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Technical Content

1-747 Model Download Search Results

Showing 25 of 11888 results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2-1747049-3 TE Connectivity
1 Configuration Features: Number of Power Positions 3 | Number of Rows 1 | Number of Signal Positions 3 | PCB Mount Orientation Vertical | Number of Positions 3 | Contact Features: Contact Retention Within Housing With | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Type Tab | Contact Mating Area Plating Material Thickness .8 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Dimensions: Wire Size .22 2-1747049-3
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
3-1747050-1 TE Connectivity
1 Configuration Features: Number of Positions 2 | Number of Rows 1 | Number of Signal Positions 3 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 10 AMP | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness .8 MICM | Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Type Receptacle | Multiple Contact Types Without | Dimensions: Wire Size .22 – 1.38 MMSQ | Wire Size 434.18 – 2723.4 3-1747050-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1747981-1 TE Connectivity
1 Body Features: Shell Plating Material Tin | Connector Profile Standard | Shell Plating Finish Matte | Configuration Features: Number of Ports 1 | Stacked No | PCB Mount Orientation Right Angle | Number of Positions 19 | Contact Features: Contact Mating Area Plating Material Thickness 3.937 MICIN | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .1 MICM | Dimensions: PCB Thickness (Min) 1.6 MM | PCB T 1747981-1
3D model available
Symbol and footprint not available
 1
1 Download Model
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3-1747050-4 TE Connectivity
1 Body Features: Connector & Keying Code D | Configuration Features: Number of Rows 1 | Number of Positions 2 | Number of Signal Positions 2 | Number of Power Positions 2 | Contact Features: Contact Type Receptacle | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Thickness .8 MICM | Contact Current Rating (Max) 10 AMP | Contact Mating Area Plating Material Tin | Dimensions: Wire Size 434.18 – 27 3-1747050-4
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1747050-3 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Positions 2 | Number of Power Positions 2 | Number of Signal Positions 2 | Contact Features: Multiple Contact Types Without | Contact Type Receptacle | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness .8 MICM | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Current Rating (Max) 10 AMP | Dimensions: Wire Size 24 – 16 AWG | Wire Size 434.18 – 2723.46 CM 1747050-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1-1747049-2 TE Connectivity
1 Configuration Features: Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Signal Positions 3 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .8 MICM | Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing With | Contact Type Tab | Contact Mating Area Plating Material Thickness 31.5 MICIN | Dimensions: Wire Size 434 1-1747049-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
1747995-1 TE Connectivity
1 Body Features: Connector & Keying Code A | Configuration Features: Number of Positions 3 | Number of Rows 1 | Number of Power Positions 3 | Number of Signal Positions 0 | Contact Features: Contact Mating Area Plating Material Thickness .8 MICM | Contact Retention Within Housing With | Contact Current Rating (Max) 20 AMP | Contact Type Receptacle | Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Mating Area Plating Material Tin | Contact Layout Inline | Dimensions: Wire Size 2427 – 7144 1747995-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1747996-3 TE Connectivity
1 Body Features: Connector & Keying Code C | Configuration Features: Number of Signal Positions 0 | Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Layout Inline | Mating Tab Width .122 INCH | Contact Current Rating (Max) 20 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Mating Area Plating Material Tin | Contact Type Tab | Contact Base Material Cop 1747996-3
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
1747047-1 TE Connectivity
1 Body Features: Connector & Keying Code A | Configuration Features: Number of Signal Positions 3 | Number of Positions 3 | Number of Rows 1 | Number of Power Positions 3 | Contact Features: Contact Current Rating (Max) 9 AMP | Contact Type Receptacle | Contact Retention Within Housing With | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .8 MICM | 1747047-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
3-1747050-1 TE Connectivity
1 Configuration Features: Number of Positions 2 | Number of Rows 1 | Number of Signal Positions 3 | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 10 AMP | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness .8 MICM | Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Type Receptacle | Multiple Contact Types Without | Dimensions: Wire Size .22 – 1.38 MMSQ | Wire Size 434.18 – 2723.4 3-1747050-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2-1747050-1 TE Connectivity
1 Configuration Features: Number of Rows 1 | Number of Signal Positions 2 | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Contact Current Rating (Max) 10 AMP | Contact Type Receptacle | Contact Mating Area Plating Material Thickness .8 MICM | Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing With | Dimensions: Wire Size 434.18 – 2723.46 CMA | Wire Size .22 – 1.38 MMSQ | Wire Size 24 – 16 AWG | 2-1747050-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
LPI5124A174722 APEM Inc
1 Special Switch, Momentary, 5A, 12VDC, Screw Terminal, Panel Mount LPI5124A174722
3D model not available
Symbol and footprint not available
 0
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CP0805A1747BS Kyocera AVX Components
1 Directional Coupler, 1710MHz Min, 1785MHz Max, 0.5dB Insertion Loss-Max CP0805A1747BS
3D model not available
Symbol and footprint not available
 0
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LPI5112A174715 APEM Inc
1 Special Switch, Momentary, 5A, 12VDC, Screw Terminal, Panel Mount LPI5112A174715
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
71-74740-9J Amphenol Corporation
1 MIL Series Connector, 47 Contact(s), Aluminum Alloy, Male, Solder Terminal, Receptacle 71-74740-9J
3D model not available
Symbol and footprint not available
 0
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Part Image Part Image
LPI3412G174720 APEM Inc
1 Special Switch, Momentary, 0.05A, 24VDC, Screw Terminal, Panel Mount LPI3412G174720
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
1823174-7 TE Connectivity
1 Combination Line Connector 1823174-7
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
3-1747066-8 TE Connectivity
1 COMBINATION LINE CONNECTOR, PLUG 3-1747066-8
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
VS-5040-EFX-205X-832M0000000-1747M623050 Microchip Technology Inc
1 SAW Oscillator VS-5040-EFX-205X-832M0000000-1747M623050
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2174702222 Molex
1 Cable Assembly, 2174702222
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
VS-5040-EFX-205X-1747M623050-2135M373597 Microsemi Corporation
1 SAW Oscillator, VS-5040-EFX-205X-1747M623050-2135M373597
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
VS-4020-EEX-205X-1000M000000-1747M030837 Microchip Technology Inc
1 SAW Oscillator VS-4020-EEX-205X-1000M000000-1747M030837
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
WNCD-017-4700AK Vishay Electro-Films
1 CAPACITOR, FILM/FOIL, SILICON DIOXIDE, 20 V, 0.00047 uF, SURFACE MOUNT, CHIP WNCD-017-4700AK
3D model not available
Symbol and footprint not available
 0
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Part Image Part Image
VS-5040-EEX-205X-1747M623050-2068M675135 Microsemi Corporation
1 SAW Oscillator, VS-5040-EEX-205X-1747M623050-2068M675135
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
239041174754 YAGEO Corporation
1 Fixed Resistor, Thin Film, 0.125W, 475000ohm, 200V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 1206, CHIP, ROHS COMPLIANT 239041174754
3D model not available
Symbol and footprint not available
 0
0 Build or Request
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