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Z-DII Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
EC0126-000 TE Connectivity
1 Body Features: Primary Product Color Yellow | Marker Size 5 | Marker Style Push-On | Primary Product Material Flexible PVC | Dimensions: Compatible Cable Diameter Range 1.5 – 2 MM | Product Width .177 INCH | Product Width 4.5 MM | Compatible Cable Diameter Range .06 – .08 INCH | Other: Printed Marking Color Black | Packaging Features: Packaging Method Reel | Packaging Quantity 1000 | Printer/Label Features: Marker Cut Straight | Marking Details Z | EC0126-000 0 Build or Request
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ISL73020SEHML Renesas Electronics
1 The ISL73020SEH is a 40V N-channel enhancement mode GaN power transistor. This GaN FET has been characterized for destructive Single Event Effects (SEE) and tested for Total Ionizing Dose (TID) radiation. Applications for this device include commercial aerospace, medical, and nuclear power generation. The exceptionally high electron mobility and low temperature coefficient of the GaN allows for very low rDS(ON), while its lateral device structure and majority carrier diode provide exceptionally low QG and z ISL73020SEHML 0 Build or Request
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2-2208145-1 TE Connectivity
0 Body Features: Connector & Keying Code Z | Cable Exit Angle 90° | Configuration Features: Number of Positions 1 | Mechanical Attachment: Connector Mounting Type Cable Mount (Free-Hanging) | Operation/Application: Shielded Yes | Product Type Features: Connector System Wire-to-Board | Connector & Housing Type Housing for Female Terminals | Sealable No | Termination Features: Termination Method to Wire & Cable Crimp | Usage Conditions: Cable Type Coax | 2-2208145-1 0 Build or Request
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ISL73020SEHMX Renesas Electronics
1 The ISL73020SEH is a 40V N-channel enhancement mode GaN power transistor. This GaN FET has been characterized for destructive Single Event Effects (SEE) and tested for Total Ionizing Dose (TID) radiation. Applications for this device include commercial aerospace, medical, and nuclear power generation. The exceptionally high electron mobility and low temperature coefficient of the GaN allows for very low rDS(ON), while its lateral device structure and majority carrier diode provide exceptionally low QG and z ISL73020SEHMX 0 Build or Request
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2312192-9 TE Connectivity
0 Body Features: Connector & Keying Code Z | Cable Exit Angle 180° | Configuration Features: Number of Positions 1 | Contact Features: Mating Pin Diameter .4 MM | Mating Pin Diameter .015 INCH | Mechanical Attachment: Connector Mounting Type Cable Mount (Free-Hanging) | Operation/Application: Shielded No | Product Type Features: Sealable Yes | Connector & Housing Type Housing for Female Terminals | Connector System Wire-to-Wire | Termination Features: Termination Method to Wire & Cable Crimp | Usage Conditio 2312192-9 0 Build or Request
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ISL70024SEHMX Renesas Electronics
1 The ISL70024SEH is a 200V N-channel enhancement mode GaN power transistor. These GaN FETs have been characterized for destructive Single Event Effects (SEE) and tested for Total Ionizing Dose (TID) radiation. Applications for this device include commercial aerospace, medical, and nuclear power generation. GaN's exceptionally high electron mobility and low temperature coefficient allows for very low rDS(ON), while its lateral device structure and majority carrier diode provide exceptionally low QG and near z ISL70024SEHMX 0 Build or Request
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ISL70024SEHX/SAMPLE Renesas Electronics
1 The ISL70024SEH is a 200V N-channel enhancement mode GaN power transistor. These GaN FETs have been characterized for destructive Single Event Effects (SEE) and tested for Total Ionizing Dose (TID) radiation. Applications for this device include commercial aerospace, medical, and nuclear power generation. GaN's exceptionally high electron mobility and low temperature coefficient allows for very low rDS(ON), while its lateral device structure and majority carrier diode provide exceptionally low QG and near z ISL70024SEHX/SAMPLE 0 Build or Request
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EC1072-000 TE Connectivity
1 Body Features: Primary Product Color White | Marker Style Push-On | Primary Product Material Flexible PVC | Marker Size 15 | Dimensions: Compatible Cable Diameter Range 3.8 – 6.3 MM | Product Width 4.5 MM | Product Width .177 INCH | Compatible Cable Diameter Range .15 – .25 INCH | Other: Printed Marking Color Black | Packaging Features: Packaging Method Box | Packaging Quantity 1000 | Printer/Label Features: Marker Cut Straight | Marking Details Z | EC1072-000 0 Build or Request
