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74LCX541MTCX
onsemi
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1 | 6.5 ns tPD max (VCC = 3.3V), 10 µA ICC max; Implements patented noise/ EMI reduction circuitry; Power-down high impedance inputs and outputs; Leadless Pb-Free DQFN package; ±24 mA output drive (VCC = 3.0V); Supports live insertion/withdrawal (Note 1); ESD performance: Human body model > 2000V Machine model > 200V; 2.3V-3.6V VCC specifications provided; 5V tolerant input and outputs; Latch-up performance exceeds JEDEC 78 conditions | Small Outline Packages | 74LCX541MTCX |
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74LCX16244MTDX
onsemi
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1 | Power down high impedance inputs and outputs; ±24 mA output drive (VCC = 3.0V); 5V tolerant inputs and outputs; Latch-up performance exceeds 500 mA; 2.3V to 3.6V VCC specifications provided; Uses patented noise/EMI reduction circuitry; 4.5 ns tPD max, 10 µA ICCQ max; ESD performance: Human body model > 2000V Machine model > 200V; Supports live insertion/withdrawal (Note 1); Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) | Small Outline Packages | 74LCX16244MTDX |
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74AHC32T14-13
Diodes Incorporated
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1 | • Wide Supply Voltage Range from 2.0V to 5.5V\r\n• Outputs Sink or Source 8mA at VCC = 4.5V\r\n• CMOS Low Power Consumption\r\n• Schmitt Trigger Action at All Inputs\r\n• Inputs can be driven by 3.3V or 5.5V allowing for voltage\r\ntranslation applications.\r\n• ESD Protection Exceeds JESD 22\r\n 200-V Machine Model (A115-A)\r\n 2000-V Human Body Model (A114-A)\r\n Exceeds 1000-V Charged Device Model (C101C)\r\n• Latch-Up Exceeds 250mA per JESD 78, Class II\r\n• Range of Package Options SO-14 and TSSOP-14\r\n• Totally Lead-Free | Small Outline Packages | 74AHC32T14-13 |
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MMSZ5244B-HE3_A-08
Vishay
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1 | • Silicon planar Zener diodes\r\n• Standard Zener voltage tolerance is ± 5 %\r\nwith a “B” suffix (e.g.: MMSZ5225B), suffix “C”\r\nis ± 2 % tolerance\r\n• AEC-Q101 qualified available\r\n• ESD capability according to AEC-Q101:\r\nHuman body model > 8 kV\r\nMachine model > 800 V\r\n• Base P/N-E3 - RoHS-compliant, commercial grade\r\n• Base P/N-HE3_A - RoHS-compliant, AEC-Q101 qualified\r\n• Material categorization: for definitions of compliance\r\nplease see www.vishay.com/doc?99912 | Small Outline Diode | MMSZ5244B-HE3_A-08 |
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BZT52B30-V-GS08
Vishay
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1 | • Silicon planar Zener diodes • The Zener voltages are graded according to the international E24 standard • AEC-Q101 qualified available • ESD capability according to AEC-Q101: Human body model > 8 kV Machine model > 800 V • Base P/N-E3 - RoHS-compliant, commercial grade • Base P/N-HE3 - RoHS-compliant, AEC-Q101 qualified • Material categorization: for definitions of compliance | Small Outline Diode | BZT52B30-V-GS08 |
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MBR140SFT1G
onsemi
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1 | Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8 inch; Package Designed for Optimal Automated Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; All Packages are Pb-Free; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements | Small Outline Diode Flat Lead | MBR140SFT1G |
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MC74LCX138DR2G
onsemi
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1 | 5V Tolerant Inputs - Interface Capability With 5V TTL Logic; LVTTL Compatible; 24mA Balanced Output Sink and Source Capability; Near Zero Static Supply Current (10mA) Substantially Reduces System Power Requirements; Designed for 2.3 V to 3.6 V VCC Operation; ESD Performance: Human Body Model >2000V; Machine Model >200V; Latchup Performance Exceeds 500mA; LVCMOS Compatible; Pb-Free Packages are Available* | Small Outline Packages | MC74LCX138DR2G |
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NUP4060AXV6T1G
onsemi
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1 | Protects up to 4 Lines in a Single SOT-563 Package; ESD Rating: IEC61000-4-2: Level 4, Contact (8 kV), Air (15 kV); Human Body Model (HMB); Class 3B, Machine Model (MM); 400V; VCC Pin = 16 V Protection, D1, D2, and D3 Pins =6.8 V Protection; Low Capacitance (< 7 pF @ 3 V) for D1, D2, and D3; This is a Pb-Free Device | SO Transistor Flat Lead | NUP4060AXV6T1G |
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MC74LCX00DTR2G
onsemi
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1 | ESD Performance: Human Body Model >2000V; Machine Model >200V; Near Zero Static Supply Current (10mA) Substantially Reduces System Power Requirements; 24mA Balanced Output Sink and Source Capability; Designed for 2.3 to 3.6V VCC Operation; LVCMOS Compatible; Latchup Performance Exceeds 500mA; 5V Tolerant Inputs - Interface Capability With 5V TTL Logic; LVTTL Compatible | Small Outline Packages | MC74LCX00DTR2G |
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MMBTA06WT1G
onsemi
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1 | Moisture Sensitivity Level: 1; ESD Rating: Human Body Model - 4 kV Machine Model - 400 V; Pb-Free Package May be Available. The G-Suffix Denotes a Pb-Free Lead Finish; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable | SOT23 (3-Pin) | MMBTA06WT1G |
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NRVB140SFT1G
onsemi
