2-767 Model Download Search Results
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172767-0014
Molex
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0 | 172767-0014 - Molex Female Connector Housing - MiniFit, 4.2mm Pitch, 14 Way, 2 Row | 172767-0014 |
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172767-0120
Molex
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0 | 172767-0120 - Molex Female Connector Housing - MiniFit, 4.2mm Pitch, 20 Way, 2 Row | 172767-0120 |
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2327678-8
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 84 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 1.1 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .381 MICM | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitc | 2327678-8 |
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2327678-1
TE Connectivity
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1 | Configuration Features: Number of Positions 84 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Current Rating (Max) 1.1 AMP | PCB Contact Termination Area Plating Material Tin | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitch | 2327678-1 |
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492767
Essentra Components
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1 | 2 Way Panel Former 38.0 mm 180 ° PVC | 492767 |
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172767-0122
Molex
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0 | 172767-0122 - Molex Female Connector Housing - MiniFit, 4.2mm Pitch, 22 Way, 2 Row | 172767-0122 |
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1727670102
Molex
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1 | Mini-Fit TPA2 Plug Housing, 4.20mm Pitch, Dual Row, UL 94V-2, Glow-Wire Capable, 2 Circuits, Panel Mount | 1727670102 |
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172767-0114
Molex
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0 | 172767-0114 - Molex Female Connector Housing - MiniFit, 4.2mm Pitch, 14 Way, 2 Row | 172767-0114 |
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2227670-2
TE Connectivity
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1 | Configuration Features: Number of Positions 152 | Number of Rear EONs per Port Column 3 | Number of Ports 4 | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne | 2227670-2 |
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172767-0022
Molex
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0 | 172767-0022 - Molex Female Connector Housing - MiniFit, 4.2mm Pitch, 22 Way, 2 Row | 172767-0022 |
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2327678-3
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 84 | Contact Features: Contact Mating Area Plating Material Thickness .762 MICM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) . | 2327678-3 |
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172767-0016
Molex
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0 | 172767-0016 - Molex Female Connector Housing - MiniFit, 4.2mm Pitch, 16 Way, 2 Row | 172767-0016 |
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2227671-2
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 3 | Number of Positions 228 | Number of Rear EONs per Port Column 3 | Number of Ports 6 | Contact Features: Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne | 2227671-2 |
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2227671-3
TE Connectivity
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1 | Configuration Features: Number of Ports 6 | Number of Positions 228 | Port Matrix Configuration 2 x 3 | Number of Rear EONs per Port Column 3 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2227671-3 |
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2227670-7
TE Connectivity
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1 | Configuration Features: Number of Rear EONs per Port Column 3 | Port Matrix Configuration 2 x 2 | Number of Ports 4 | Number of Positions 152 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) .5 AMP | Electrical Characteristics: Data Rate (Max) 25 GBS | Housing Features: Centerline (Pitch) .8 MM | Centerline (Pitch) .032 INCH | Operation/Application: Circuit Application Signal | Other: Included Lightpipe No | EMI Containment Feature Type Internal/External E | 2227670-7 |
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1727673002
Molex
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1 | Mini-Fit Sigma Plug Housing, 4.20mm Pitch, Dual Row, Panel Mount, UL 94V-0, Glow-Wire Capable, 2 Circuits | 1727673002 |
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2327670-2
TE Connectivity
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1 | Configuration Features: Number of Positions 140 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .381 MICM | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Current Rating (Max) 1.1 AMP | PCB Contact Termination Area Plating Material Tin | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitc | 2327670-2 |
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2327670-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 140 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch | 2327670-1 |
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2327678-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 84 | Contact Features: Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .762 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1.1 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) . | 2327678-6 |
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2227670-1
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Ports 4 | Number of Positions 152 | Number of Rear EONs per Port Column 3 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne | 2227670-1 |
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2327678-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 84 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Base Material Copper Alloy | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .381 MICM | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitc | 2327678-2 |
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2227670-3
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Number of Rear EONs per Port Column 3 | Number of Positions 152 | Number of Ports 4 | Contact Features: Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2227670-3 |
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2327678-9
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 84 | Contact Features: Contact Underplating Material Nickel | Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .762 MICM | Contact Mating Area Plating Material Gold | Housing Features: Centerline (Pitch) .023 INCH | Centerline (Pitc | 2327678-9 |
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2327678-7
TE Connectivity
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1 | Configuration Features: Number of Positions 84 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 1.1 AMP | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .076 MICM | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) .0 | 2327678-7 |
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2327677-9
TE Connectivity
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1 | Configuration Features: Number of Positions 140 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .762 MICM | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Nickel | Contact Current Rating (Max) 1.1 AMP | PCB Contact Termination Area Plating Material Tin | Housing Features: Centerline (Pitch) .6 MM | Centerline (Pitch) | 2327677-9 |
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