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ISL70020SEHX/SAMPLE Renesas Electronics
1 The ISL70020SEH is a 40V N-channel enhancement mode GaN power transistor. This GaN FET has been characterized for destructive Single Event Effects (SEE) and tested for Total Ionizing Dose (TID) radiation. Applications for this device include commercial aerospace, medical, and nuclear power generation. The exceptionally high electron mobility and low temperature coefficient of the GaN allows for very low rDS(ON), while its lateral device structure and majority carrier diode provide exceptionally low QG and z ISL70020SEHX/SAMPLE 0 Build or Request
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R5F2138AXJFP Renesas Electronics
1 The R8C/38W, X, Y, and Z are limited to customers who have already adopted these products. The RL78/F12, F13, F14, F15 Groups are recommended for new designs.The R8C/38W Group, R8C/38X Group, R8C/38Y Group, and R8C/38Z Group of single-chip MCUs incorporate the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. R5F2138AXJFP 0 Build or Request
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2-2306368-9 TE Connectivity
0 Body Features: Connector & Keying Code Z | Configuration Features: PCB Mount Orientation Horizontal | Number of Positions 2 | Contact Features: Mating Pin Diameter .015 INCH | Mating Pin Diameter .42 MM | Housing Features: Centerline (Pitch) 4 MM | Centerline (Pitch) .157 INCH | Operation/Application: Circuit Application Signal | Shielded Yes | Other: Outer Contact Plating Material Tin (Sn) | Product Type Features: Connector System Cable-to-Board | Sealable No | Usage Conditions: Operating Temperature (Max) 2-2306368-9 0 Build or Request
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ZPF000000000018256 TE Connectivity
1 Body Features: Shell Base Material Aluminum | Hermetically Sealed No | Environmental Protection Type Elastomer Sealed | Circular Connector Insulation Material Type Thermoset | Shell Plating Material Black Anodized | Configuration Features: Number of Positions 26 | Number of Signal Positions 26 | Number of Power Positions 0 | Contacts Preloaded No | Keying Insert Polarization Z | Contact Features: Circular Connector Contact Type Pin | Contact Layout Arrangement 16 – 26 | Contact Current Rating (Max) 7.5 AM ZPF000000000018256 0 Build or Request
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1-2378550-9 TE Connectivity
0 Body Features: Connector & Keying Code Z | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 4 | Contact Features: Mating Pin Diameter .4 MM | Mating Pin Diameter .015 INCH | Housing Features: Centerline (Pitch) .157 INCH | Centerline (Pitch) 4 MM | Mechanical Attachment: Connector Mounting Type Board Mount | Operation/Application: Shielded Yes | Product Type Features: Connector System Cable-to-Board | Connector System Wire-to-Board | Sealable No | 1-2378550-9 0 Build or Request
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EC0956-000 TE Connectivity
1 Body Features: Primary Product Material Flexible PVC | Primary Product Color White | Marker Size 13 | Marker Style Push-On | Dimensions: Compatible Cable Diameter Range 3.4 – 5.7 MM | Product Width .177 INCH | Product Width 4.5 MM | Compatible Cable Diameter Range .133 – .224 INCH | Other: Printed Marking Color Black | Packaging Features: Packaging Quantity 1000 | Printer/Label Features: Marking Details Z | Marker Cut Straight | EC0956-000 0 Build or Request
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ZPF000000000018258 TE Connectivity
1 Body Features: Environmental Protection Type Elastomer Sealed | Hermetically Sealed No | Shell Plating Material Nickel | Shell Base Material Aluminum | Circular Connector Insulation Material Type Thermoset | Configuration Features: Number of Power Positions 0 | Contacts Preloaded No | Number of Positions 26 | Number of Signal Positions 26 | Keying Insert Polarization Z | Contact Features: Contact Current Rating (Max) 7.5 AMP | Reverse Gender No | Contact Layout Arrangement 16 – 26 | Circular Connector Con ZPF000000000018258 0 Build or Request
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2378550-9 TE Connectivity
0 Body Features: Connector & Keying Code Z | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 4 | Contact Features: Mating Pin Diameter .4 MM | Mating Pin Diameter .015 INCH | Housing Features: Centerline (Pitch) .157 INCH | Centerline (Pitch) 4 MM | Mechanical Attachment: Connector Mounting Type Board Mount | Operation/Application: Shielded Yes | Product Type Features: Connector System Wire-to-Board | Sealable No | Connector System Cable-to-Board | 2378550-9 0 Build or Request
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2312193-9 TE Connectivity
