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82726 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
G8272620111 Amphenol Corporation
1 Board Connector G8272620111 0 Build or Request
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G8272621311LF Amphenol Corporation
1 Board Connector G8272621311LF 0 Build or Request
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AI827-26030 Amphenol Corporation
1 Board Connector, 42 Contact(s), 7 Row(s), Male, Right Angle, Press Fit Terminal, Locking, Black Insulator AI827-26030 0 Build or Request
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G8272620101EU Amphenol Corporation
1 Board Connector G8272620101EU 0 Build or Request
Part Image Part Image
G8272610211LF Amphenol Corporation
1 Board Connector G8272610211LF 0 Build or Request
Part Image Part Image 1 Board Connector 10121750-1827265LF 0 Build or Request
Part Image Part Image
G8272621011EU Amphenol Corporation
1 Board Connector G8272621011EU 0 Build or Request
Part Image Part Image 1 Board Connector, 26 Contact(s), 2 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Locking, Black Insulator 10122282-726010TLF 0 Build or Request
Part Image Part Image
JI827-26A00 Amphenol Corporation
1 Board Connector, 42 Contact(s), 7 Row(s), Male, Right Angle, Press Fit Terminal, Locking, Black Insulator JI827-26A00 0 Build or Request
Part Image Part Image
2-827261-3 TE Connectivity
0 Body Features: Primary Product Color Green | Configuration Features: Number of Positions 23 | Number of Rows 1 | Board-to-Board Configuration Parallel | PCB Mount Orientation Vertical | Contact Features: Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 31.49 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .8 MICM | Dimensions: PCB Thickness (Recommended) 1.4 MM | PCB Thickness 2-827261-3 0 Build or Request
Part Image Part Image
2-827261-7 TE Connectivity
0 Body Features: Primary Product Color Green | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Board-to-Board Configuration Parallel | Number of Positions 27 | Contact Features: Contact Mating Area Plating Material Thickness 31.49 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .8 MICM | Contact Type Pin | Dimensions: PCB Thickness (Recommended) 1.4 MM | PCB Thickness 2-827261-7 0 Build or Request
Part Image Part Image
4-827261-9 TE Connectivity
0 Body Features: Primary Product Color Green | Configuration Features: Number of Positions 49 | PCB Mount Orientation Vertical | Number of Rows 1 | Board-to-Board Configuration Parallel | Contact Features: Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 31.49 MICIN | Contact Mating Area Plating Material Thickness .8 MICM | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.4 MM | PCB Thickness 4-827261-9 0 Build or Request
Part Image Part Image 0 B82726E6203B41 0 Build or Request
Part Image Part Image 0 B82726E6333B40 0 Build or Request
Part Image Part Image 0 MP8-782726 0 Build or Request
Part Image Part Image
77311-827-26LF Amphenol Communications Solutions
1 BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch. 77311-827-26LF 0 Build or Request
Part Image Part Image
1-827261-3 TE Connectivity
0 Body Features: Primary Product Color Green | Configuration Features: Number of Rows 1 | Board-to-Board Configuration Parallel | Number of Positions 13 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 31.49 MICIN | Contact Mating Area Plating Material Thickness .8 MICM | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Dimensions: PCB Thickness (Recommended) .055 INCH | PCB Thickn 1-827261-3 0 Build or Request
Part Image Part Image 0 B82726S2363N040 0 Build or Request
Part Image Part Image
7827269 PRO POWER
0 7827269 0 Build or Request
Part Image Part Image
3-827261-8 TE Connectivity
0 Body Features: Primary Product Color Green | Configuration Features: Number of Positions 38 | Number of Rows 1 | PCB Mount Orientation Vertical | Board-to-Board Configuration Parallel | Contact Features: Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .8 MICM | Contact Mating Area Plating Material Thickness 31.49 MICIN | Dimensions: PCB Thickness (Recommended) 1.4 MM | PCB Thickness 3-827261-8 0 Build or Request
Part Image Part Image
7827268 PRO POWER
0 7827268 0 Build or Request
Part Image Part Image
G8272610010 Amphenol Corporation
1 Board Connector, 26 Contact(s), 1 Row(s), Female, Straight, Solder Terminal, Socket, G8272610010 0 Build or Request
Part Image Part Image
G8272611211EU Amphenol Corporation
1 Board Connector G8272611211EU 0 Build or Request
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G8272620211 Amphenol Corporation
1 Board Connector G8272620211 0 Build or Request
Part Image Part Image
75914-827-26 Amphenol Communications Solutions
1 Board Connector, 26 Contact(s), 2 Row(s), Male, Straight, Solder Terminal, 75914-827-26 0 Build or Request
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