DICF- Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Prices / Stock	Model	Action
	DICF-16AS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-16AS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-16C Japan Aviation Electronics Industry Limited	1	IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-16C	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-16A Japan Aviation Electronics Industry Limited	1	IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-16A	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-24A Japan Aviation Electronics Industry Limited	1	IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-24A	3D model not available Symbol and footprint not available 0	0 Build or Request

	DICF-28C Japan Aviation Electronics Industry Limited	1	IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-28C	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-20AS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP20, 20 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-20AS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-22C Japan Aviation Electronics Industry Limited	1	IC Socket, DIP22, 22 Contact(s), 2.54mm Term Pitch, 10.16mm Row Spacing, Solder	DICF-22C	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-28CS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-28CS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-16CS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-16CS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-24CS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-24CS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-40AS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP40, 40 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-40AS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-28A Japan Aviation Electronics Industry Limited	1	IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-28A	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-18AS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder	DICF-18AS	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-42C Japan Aviation Electronics Industry Limited	1	IC Socket, DIP42, 42 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-42C	3D model not available Symbol and footprint not available 0	0 Build or Request
	DICF-42CS Japan Aviation Electronics Industry Limited	1	IC Socket, DIP42, 42 Contact(s), 2.54mm Term Pitch, 15.24mm Row Spacing, Solder	DICF-42CS	3D model not available Symbol and footprint not available 0	0 Build or Request

	CL55R100DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 5% +Tol, 5% -Tol, R2H, -220ppm/Cel TC, 0.00001uF, Surface Mount, 2220	CL55R100DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL43R6R2DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 8.0645% +Tol, 8.0645% -Tol, R2H, -220ppm/Cel TC, 0.0000062uF, Surface Mount, 1812	CL43R6R2DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL55C030DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 16.6667% +Tol, 16.6667% -Tol, C0G, 30ppm/Cel TC, 0.000003uF, Surface Mount, 2220	CL55C030DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL55S030DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 16.6667% +Tol, 16.6667% -Tol, S2H, -330ppm/Cel TC, 0.000003uF, Surface Mount, 2220	CL55S030DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	1933R-B-DI-C-FA-03-N EMCORE Corporation	1	DFB Laser Diode Emitter, 1300nm Min, 1320nm Max, FC/APC Connector, Panel Mount, Through Hole Mount	1933R-B-DI-C-FA-03-N	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL55R1R6DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 31.25% +Tol, 31.25% -Tol, R2H, -220ppm/Cel TC, 0.0000016uF, Surface Mount, 2220	CL55R1R6DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL43RR56DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 89.2857% +Tol, 89.2857% -Tol, R2H, -220ppm/Cel TC, 0.00000056uF, Surface Mount, 1812	CL43RR56DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL55CR91DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 54.9451% +Tol, 54.9451% -Tol, C0G, 30ppm/Cel TC, 0.00000091uF, Surface Mount, 2220	CL55CR91DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	CL43C4R7DICF Samsung Electro-Mechanics	1	Ceramic Capacitor, Multilayer, Ceramic, 1000V, 10.6383% +Tol, 10.6383% -Tol, C0G, 30ppm/Cel TC, 0.0000047uF, Surface Mount, 1812	CL43C4R7DICF	3D model not available Symbol and footprint not available 0	0 Build or Request
	FP-D-830-1DI-C-F Laser Components USA Inc	1	Laser Diode Module Emitter	FP-D-830-1DI-C-F	3D model not available Symbol and footprint not available 0	0 Build or Request
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