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2129- Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image 0 Tactile Switches 12 x 12 mm 9.5 mm Actuactor Height 260gf Black Surface Mount TR SPST Other TS16-1212-95-BK-260-SMT-TR 1 Download Model
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2-2129710-5 TE Connectivity
1 Body Features: Frame Style C Shape | Configuration Features: Number of Positions 1824 | Grid Spacing .9906 x .8585 MM | Grid Spacing .039 x .0338 INCH | Contact Features: IC Socket Type LGA 3647 | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | Housing Features: Centerline (Pitch) .86 MM | Centerline (Pitch) .99 MM | Housing Color Black | Centerline (Pitch) .039 INCH | Housing Mat Other 2-2129710-5 1 Download Model
Part Image Part Image 1 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch Other TSW-121-29-SS-S 1 Download Model
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1821290 Phoenix Contact
1 PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, type of contact: Male connector, Number of potentials: 7, Number of rows: 1, Number of positions per row: 7, number of connections: 7, product range: MC 0,5/..-G-THR, pitch: 2.54 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, Stecksystem: MICRO COMBICON - FMC 0,5, Locking: without, type of packaging: 44 mm wide tape, Sample values available unde Other 1821290 1 Download Model
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R5F21294SDSP#W4 Renesas Electronics
1 The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat Small Outline Packages R5F21294SDSP#W4 1 Download Model
Part Image Part Image 1 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch Other TSW-121-29-S-S 1 Download Model
Part Image Part Image
252129 Amphenol
1 RF Connectors / Coaxial Connectors MCX R/A RECEPTACLE PCB .155 LEGS Other 252129 1 Download Model
Part Image Part Image
ALD212900SAL Advanced Linear Devices Inc.
1 MOSFET Dual N-Ch EPAD FET Array VGS=0.0V Small Outline Packages ALD212900SAL 1 Download Model
Part Image Part Image 1 RM33, Rugged Rectangular Connector, 0.075"/1.91mm Pitch, Plastic Body, Vertical Board Mount Plug, Plated Thru Hole (PTH), without Mounting Ears. 3-Row, Size: 11-206 Other RM332-059-121-2900 1 Download Model
Part Image Part Image
7112129 RS Pro
1 RS Pro 10μF 450 V dc Aluminium Electrolytic Capacitor 2000h 13 Dia. x 21mm Capacitor, Polarized Radial Diameter 7112129 1 Download Model
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R5F21294JSP#U0 Renesas Electronics
1 16-bit Microcontrollers - MCU R8C/29 16KB+2KB/1KB 20LSSOP J Temp Small Outline Packages R5F21294JSP#U0 1 Download Model
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830202129201 Würth Elektronik
1 Standard 7 x 5mm crystal oscillator in a ceramic package with a seam sealed metal lid, hermetically sealed Other 830202129201 1 Download Model
Part Image Part Image 1 IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty. Other 242-1293-29-0602J 1 Download Model
Part Image Part Image 1 Rectangular MIL Spec Connectors CONNECTOR, R SERIES Other RM212-020-121-2900 1 Download Model
Part Image Part Image
R5F21294SNSP#U0 Renesas Electronics
1 The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat Small Outline Packages R5F21294SNSP#U0 1 Download Model
Part Image Part Image 1 DUAL P-CHANNEL MOSFET,SOT-363 SOT23 (6-Pin) SI2129DW-TP 1 Download Model
Part Image Part Image 1 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch Other TSW-121-29-L-S 1 Download Model
Part Image Part Image 1 NXP LPC2129FBD64/01,15, 16/32bit ARM7TDMI-S Microcontroller, 60MHz, 256 kB Flash, 64-Pin LQFP Quad Flat Packages LPC2129FBD64/01,15 1 Download Model
Part Image Part Image 1 Card Edge Connector, 58 Contact(s), 2 Row(s), Female, Straight, Solder Terminal 2129-N3-15-40 0 Build or Request
Part Image Part Image 1 Card Edge Connector, 58 Contact(s), 2 Row(s), Female, Straight, Solder Terminal 2129-S2-24-40 0 Build or Request
Part Image Part Image 1 Card Edge Connector, 58 Contact(s), 2 Row(s), Female, Straight, Solder Terminal 2129-N4-34-20 0 Build or Request
Part Image Part Image 1 58 CONTACT(S), FEMALE, RIGHT ANGLE SINGLE PART CARD EDGE CONN, SOLDER 2129-N4-28-40 0 Build or Request
Part Image Part Image 1 Card Edge Connector, 58 Contact(s), 2 Row(s), Female, Straight, Solder Terminal 2129-S4-25-50 0 Build or Request
Part Image Part Image 1 58 CONTACT(S), FEMALE, RIGHT ANGLE SINGLE PART CARD EDGE CONN, SOLDER 2129-S2-27-30 0 Build or Request
Part Image Part Image 1 58 CONTACT(S), FEMALE, RIGHT ANGLE SINGLE PART CARD EDGE CONN, SOLDER 2129-N4-36-20 0 Build or Request
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