18278 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	1-827872-5 TE Connectivity	1	15P MOD1 UNSHRD HDR, P 5.08, ST, 0.8 Au		1-827872-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-827874-7 TE Connectivity	1	CONNECTOR, 17 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER		1-827874-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1514V18-278BZXI Cypress Semiconductor	1	QDR SRAM, 2MX36, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165		CY7C1514V18-278BZXI	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-1827863-4 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: Number of Positions 28 \| Number of Rows 2 \| Dimensions: Row-to-Row Spacing 3.3 MM \| Row-to-Row Spacing .129 INCH \| Housing Features: Centerline (Pitch) .079 INCH \| Centerline (Pitch) 2 MM \| Mechanical Attachment: Connector Mounting Type Cable Mount (Free-Hanging) \| Mating Retention With \| Operation/Application: Circuit Application Signal \| Product Type Features: Connector & Housing Type Receptacle \| Sealable No \| Connector System Wire-to-B		1-1827863-4	3D model not available Symbol and footprint not available 0	0 Build or Request

	2-1827875-6 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: Number of Positions 12 \| PCB Mount Orientation Vertical \| Number of Rows 2 \| Contact Features: Contact Type Pin \| Contact Mating Area Plating Material Gold \| Contact Current Rating (Max) 5 AMP \| Contact Mating Area Plating Material Thickness .38 MICM \| Contact Mating Area Plating Material Thickness 15 MICIN \| Housing Features: Centerline (Pitch) .099 INCH \| Housing Material Polyester GF \| Centerline (Pitch) 2.5 MM \| Industry Standards: UL		2-1827875-6	3D model not available Symbol and footprint not available 0	0 Build or Request
	2-1827875-8 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: PCB Mount Orientation Vertical \| Number of Positions 16 \| Number of Rows 2 \| Contact Features: Contact Type Pin \| Contact Mating Area Plating Material Thickness 15 MICIN \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness .38 MICM \| Contact Current Rating (Max) 5 AMP \| Housing Features: Centerline (Pitch) .099 INCH \| Centerline (Pitch) 2.5 MM \| Housing Material Polyester GF \| Industry Standards: UL		2-1827875-8	3D model not available Symbol and footprint not available 0	0 Build or Request
	10121750-0818278LF Amphenol FCi	1	Board Connector		10121750-0818278LF	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1917CV18-278BZC Cypress Semiconductor	1	DDR SRAM, 2MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165		CY7C1917CV18-278BZC	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-827875-5 TE Connectivity	1	CONNECTOR, 15 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER		1-827875-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-1827875-5 TE Connectivity	1	Header,vert 10w,Tab 2.5mm,X-key,1200D	Other	1-1827875-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1415BV18-278BZI Cypress Semiconductor	1	QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, M0-216, FBGA-165		CY7C1415BV18-278BZI	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-1827876-3 TE Connectivity	1	Header horiz 6 way 2 row TAB 2.5mm D-1	Other	1-1827876-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-1827876-3 TE Connectivity	1	Header horiz 6 way 2 row TAB 2.5mm D-1	Other	1-1827876-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-827872-7 TE's AMP	1	17 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER		1-827872-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-827875-9 TE Connectivity	1	CONNECTOR, 19 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER		1-827875-9	3D model not available Symbol and footprint not available 0	0 Build or Request

	CY7C1424AV18-278BZXI Cypress Semiconductor	1	DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165		CY7C1424AV18-278BZXI	3D model not available Symbol and footprint not available 0	0 Build or Request
	4-1618278-2 TE Connectivity	1	POWER/SIGNAL RELAY, SPST, MOMENTARY, 26.5VDC (COIL), 50A (CONTACT), PANEL MOUNT		4-1618278-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-1827876-6 TE Connectivity	1	Header horiz 12 way 2 row TAB 2.5mm D-1	Other	1-1827876-6	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1319BV18-278BZI Cypress Semiconductor	1	DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165		CY7C1319BV18-278BZI	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-1827863-2 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: Number of Positions 24 \| Number of Rows 2 \| Dimensions: Row-to-Row Spacing 3.3 MM \| Row-to-Row Spacing .129 INCH \| Housing Features: Centerline (Pitch) .079 INCH \| Centerline (Pitch) 2 MM \| Mechanical Attachment: Mating Retention With \| Connector Mounting Type Cable Mount (Free-Hanging) \| Operation/Application: Circuit Application Signal \| Product Type Features: Connector & Housing Type Receptacle \| Connector Product Type Housing \| Connect		1-1827863-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1311CV18-278BZXI Cypress Semiconductor	1	QDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165		CY7C1311CV18-278BZXI	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1513V18-278BZI Cypress Semiconductor	1	QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165		CY7C1513V18-278BZI	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1916CV18-278BZXI Cypress Semiconductor	1	DDR SRAM, 2MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165		CY7C1916CV18-278BZXI	3D model not available Symbol and footprint not available 0	0 Build or Request
	CY7C1523V18-278BZI Cypress Semiconductor	1	DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165		CY7C1523V18-278BZI	3D model not available Symbol and footprint not available 0	0 Build or Request
	1-827875-0 TE's AMP	1	10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, ROHS COMPLIANT		1-827875-0	3D model not available Symbol and footprint not available 0	0 Build or Request
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