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3-1589462-1
TE Connectivity
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1 | Receptacle, Wire-to-Board, 15 Position, .64 mm [.025 in] Centerline, Printed Circuit Board, Power, Microminiature & Nanominiature D Connectors | Other | 3-1589462-1 |
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3-794626-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact | Other | 3-794626-4 |
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TLE4946-2L
Infineon
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1 | Infineon TLE4946-2L, Latch Hall Effect Sensor Latch 3-Pin SSO, 2.7 → 18 V | Other | TLE4946-2L |
3
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TLE49462KHTSA1
Infineon
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1 | Board Mount Hall Effect / Magnetic Sensors HALLEFFECT IC'S | SOT23 (3-Pin) | TLE49462KHTSA1 |
3
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5-794620-4
TE Connectivity
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1 | Connector Header Through Hole, Right Angle 24 position 0.118" (3.00mm) | Other | 5-794620-4 |
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3-794620-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Conta | Other | 3-794620-2 |
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5-794629-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 24 | Number of Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plat | Other | 5-794629-4 |
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5-794626-0
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 20 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Surface Mount, Power, Micro MATE-N-LOK | Other | 5-794626-0 |
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5-794628-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Platin | Other | 5-794628-0 |
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3-794627-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Contact Features: Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | | Other | 3-794627-8 |
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2322946-2
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 6 Position, 6.35 mm [.25 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Orange, Tray | Other | 2322946-2 |
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4-794627-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 14 | Number of Rows 2 | Number of Positions 14 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact C | Other | 4-794627-4 |
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MAL205946221E3
Vishay
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1 | Aluminum Electrolytic Capacitors - Snap In 220 F 400V 30x50mm 105 C 10000h | Other | MAL205946221E3 |
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TLI4946-2K
Infineon
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1 | Infineon TLI4946-2K, Latch Hall Effect Sensor Latch 3-Pin SC-59, 2.7 → 18 V | SOT23 (3-Pin) | TLI4946-2K |
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TLE49462LHALA1
Infineon
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1 | Board Mount Hall Effect / Magnetic Sensors High Precision Hall Effect Latch | Other | TLE49462LHALA1 |
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BQ294624DRVT
Texas Instruments
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1 | TEXAS INSTRUMENTS - BQ294624DRVT - Li-Ion, Over Voltage Protector, 4.45V, 6.5s Delay, 1 Cell, 3V to 8V, WSON-6 | Small Outline No-lead | BQ294624DRVT |
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4-794629-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 16 | PCB Mount Orientation Right Angle | Number of Positions 16 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Conta | Other | 4-794629-6 |
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4-794620-8
TE Connectivity
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1 | 18P MICRO MNL ASSY,R/A,HDR,LF | Other | 4-794620-8 |
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4-794620-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 10 | Number of Power Positions 10 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material T | Other | 4-794620-0 |
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3-794627-2
TE Connectivity
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1 | Connector Header Surface Mount, Right Angle 2 position | Other | 3-794627-2 |
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4-794629-2
TE Connectivity
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1 | Configuration Features: Number of Positions 12 | Number of Power Positions 12 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact | Other | 4-794629-2 |
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1779462
Phoenix Contact
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1 | MCV 1,5/ 7-G-3,5 P26 THR - PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 7, number of rows: 1, number of positions: 7, number of connections: 7, product range: MCV 1,5/..-G-THR, pitch: 3.5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin | Other | 1779462 |
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3-794629-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 8 | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Con | Other | 3-794629-8 |
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5645946-2
TE Connectivity
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1 | Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 4 AMP | Contact Spring Plating Material Gold | Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 30 MICM | Contact Spring Plating Thickness .762 MICM | Dimensions: Mating Pin Diamet | Other | 5645946-2 |
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3-794620-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | PCB Contact Terminat | Other | 3-794620-6 |
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