DICF- Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Prices / Stock	Model	Action
	DICF-16C Japan Aviation Electronics Industry Limited	1	IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-16C	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-16AS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-16AS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-24A Japan Aviation Electronics Industry Limited	1	IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-24A	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-16A Japan Aviation Electronics Industry Limited	1	IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-16A	3D model not available Symbol and footprint not available 0	0 Build or Request

	DICF-20AS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP20, 20 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-20AS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-28C Japan Aviation Electronics Industry Limited	1	IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-28C	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-28A Japan Aviation Electronics Industry Limited	1	IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-28A	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-40AS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-40AS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-24CS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-24CS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-16CS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-16CS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-28CS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-28CS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-22C Japan Aviation Electronics Industry Limited	1	IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder	DICF-22C	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-18AS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-18AS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-42C Japan Aviation Electronics Industry Limited	1	IC Socket, DIP42, 42 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-42C	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-42CS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP42, 42 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-42CS	3D model not available Symbol and footprint not available 0	0 Build or Request

	CL32C4R7DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 10.6383% +Tol, 10.6383% -Tol, C0G, 30ppm/Cel TC, 0.0000047uF, Surface Mount, 1210	CL32C4R7DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL32P2R7DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 18.5185% +Tol, 18.5185% -Tol, P2H, -150ppm/Cel TC, 0.0000027uF, Surface Mount, 1210	CL32P2R7DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL55T020DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 25% +Tol, 25% -Tol, T2H, -470ppm/Cel TC, 0.000002uF, Surface Mount, 2220	CL55T020DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL43S5R6DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 8.9286% +Tol, 8.9286% -Tol, S2H, -330ppm/Cel TC, 0.0000056uF, Surface Mount, 1812	CL43S5R6DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	X3DICFDANF-40.000000 Taitien Electronics Co Ltd	1	Parallel - Fundamental Quartz Crystal, 40MHz Nom	X3DICFDANF-40.000000	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL43SR91DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 54.9451% +Tol, 54.9451% -Tol, S2H, -330ppm/Cel TC, 0.00000091uF, Surface Mount, 1812	CL43SR91DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	1933R-B-DI-C-FA-03-N EMCORE Corporation	1	DFB Laser Diode Emitter, 1300nm Min, 1320nm Max, FC/APC Connector, Panel Mount, Through Hole Mount	1933R-B-DI-C-FA-03-N	3D model not available Symbol and footprint not available 0	0 Build or Request
	1933W-B-DI-C-FA-09-N EMCORE Corporation	1	DFB Laser Diode Emitter	1933W-B-DI-C-FA-09-N	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL55P3R9DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 12.8205% +Tol, 12.8205% -Tol, P2H, -150ppm/Cel TC, 0.0000039uF, Surface Mount, 2220	CL55P3R9DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL43P1R6DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 31.25% +Tol, 31.25% -Tol, P2H, -150ppm/Cel TC, 0.0000016uF, Surface Mount, 1812	CL43P1R6DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
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