1 | 150mA Low-Dropout (LDO) Regulator With Foldback Current Limit for Portable Devices | SOT23 (5-Pin) | TLV713185PDBVR |
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HT66F3185
Holtek
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1 | A/D Flash MCU with EEPROM | Small Outline Packages | HT66F3185 |
3
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MAX31850JATB+T
Analog Devices
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1 | Sensor Interface 10Mbps ESD SR-Lmtd RS485/422 Trxcvr | Small Outline No-lead | MAX31850JATB+T |
3
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MAX31855SASA+
Analog Devices
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1 | Sensor Interface Cold-Junction Compensated Thermocouple-to-Digital Convert S TYPE | Small Outline Packages | MAX31855SASA+ |
3
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MAX31855SASA+T
Analog Devices
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1 | Sensor Interface Cold-Junction Compensated Thermocouple-to-Digital Convert S TYPE | Small Outline Packages | MAX31855SASA+T |
3
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1 | Crystals 20.0MHz 11.05 x 4.7 x 4.1mm, PK | Other | LFXTAL003185 830003185B |
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MAX31850JATB+
Analog Devices
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1 | MAXIM INTEGRATED PRODUCTS - MAX31850JATB+ - Temperature Sensor IC, Digital, ± 4°C, -210 °C, 1200 °C, TDFN, 10 Pins | Small Outline No-lead | MAX31850JATB+ |
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