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1 | Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Temperature; Epoxy Meets UL94, VO at 1/8 inch; Package Designed for Optimal Automated Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; All Packages are Pb-Free; AEC-Q101 Qualified and PPAP Capable; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements | Other | NRVB140SFT1G |
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74LCX821MTCX
onsemi
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1 | Implements patented noise/EMI reduction circuitry; Power-down high impedance inputs and outputs; Supports live insertion/withdrawal (Note 1); 7.0 ns tPD max (VCC = 3.3V), 10 µA ICC max; Latch-up performance exceeds 500 mA; ±24 mA output drive (VCC = 3.0V); 2.3V-3.6V VCC specifications provided; 5V tolerant inputs and outputs; ESD performance: Human Body Model > 2000V Machine Model > 200V | Small Outline Packages | 74LCX821MTCX |
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MBR120LSFT3G
onsemi
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1 | Guardring for Stress Protection; Low Forward Voltage; 125 C Operating Junction Tamperature; Epoxy Meets UL94, VO at 1/8 inch; Package Designed for Optimal Automated Board Assembly; ESD Ratings: Machine Model = C, Human Body Model = 3B; All Packages are Pb-Free; NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable | Small Outline Diode Flat Lead | MBR120LSFT3G |
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74LCX32BQX
onsemi
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1 | 5.5 ns tPD max (VCC = 3.3V), 10 µA ICC max; ESD performance:Human body model > 2000VMachine model > 150V; 5V tolerant inputs; Implements patented noise/EMI reduction circuitry; Leadless Pb-Free DQFN package; 2.3V-3.6V VCC specifications provided; ±24 mA output drive (VCC = 3.0V); Latch-up performance exceeds JEDEC 78 conditions; Power down high impedance inputs and outputs | Other | 74LCX32BQX |
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FDC6321C
onsemi
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1 | N-Ch 25 V, 0.68 A, RDS(ON) = 0.45 Ω @ VGS= 4.5 V; Replace multiple dual NPN & PNP digital transistors.; Very low level gate drive requirements allowing direct operation in 3 V circuits. VGS(th) < 1.0V.; P-Ch -25 V, -0.46 A, RDS(ON) = 1.1 Ω @ VGS= -4.5 V.; Gate-Source Zener for ESD ruggedness. >6kV Human Body Model | Small Outline Packages | FDC6321C |
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RFD14N05LSM
onsemi
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1 | Can be Driven Directly from CMOS, NMOS, andTTL Circuits; Peak Current vs Pulse Width Curve; 14A, 50V; Related Literature - TB334 “Guidelines for Soldering Surface MountComponents to PC Boards”; rDS(ON)= 0.100Ω; 175°C Operating Temperature; UIS Rating Curve; Temperature Compensating PSPICE® Model | Other | RFD14N05LSM |
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SNUP2114UCMR6T1G
onsemi
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1 | Low Capacitance 0.8 pF; AECQ101 Qualified and PPAP Capable SNUP2114; Low Clamping Voltage; Stand Off Voltage: 5 V; Low Leakage; ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model and Class C (Exceeding 400 V) per Machine Model; Protection for the Following IEC Standards: IEC 6100042 Level 4 ESD Protection; UL Flammability Rating of 94 V0; This is a PbFree Device; S prefix for automotive and other applications requiring unique site and control change requirements | Small Outline Packages | SNUP2114UCMR6T1G |
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MMBZ5245BLT1G
onsemi
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1 | 225 mW Rating on FR-4 or FR-5 Board; Zener Voltage Range - 2.4 V to 91 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMABILITY RATING: | SOT23 (3-Pin) | MMBZ5245BLT1G |
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SMF05CT2G
onsemi
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1 | Protects up to 5 Lines in a Single SC-88 Package; Peak Power Dissipation - 100W (8x20 µ Waveform); ESD Rating of Class 3B (Exceeding 8 kV) per Human Body Model and Class C (Exceeding 400 V) per Machine Model; Compliance with IEC 61000-4-2 (ESD) 15 kV (Air), 8 kV (Contact); UL Flammability Rating of 94V-0; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements | SOT23 (6-Pin) | SMF05CT2G |
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MMBZ5242BLT3G
onsemi
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1 | 225 mW Rating on FR-4 or FR-5 Board; Zener Voltage Range - 2.4 V to 91 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMABILITY RATING: | SOT23 (3-Pin) | MMBZ5242BLT3G |
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MMSZ5250BT1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA | Small Outline Diode | MMSZ5250BT1G |
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MM3Z12VST1G
onsemi
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1 | Standard Zener Breakdown Voltage Range - 2.4 V to 75 V; Steady State Power Rating of 300 mW; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics:; Tight Tolerance ; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; FLAMMABILITY RATING: UL94 V-0; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant; AEC-Q101 Qualified and PPAP Capable ; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements | Small Outline Diode | MM3Z12VST1G |
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MMSZ12T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | MMSZ12T1G |
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MMSZ4689T1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit | Small Outline Diode | MMSZ4689T1G |
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MMSZ5240BT3G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA | Small Outline Diode | MMSZ5240BT3G |
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