20075 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	SEAF-20-07.5-STL-05-1-A-K-TR SAMTEC	1	100 Position, .050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socke	Other	SEAF-20-07.5-STL-05-1-A-K-TR	3D model not available Symbol and footprint available 2	1 Download Model
	SEAF-20-07.5-STL-08-1-A-K-TR SAMTEC	1	160 Position, .050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socke	Other	SEAF-20-07.5-STL-08-1-A-K-TR	3D model not available Symbol and footprint available 2	1 Download Model
	SEAF-20-07.5-L-08-1-A-K-TR SAMTEC	1	160 Position, .050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socke	Other	SEAF-20-07.5-L-08-1-A-K-TR	3D model not available Symbol and footprint available 2	1 Download Model
	MAX20075ATCC/V+ Analog Devices	1	Buck Switching Regulator IC Positive Programmable (Fixed) 1V 1 Output 600mA 12-WFDFN Exposed Pad	Small Outline No-lead	MAX20075ATCC/V+	3D model available Symbol and footprint available 3	1 Download Model

	MAX20075DATCD/V+ Analog Devices	1	36V, 600mA/1.2A Mini Buck Converter with 3.5µA IQ	Small Outline No-lead	MAX20075DATCD/V+	3D model available Symbol and footprint available 3	1 Download Model
	ADF6-20-07.5-L-4-0-A-TR SAMTEC	1	80 Position Connector High Density Array, Female Surface Mount Gold	Other	ADF6-20-07.5-L-4-0-A-TR	3D model available Symbol and footprint available 3	1 Download Model
	MAX20075DATCA/V+T Analog Devices	1	36V, 600mA/1.2A Mini Buck Converter TD1233+2C	Small Outline No-lead	MAX20075DATCA/V+T	3D model available Symbol and footprint available 3	1 Download Model
	SEAF-20-07.5-S-08-2-A-K-TR SAMTEC	1	.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket	Other	SEAF-20-07.5-S-08-2-A-K-TR	3D model not available Symbol and footprint available 2	1 Download Model
	SEAF-20-07.5-S-05-2-A-K-TR SAMTEC	1	100 Position, .050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socke	Other	SEAF-20-07.5-S-05-2-A-K-TR	3D model available Symbol and footprint available 3	1 Download Model
	ADF6-20-07.5-L-4-2-A-TR SAMTEC	1	0.635 mm AcceleRate® HD High-Density 4-Row Socket , 1.34 A , - 55 C+ 125 C ,80 Position	Other	ADF6-20-07.5-L-4-2-A-TR	3D model available Symbol and footprint available 3	1 Download Model
	MAX20075DATCB/V+T Analog Devices	1	36V, 600mA/1.2A Mini Buck Converter	Small Outline No-lead	MAX20075DATCB/V+T	3D model available Symbol and footprint available 3	1 Download Model
	MAX20075DATCA/V+ Analog Devices	1	36V, 600mA/1.2A Mini Buck Converter TD1233+2C	Small Outline No-lead	MAX20075DATCA/V+	3D model available Symbol and footprint available 3	1 Download Model
	SEAF-20-07.5-L-06-1-A-K-TR SAMTEC	1	120 Position, .050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socke	Other	SEAF-20-07.5-L-06-1-A-K-TR	3D model not available Symbol and footprint available 2	1 Download Model
	MAX20075ATCA/V+ Analog Devices	1	36V, 600mA/1.2A Mini Buck Converter	Small Outline No-lead	MAX20075ATCA/V+	3D model available Symbol and footprint available 3	1 Download Model
	SEAF-20-07.5-STL-10-1-A-K-TR SAMTEC	1	200 Position, .050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket	Other	SEAF-20-07.5-STL-10-1-A-K-TR	3D model not available Symbol and footprint available 2	1 Download Model

	20075C Celestica Inc	1	Synchronous DRAM Module, 2MX64, 7.5ns, CMOS		20075C	3D model not available Symbol and footprint not available 0	0 Build or Request
	2007567-6 TE Connectivity	1	Configuration Features: Number of Ports 12 \| Number of Positions 240 \| Port Matrix Configuration 2 x 6 \| Contact Features: Contact Mating Area Plating Material Thickness .76 MICM \| Tail Plating Material Tin \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 16 GBS \| Housing Features: Cage Material Nickel Silver \| Centerline (Pitch) .8 MM \| Center		2007567-6	3D model available Symbol and footprint not available 1	1 Download Model
	2007500000 Weidmüller	1	Round plug (field customisable), M12, Number of poles: 8,		2007500000	3D model available Symbol and footprint not available 1	1 Download Model
	2007514-2 TE Connectivity	1	AMP .050C/L CEC 40 DUAL POS		2007514-2	3D model available Symbol and footprint not available 1	1 Download Model
	2007514-1 TE Connectivity	1	Card Edge Connector, 40 Contact(s), 2 Row(s), Female, Straight, Solder Terminal		2007514-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	2007590000 Weidmüller Interface GmbH & Co. KG	1	Strip Terminal Block		2007590000	3D model not available Symbol and footprint not available 0	0 Build or Request
	2007562-1 TE Connectivity	1	Telecom and Datacom Connector		2007562-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	2007562-7 TE Connectivity	1	Telecom and Datacom Connector, 240 Contact(s), Press Fit Terminal		2007562-7	3D model not available Symbol and footprint not available 0	0 Build or Request
	2007562-8 TE Connectivity	1	Telecom and Datacom Connector, 240 Contact(s), Press Fit Terminal		2007562-8	3D model not available Symbol and footprint not available 0	0 Build or Request
	2007538-7 TE Connectivity	1	Configuration Features: Number of Ports 2 \| Number of Positions 40 \| Port Matrix Configuration 2 x 1 \| Contact Features: Contact Mating Area Plating Material Thickness .76 MICM \| Tail Plating Material Tin \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 16 GBS \| Housing Features: Centerline (Pitch) .8 MM \| Centerline (Pitch) .032 INCH \| Cage Ma		2007538-7	3D model available Symbol and footprint not available 1	1 Download Model
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