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Q13MC1462000101
Seiko Epson Corporation
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1 | 32.768 kHz ±20ppm Crystal 7pF 65 kOhms 4-SMD, Flat Leads | Other | Q13MC1462000101 |
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1462047-8
TE Connectivity
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1 | IM02IJR=IM RELAY 140 MW 4.5V HCV MOQ Reduction | Other | 1462047-8 |
3
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IM26GR 3-1462039-1
TE Connectivity
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1 | PCB Latching (x2) Relay DPDT, 8A 12Vdc | Other | IM26GR 3-1462039-1 |
3
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IM06DGR 1-1462039-8
TE Connectivity
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1 | TE Connectivity DPDT Non-Latching Relay PCB Mount, 12V dc Coil, 2 A | Other | IM06DGR 1-1462039-8 |
3
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46207-8018
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 18 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-8018 |
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46207-7012
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 12 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-7012 |
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46207-6022
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 22 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-6022 |
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46207-1324
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 24 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-1324 |
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46207-0114
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 14 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-0114 |
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46207-5110
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 10 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5110 |
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46207-1104
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 4 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-1104 |
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46207-4018
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 18 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-4018 |
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AX7PAF4-620.0000C
ABRACON
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1 | XTAL OSC XO 620.0000MHZ LVPECL | Other | AX7PAF4-620.0000C |
3
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46207-0210
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 10 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-0210 |
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AX7PAF4-620.0000T
ABRACON
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1 | XTAL OSC XO 620.0000MHZ LVPECL | Other | AX7PAF4-620.0000T |
3
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AX7MBF4-620.0000
ABRACON
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1 | XTAL OSC XO 620.0000MHZ CML SMD | Other | AX7MBF4-620.0000 |
3
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1462043-3
TE Connectivity
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1 | Relay,DPDT,2A,SMT,5Vdc TE Connectivity DPST-2NO Surface Mount Non-Latching Relay, 5V dc Coil, 2 A General Purpose Relay | Other | 1462043-3 |
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PBSS4620PA-QX
Nexperia
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1 | 20 V, 6 A NPN low VCEsat transistor | Other | PBSS4620PA-QX |
3
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46207-7024
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 24 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-7024 |
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46207-7002
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 2 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-7002 |
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AX5PBF4-620.0000C
ABRACON
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1 | OSC XO 620MHZ 2.5V LVPECL | Other | AX5PBF4-620.0000C |
3
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46207-5218
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 18 Circuits, 1.57mm PCB Thickness, with PCB Pegs, LCP Housing | Other | 46207-5218 |
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46207-4020
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 20 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-4020 |
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46207-6002
Molex
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1 | 4.20mm Pitch, Mini-Fit Jr. Reflow Solder Capable Header, Dual Row, Vertical, 2 Circuits, 1.57mm PCB Thickness, without PCB Pegs, LCP Housing | Other | 46207-6002 |
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734-462/037-000
Wago
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1 | THT female header; straight; Pin spacing 3.5 mm; 2-pole; 100% protected against mismating; Locking lever; 0.9 x 0.9 mm solder pin | Other | 734-462/037-000 |
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