0 Body Features: Cable Exit Angle 180° | Connector & Keying Code Z | Configuration Features: Number of Positions 1 | Mechanical Attachment: Connector Mounting Type Cable Mount (Free-Hanging) | Operation/Application: Shielded No | Product Type Features: Sealable No | Connector & Housing Type Housing for Male Terminals | Connector System Wire-to-Wire | Usage Conditions: Operating Temperature Range -40 – 221 DEGF | Operating Temperature (Max) 221 DEGF | Operating Temperature (Max) 105 DEGC | Operating Tempera 2312193-9 0 Build or Request
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2208338-9 TE Connectivity
0 Body Features: Connector & Keying Code Z | Primary Product Color Water Blue | Configuration Features: Number of Positions 6 | Number of Rows 2 | Contact Features: Mating Tab Width .5 MM | Mating Tab Width .02 INCH | Housing Features: Centerline (Pitch) .07 INCH | Centerline (Pitch) 1.8 MM | Mechanical Attachment: Connector Mounting Type Cable Mount (Free-Hanging) | Operation/Application: Circuit Application Signal | Other: Connector Position Assurance Capable No | Product Type Features: Connector & Housing 2208338-9 0 Build or Request
Part Image Part Image 1 Body Features: Shell Base Material Aluminum | Circular Connector Insulation Material Type Thermoset | Shell Plating Material Nickel | Hermetically Sealed No | Environmental Protection Type Elastomer Sealed | Configuration Features: Number of Positions 21 | Keying Insert Polarization Z | Number of Signal Positions 21 | Contacts Preloaded No | Number of Power Positions 0 | Contact Features: Circular Connector Contact Type Less Socket | Contact Current Rating (Max) 13 AMP | Reverse Gender No | Contact Layout A FDBA 50-22-21 SZ-K 090-A499 0 Build or Request
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STD01W-Z TE Connectivity
1 Body Features: Primary Product Material Polyoxymethylene | Marker Size STD 01 | Primary Product Color White | Marker Style Snap-On | Dimensions: Compatible Cable Diameter Range 1 – 1.4 MM | Compatible Cable Diameter Range .04 – .055 INCH | Other: Printed Marking Color Black | Packaging Features: Packaging Quantity 300 | Packaging Method Strip | Printer/Label Features: Marker Cut Straight | Marking Details Z | STD01W-Z 0 Build or Request
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EC6489-000 TE Connectivity
1 Body Features: Marker Size 65 | Marker Style Tie-On | Primary Product Color Yellow | Primary Product Material Flexible PVC | Dimensions: Product Width 6 MM | Compatible Cable Diameter Range 4.2 – 7 MM | Compatible Cable Diameter Range .165 – .276 INCH | Product Width .23 INCH | Other: Printed Marking Color Black | Packaging Features: Packaging Method Reel | Packaging Quantity 500 | Printer/Label Features: Marking Details Z | Marker Cut Straight | EC6489-000 0 Build or Request
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R5F2138AYJFP Renesas Electronics
1 The R8C/38W, X, Y, and Z are limited to customers who have already adopted these products. The RL78/F12, F13, F14, F15 Groups are recommended for new designs.The R8C/38W Group, R8C/38X Group, R8C/38Y Group, and R8C/38Z Group of single-chip MCUs incorporate the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. R5F2138AYJFP 0 Build or Request
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2378740-1 TE Connectivity
0 Body Features: Connector & Keying Code Z | Primary Product Color Gray | Configuration Features: Number of Rows 2 | Number of Positions 22 | Contact Features: Mating Tab Width 2.8 MM | Mating Tab Width .11 INCH | Contact Size 2.8mm | Electrical Characteristics: Nominal Voltage Architecture 12 V | Housing Features: Centerline (Pitch) .197 INCH | Centerline (Pitch) 5 MM | Mechanical Attachment: Connector Mounting Type Cable Mount (Free-Hanging) | Mating Alignment Type Keyed | Mating Alignment With | Other: Con 2378740-1 0 Build or Request
Part Image Part Image 1 Body Features: Shell Base Material Aluminum | Shell Plating Material Black Anodized | Circular Connector Insulation Material Type Thermoset | Environmental Protection Type Elastomer Sealed | Hermetically Sealed No | Configuration Features: Number of Positions 55 | Keying Insert Polarization Z | Number of Signal Positions 55 | Number of Power Positions 0 | Contacts Preloaded No | Contact Features: Contact Current Rating (Max) 7.5 AMP | Contact Layout Arrangement 22 – 55 | Reverse Gender No | Circular Conne FDBA 50-22-55 PZ-K-A6032 0 Build or Request
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R5F2138CWJFP Renesas Electronics
1 The R8C/38W, X, Y, and Z are limited to customers who have already adopted these products. The RL78/F12, F13, F14, F15 Groups are recommended for new designs.The R8C/38W Group, R8C/38X Group, R8C/38Y Group, and R8C/38Z Group of single-chip MCUs incorporate the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. R5F2138CWJFP 0 Build or Request
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