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2227667-3
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Ports 4 | Number of Rear EONs per Port Column 0 | Number of Positions 152 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2227667-3 |
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2227670-7
TE Connectivity
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1 | Configuration Features: Number of Rear EONs per Port Column 3 | Port Matrix Configuration 2 x 2 | Number of Ports 4 | Number of Positions 152 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) .5 AMP | Electrical Characteristics: Data Rate (Max) 25 GBS | Housing Features: Centerline (Pitch) .8 MM | Centerline (Pitch) .032 INCH | Operation/Application: Circuit Application Signal | Other: Included Lightpipe No | EMI Containment Feature Type Internal/External E | 2227670-7 |
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1-2227669-0
TE Connectivity
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1 | Configuration Features: Number of Positions 76 | Number of Rear EONs per Port Column 3 | Port Matrix Configuration 2 x 1 | Number of Ports 2 | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Gold | Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thicknes | 1-2227669-0 |
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2227667-1
TE Connectivity
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1 | Configuration Features: Number of Positions 152 | Port Matrix Configuration 2 x 2 | Number of Rear EONs per Port Column 0 | Number of Ports 4 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne | 2227667-1 |
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2227666-1
TE Connectivity
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1 | Configuration Features: Number of Positions 76 | Number of Ports 2 | Port Matrix Configuration 2 x 1 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recommended) 1.57 MM | Electrical Cha | 2227666-1 |
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2227669-3
TE Connectivity
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1 | Configuration Features: Number of Positions 76 | Port Matrix Configuration 2 x 1 | Number of Rear EONs per Port Column 3 | Number of Ports 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Underplating Material Tin | PCB Contact Termination Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2227669-3 |
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2227668-3
TE Connectivity
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1 | Configuration Features: Number of Positions 228 | Number of Ports 6 | Number of Rear EONs per Port Column 0 | Port Matrix Configuration 2 x 3 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2227668-3 |
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2227670-3
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Rear EONs per Port Column 3 | Number of Positions 152 | Number of Ports 4 | Contact Features: Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2227670-3 |
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322768
TE Connectivity
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1 | Body Features: Product Weight .527 G | Configuration Features: Number of Holes 2 | Contact Features: Barrel Type Closed | Terminal Orientation Right Angle | Terminal Plating Material Tin | Dimensions: Wire Size 509 – 3260 CMA | Barrel Inside Diameter .061 INCH | Stud Diameter 5 MM | Tongue Thickness .031 INCH | Wire Size 22 – 16 AWG | Wire Size .3 – 1.42 MMSQ | Stud Diameter .197 INCH | Tongue Thickness .79 MM | Barrel Inside Diameter 1.55 MM | Industry Standards: Government Qualified Terminal No | Me | 322768 |
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2227670-2
TE Connectivity
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1 | Configuration Features: Number of Positions 152 | Number of Rear EONs per Port Column 3 | Number of Ports 4 | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne | 2227670-2 |
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2227671-1
TE Connectivity
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1 | Configuration Features: Number of Rear EONs per Port Column 3 | Number of Ports 6 | Port Matrix Configuration 2 x 3 | Number of Positions 228 | Contact Features: Contact Underplating Material Tin | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne | 2227671-1 |
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2227668-2
TE Connectivity
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1 | Configuration Features: Number of Ports 6 | Port Matrix Configuration 2 x 3 | Number of Rear EONs per Port Column 0 | Number of Positions 228 | Contact Features: Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2227668-2 |
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2227668-1
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 3 | Number of Ports 6 | Number of Positions 228 | Number of Rear EONs per Port Column 0 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne | 2227668-1 |
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2227671-3
TE Connectivity
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1 | Configuration Features: Number of Ports 6 | Number of Positions 228 | Port Matrix Configuration 2 x 3 | Number of Rear EONs per Port Column 3 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2227671-3 |
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2227671-2
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 3 | Number of Positions 228 | Number of Rear EONs per Port Column 3 | Number of Ports 6 | Contact Features: Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne | 2227671-2 |
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HG532276F37HGT
CTS Corporation
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1 | Parallel - Fundamental Quartz Crystal, 27.648MHz Nom | HG532276F37HGT |
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10093462-22276LF
Amphenol FCi
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1 | Card Edge Connector, 240 Contact(s), 2 Row(s), Female, Straight, Solder Terminal | 10093462-22276LF |
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10093462-22276LF
Amphenol Communications Solutions
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1 | Card Edge Connector, 240 Contact(s), 2 Row(s), Female, Straight, Solder Terminal | 10093462-22276LF |
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232276168871L
YAGEO Corporation
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1 | Fixed Resistor, Metal Glaze/thick Film, 0.75W, 887ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010 | 232276168871L |
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64-22227-6A-0300
Gould Fiber Optics
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1 | Cable Assembly, 2 Conductor(s), Fiber Optic Cable | 64-22227-6A-0300 |
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232276161503
YAGEO Corporation
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1 | Fixed Resistor, Metal Glaze/thick Film, 0.75W, 15000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010 | 232276161503 |
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232276164229
YAGEO Corporation
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1 | Fixed Resistor, Metal Glaze/thick Film, 0.75W, 42.2ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010 | 232276164229 |
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660-083-ZNR1227-6
Glenair Inc
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1 | Connector Accessory, Cover Item, Aluminum | 660-083-ZNR1227-6 |
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RAS-2276R8FKAS
Cinetech Industrial Co Ltd
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1 | Fixed Resistor, Metal Glaze/thick Film, 0.75W, 76.8ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010 | RAS-2276R8FKAS |
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SP42276.80.1
TT Electronics Resistors
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1 | Fixed Resistor, Wire Wound, 0.125W, 76.8ohm, 200V, 0.1% +/-Tol, -2,2ppm/Cel, | SP42276.80.1 |
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