353-9 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	70T3539MS133BCI8 Renesas Electronics	1	The 70T3539M is a high-speed 512K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T353M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.	BGA	70T3539MS133BCI8	3D model available Symbol and footprint available 3	1 Download Model
	ESW-135-39-L-D SAMTEC	1	70 Position, .100" Elevated Socket Strip, Double Row	Other	ESW-135-39-L-D	3D model not available Symbol and footprint available 2	1 Download Model
	5353929-1 TE Connectivity	1	Body Features: Offset 4 MM \| Shell Plating Material Tin over Nickel \| Shell Plating Finish Bright \| Connector Profile Standard \| Configuration Features: Number of Positions 4 \| Number of Mounting Legs 2 \| Panel Ground Location Right/Left \| Number of Ports 1 \| Contact Features: Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Current Rating (Max) 1 AMP \| Contact Mating Area Plating Material Thickness 29.92 MICIN	Other	5353929-1	3D model available Symbol and footprint available 3	1 Download Model
	1935394 Phoenix Contact	1	PT 1,5/10-5,0-V - Printed circuit board terminal, nominal current: 17.5 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm², number of potentials: 10, number of rows: 1, number of positions per row: 10, product range: PT 1,5/..-V, pitch: 5 mm, connection method: Screw connection with wire protector, mounting: Wave soldering, conductor/PCB connection direction: 90 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packag	Other	1935394	3D model available Symbol and footprint available 3	1 Download Model

	S-35390A-T8T1G SII Semiconductor	1	Real Time Clock 2-Wire 1.3-5.5V	Small Outline Packages	S-35390A-T8T1G	3D model available Symbol and footprint available 3	1 Download Model
	3539 Keystone Electronics	1	Fuse Holder 4X3AG FUSE 4 FUSES HOLDER	Other	3539	3D model available Symbol and footprint available 3	1 Download Model
	MC0063W0603539K Multicomp Pro	1	MULTICOMP - MC0063W0603539K - RES, THICK FILM, 39K, 5%, 0.063W, 0603	Resistor Chip	MC0063W0603539K	3D model available Symbol and footprint available 3	1 Download Model
	70T3539MS133BC Renesas Electronics	1	The 70T3539M is a high-speed 512K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T353M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.	BGA	70T3539MS133BC	3D model available Symbol and footprint available 3	1 Download Model
	ESQ-135-39-S-S SAMTEC	1	35 Position, Elevated Socket Strip, 0.100" Pitch	Other	ESQ-135-39-S-S	3D model not available Symbol and footprint available 2	1 Download Model
	ESW-135-39-H-D SAMTEC	1	70 Position, .100" Elevated Socket Strip, Double Row	Other	ESW-135-39-H-D	3D model not available Symbol and footprint available 2	1 Download Model
	70T3539MS166BC8 Renesas Electronics	1	The 70T3539M is a high-speed 512K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T353M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.	BGA	70T3539MS166BC8	3D model available Symbol and footprint available 3	1 Download Model
	1-963539-2 TE Connectivity	1	Body Features: Connector & Keying Code C-F \| Primary Product Color Black \| Configuration Features: Number of Positions 18 \| Number of Sections 1 \| Number of Rows 2 \| PCB Mount Orientation Horizontal \| Number of Signal Positions 18 \| Contact Features: Mating Tab Width .025 INCH \| Contact Type Tab \| Mating Tab Thickness .025 INCH \| Mating Tab Width .63 MM \| Mating Tab Thickness .63 MM \| Contact Mating Area Plating Material Tin \| Contact Size .63mm \| Dimensions: Connector Length 38.08 MM \| Profile Height from	Other	1-963539-2	3D model available Symbol and footprint available 3	1 Download Model
	MC0063W0603539R Multicomp Pro	1	MULTICOMP - MC0063W0603539R - RES, THICK FILM, 39R, 5%, 0.063W, 0603	Resistor Chip	MC0063W0603539R	3D model available Symbol and footprint available 3	1 Download Model
	1735397-1 TE Connectivity	1	22 Position SATA Receptacle Connector Solder Through Hole , Contact Finish Gold, Contact Finish Thickness 15.0µin (0.38µm)	Other	1735397-1	3D model available Symbol and footprint available 3	1 Download Model
	ESW-135-39-G-D SAMTEC	1	70 Position, .100" Elevated Socket Strip, Double Row	Other	ESW-135-39-G-D	3D model not available Symbol and footprint available 2	1 Download Model

	SLY303539GECO Fischer Elektronik GmbH & Co. KG	1	male header	Other	SLY303539GECO	3D model available Symbol and footprint available 3	1 Download Model
	1-963539-1 TE Connectivity	1	PCB Mount Header, Horizontal, Wire-to-Board, 18 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Signal, Black	Other	1-963539-1	3D model available Symbol and footprint available 3	1 Download Model
	5353928-2 TE Connectivity	1	Body Features: Shell Plating Finish Bright \| Shell Plating Material Tin \| Connector Profile Standard \| Offset 4 MM \| Configuration Features: Number of Positions 4 \| Panel Ground Location Right/Left \| Number of Mounting Legs 2 \| Number of Ports 1 \| Contact Features: Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Current Rating (Max) 1 AMP \| Dimensions	Other	5353928-2	3D model available Symbol and footprint available 3	1 Download Model
	5353999-1 TE Connectivity	1	40 Position Connector Receptacle, Outer Shroud Contacts Surface Mount Gold	Other	5353999-1	3D model available Symbol and footprint available 3	1 Download Model
	ESQ-135-39-L-D SAMTEC	1	70 Position, Elevated Socket Strip, 0.100" Pitch	Other	ESQ-135-39-L-D	3D model not available Symbol and footprint available 2	1 Download Model
	ESQ-135-39-T-D SAMTEC	1	70 Position, Elevated Socket Strip, 0.100" Pitch	Other	ESQ-135-39-T-D	3D model not available Symbol and footprint available 2	1 Download Model
	ESQ-135-39-G-S SAMTEC	1	35 Position, Elevated Socket Strip, 0.100" Pitch	Other	ESQ-135-39-G-S	3D model not available Symbol and footprint available 2	1 Download Model
	S-35390A-I8T1U ABLIC Inc.	1	IC RTC CLK/CALENDAR I2C SNT-8A	SO Transistor Flat Lead	S-35390A-I8T1U	3D model available Symbol and footprint available 3	1 Download Model
	BD3539FVM ROHM Semiconductor	1	Power Management Specialised - PMIC MEMORY IC REG	Small Outline Packages	BD3539FVM	3D model available Symbol and footprint available 3	1 Download Model
	ESQ-135-39-S-T SAMTEC	1	105 Position, Elevated Socket Strip, 0.100" Pitch	Other	ESQ-135-39-S-T	3D model not available Symbol and footprint available 2	1 Download Model
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