50508 Model Download Search Results
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5050863-3
TE's AMP
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1 | Interconnection Device | 5050863-3 |
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5050863-7
TE's AMP
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1 | Interconnection Device | 5050863-7 |
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5050864-8
TE Connectivity
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1 | Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Base Material Beryllium Copper | Contact Spring Plating Thickness 30 MICIN | Contact Spring Plating Material Tin | Contact Spring Plating Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Dimensions: Socket Length .257 INCH | Wire Size .326 – .518 MMSQ | Mating Pin Diameter Range .66 – | 5050864-8 |
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5050871-6
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Current Rating (Max) 7.5 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Spring Plating Thickness 30 MICIN | Contact Spring Plating Material Tin | Contact Spring Plating Thickness 2.54 MICM | Contact Base Material Beryllium Copper | Dimensions: Socket Length 7.32 MM | PCB Hole Diameter 2.56 MM | Wire Size 18 – 17 | 5050871-6 |
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5050871-8
TE Connectivity
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1 | Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Base Material Beryllium Copper | Contact Current Rating (Max) 7.5 AMP | Contact Spring Plating Material Tin | Contact Spring Plating Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Spring Plating Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) .031 – .125 INCH | PCB Thickness (Recommen | 5050871-8 |
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5050865-6
TE Connectivity
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1 | Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Spring Plating Thickness 30 MICIN | Contact Spring Plating Material Tin | Contact Spring Plating Thickness 2.54 MICM | Contact Current Rating (Max) 6.5 AMP | Dimensions: Socket Length .26 INCH | Wire Size 20 – 18 AWG | PCB Hole Diameter 1.8 | 5050865-6 |
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505081-1
TE Connectivity
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1 | Contact Features: Magnet Wire Terminal Type Dual Blade | Terminal Orientation Flag | Mating Tab Thickness .032 INCH | Terminal Plating Material Tin | Mating Tab Width 6.4 MM | Mating Tab Thickness .81 MM | Mating Tab Width .252 INCH | Dimensions: Magnet Wire Size 22 – 20 AWG | Stock Thickness (Magnet Wire Side) .81 MM | Compatible Insulation Diameter Range .07 INCH | Terminal Height .995 INCH | Product Length 19.94 MM | Stock Thickness (Magnet Wire Side) .032 INCH | Terminal Height 25.27 MM | Compatible I | 505081-1 |
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5050863-5
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 30 MICM | Contact Current Rating (Max) 4 AMP | Contact Spring Plating Thickness .762 MICM | Contact Spring Plating Material Gold | Contact Spring Plating Thickness 30 MICIN | Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: Wire Size .081 †| 5050863-5 |
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50508-8A
ARK-LES Connectors
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1 | Fork Terminal | 50508-8A |
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5050863-3
TE Connectivity
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1 | Interconnection Device | 5050863-3 |
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5050864-6
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Spring Plating Material Tin | Contact Base Material Beryllium Copper | Contact Spring Plating Thickness 100 MICIN | Contact Spring Plating Thickness 30 MICIN | Dimensions: PCB Hole Diameter 1.57 MM | Wire Size 22 – 20 AWG | Socket Length .257 INCH | Socket Len | 5050864-6 |
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5050871-5
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness .762 MICM | Contact Base Material Beryllium Copper | Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 7.5 AMP | Contact Spring Plating Material Gold | Dimensions: Wire Size .823 | 5050871-5 |
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5050865-1
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness 30 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Spring Plating Thickness 30 MICIN | Contact Spring Plating Thickness .762 MICM | Contact Base Material Beryllium Copper | Contact Spring Plating Material Gold | Contact Current Rating (Max) 6.5 AMP | Dimensions: Mating Pin Diam | 5050865-1 |
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5050865-7
TE Connectivity
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1 | Body Features: Sleeve Plating Material Tin | Sleeve Material Copper | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Base Material Beryllium Copper | Contact Current Rating (Max) 6.5 AMP | Contact Spring Plating Thickness 30 MICIN | Contact Spring Plating Material Tin | Dimensions: Mating Pin Diameter Range .034 – .041 INCH | Wire Size 20 – 18 AWG | | 5050865-7 |
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5050865-8
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness 2.54 MICM | Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Spring Plating Thickness 30 MICIN | Contact Spring Plating Material Tin | Contact Current Rating (Max) 6.5 AMP | Dimensions: PCB Thickness (Recommended) .79 – 3.18 MM | Wire Size 20 – 18 AWG | | 5050865-8 |
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7.010MHZHC49/T/50/5/0/8PF/ATF
Euroquartz Ltd
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1 | Parallel - Fundamental Quartz Crystal, 7.01MHz Nom | 7.010MHZHC49/T/50/5/0/8PF/ATF |
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GP50508871BLFLTR
TT Electronics Resistors
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1 | Fixed Resistor, Metal Film, 0.125W, 8870ohm, 200V, 0.1% +/-Tol, 50ppm/Cel, Through Hole Mount | GP50508871BLFLTR |
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GP50508451CBLK
TT Electronics Resistors
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1 | Fixed Resistor, Metal Film, 0.125W, 8450ohm, 200V, 0.25% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED, LEAD FREE | GP50508451CBLK |
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GP50508160CBLK
TT Electronics Resistors
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1 | Fixed Resistor, Metal Film, 0.125W, 816ohm, 200V, 0.25% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED, LEAD FREE | GP50508160CBLK |
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YK50508300J0G
Amphenol FCi
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1 | Barrier Strip Terminal Block | YK50508300J0G |
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395250508
Molex
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1 | Strip Terminal Block, 15A, 1 Row(s), 1 Deck(s) | 395250508 |
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GP50508062DLFLTR
TT Electronics Resistors
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1 | Fixed Resistor, Metal Film, 0.125W, 80600ohm, 200V, 0.5% +/-Tol, 50ppm/Cel, Through Hole Mount | GP50508062DLFLTR |
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250508-20
Aries Electronics Inc
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1 | IC SOCKET | 250508-20 |
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LPS5050-825MQC
Coilcraft Inc
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1 | General Purpose Inductor, 8200uH, 20%, 1 Element, Ferrite-Core, SMD, 1919 | LPS5050-825MQC |
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EM250508H
Eaton Corporation
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1 | Strip Terminal Block, 15A, 1 Row(s), 1 Deck(s) | EM250508H |
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