9-173 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	0559173650 Molex	1	MicroClasp Vertical Header, 2.00mm Pitch, Dual Row, Through Hole, Gold Flash (Au) Plating, 36 Circuits, without PCB Locator	Other	0559173650	3D model available Symbol and footprint available 3	1 Download Model
	55917-3010 Molex	1	Headers & Wire Housings 30 Ckt Vert. Header , UL94 V-0 , 3 A , UL 94 V-0 , 250 V	Other	55917-3010	3D model available Symbol and footprint available 3	1 Download Model
	55917-3030 Molex	1	Headers & Wire Housings 2.0 WtB Dual Con Dip Plg Hsg Assy 30 Ckt	Other	55917-3030	3D model available Symbol and footprint available 3	1 Download Model
	1-917338-2 TE Connectivity	1	PCB Mount Header, Vertical, Wire-to-Board, 4 Position, 5.08 mm [.2 in] Centerline, Fully Shrouded, Gold (Au), Dynamic 3000 Series	Other	1-917338-2	3D model available Symbol and footprint available 3	1 Download Model

	1-917338-5 TE Connectivity	1	Connector Header Through Hole 4 position 0.200" (5.08mm)	Other	1-917338-5	3D model available Symbol and footprint available 3	1 Download Model
	0559173850 Molex	1	MicroClasp Vertical Header, 2.00mm Pitch, Dual Row, Through Hole, Gold Flash (Au) Plating, 38 Circuits, without PCB Locator	Other	0559173850	3D model available Symbol and footprint available 3	1 Download Model
	1809173 Phoenix Contact	1	MSTBA 2,5/12-G-5,08-LR - PCB headers, nominal cross section: 2.5 mm², color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 12, number of rows: 1, number of positions: 12, number of connections: 12, product range: MSTBA 2,5/..-G-LR, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.23 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connecto	Other	1809173	3D model available Symbol and footprint available 3	1 Download Model
	0559173250 Molex	1	MicroClasp Vertical Header, 2.00mm Pitch, Dual Row, Through Hole, Gold Flash (Au) Plating, 32 Circuits, without PCB Locator	Other	0559173250	3D model available Symbol and footprint available 3	1 Download Model
	9173B-01CS08LF Renesas Electronics	1	The 9173B provide the analog PLL circuit blocks to implement a frequency multiplier. Because the device is configured to use an external divider in the PLL clock feedback path, a large divider can be used to result in a large frequency multiplication ratio. This is useful when using a low frequency input clock to generate a high frequency output clock. The 9173B contains a phase detector, charge pump, loop filter, and voltage-controlled oscillator (VCO). The 674-01 can be used as the external feedback divid	Small Outline Packages	9173B-01CS08LF	3D model available Symbol and footprint available 3	1 Download Model
	2-917337-2 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: PCB Mount Orientation Vertical \| Number of Positions 2 \| Number of Rows 1 \| Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN \| Contact Current Rating (Max) 15 AMP \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .38 MICM \| Contact Type Pin \| Housing Features: Centerline (Pitch) .2 INCH \| Centerline (Pitch) 5.08 MM \| Housing Material Polyester GF \| Industry Standards: UL F	Other	2-917337-2	3D model available Symbol and footprint available 3	1 Download Model
	0559173450 Molex	1	MicroClasp Vertical Header, 2.00mm Pitch, Dual Row, Through Hole, Gold Flash (Au) Plating, 34 Circuits, without PCB Locator	Other	0559173450	3D model available Symbol and footprint available 3	1 Download Model
	9-173396-3 TE Connectivity	1	Interconnection Device		9-173396-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173494-2 TE Connectivity	1	Interconnection Device		9-173494-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173489-5 TE Connectivity	1	Interconnection Device		9-173489-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173485-2 TE Connectivity	1	Interconnection Device		9-173485-2	3D model not available Symbol and footprint not available 0	0 Build or Request

	9-173396-5 TE Connectivity	1	Interconnection Device		9-173396-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173499-9 TE Connectivity	1	Interconnection Device		9-173499-9	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173484-8 TE's AMP	1	Interconnection Device		9-173484-8	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173392-9 TE Connectivity	1	Interconnection Device		9-173392-9	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173386-6 TE Connectivity	1	Interconnection Device		9-173386-6	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173485-8 TE's AMP	1	Interconnection Device		9-173485-8	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173393-0 TE Connectivity	1	Interconnection Device		9-173393-0	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173494-4 TE Connectivity	1	Interconnection Device		9-173494-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173392-0 TE's AMP	1	INTERCONNECTION DEVICE		9-173392-0	3D model not available Symbol and footprint not available 0	0 Build or Request
	9-173395-1 TE Connectivity	1	Interconnection Device		9-173395-1	3D model not available Symbol and footprint not available 0	0 Build or Request
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