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2132598-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Columns 6 | Number of Pairs 24 | PCB Mount Orientation Vertical | Stackable No | Number of Signal Positions 48 | Number of Rows 12 | Number of Positions 72 | Number of Ground Positions 24 | Guide Location Unguided | Backplane Architecture Orthogonal | Contact Features: Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Type Pin | 2132598-2 |
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2132577-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 24 | PCB Mount Orientation Vertical | Number of Columns 8 | Stackable No | Number of Pairs 24 | Number of Signal Positions 48 | Number of Positions 72 | Guide Location Left | Backplane Architecture Orthogonal | Number of Rows 9 | Contact Features: Contact Mating Area Length .193 INCH | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 30 – 60 MICIN | Contact Mating Area Length 4.9 | 2132577-1 |
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2132526-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 18 | Stackable No | Number of Positions 54 | Number of Ground Positions 18 | Number of Rows 9 | Guide Location Left | Number of Signal Positions 36 | Number of Columns 6 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Length .177 INCH | Contact Type Pin | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 50 MICIN | PCB Contact Terminati | 2132526-1 |
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2132580-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 24 | Number of Rows 9 | PCB Mount Orientation Vertical | Number of Positions 72 | Number of Ground Positions 24 | Number of Signal Positions 48 | Backplane Architecture Orthogonal | Number of Columns 8 | Stackable No | Guide Location Right | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .75 AMP | Contact Underplating Material Nickel | Contact Mating Area Length 5.5 MM | Contact B | 2132580-2 |
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2132592-3
TE Connectivity
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1 | IMP100,O,H,V3P8C,UG,REW46 | 2132592-3 |
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2132589-1
TE Connectivity
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1 | IMP100O,HMP,V3P8C,UG,OEW46,4.9 | 2132589-1 |
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2132569-1
TE Connectivity
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1 | IMP100O,HMP,V3P6C,LG,OEW46,4.9 | 2132569-1 |
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2132573-1
TE Connectivity
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1 | IMP100O,HMP,V3P6C,UG,OEW46,4.9 | 2132573-1 |
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2132541-2
TE Connectivity
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1 | IMP100S,H,V3P6C,UG,REW39,4.9 | 2132541-2 |
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2132596-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Pairs 24 | Number of Positions 72 | Backplane Architecture Orthogonal | Number of Ground Positions 24 | Stackable No | Number of Columns 6 | Guide Location Right | Number of Signal Positions 48 | Number of Rows 12 | Contact Features: Contact Mating Area Length .217 INCH | Contact Current Rating (Max) .75 AMP | Contact Underplating Material Thickness 1.27 MICM | Contact Type Pin | Contact Layout In | 2132596-2 |
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2132579-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 48 | Stackable No | PCB Mount Orientation Vertical | Guide Location Right | Number of Pairs 24 | Number of Columns 8 | Number of Rows 9 | Number of Ground Positions 24 | Number of Positions 72 | Backplane Architecture Orthogonal | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 50 MICIN | Contact Type Pin | Contact Layout Inline | Contact Mating Area L | 2132579-2 |
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2132536-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 18 | Number of Ground Positions 18 | Number of Positions 54 | Guide Location Unguided | Number of Signal Positions 36 | PCB Mount Orientation Vertical | Stackable No | Number of Rows 9 | Number of Columns 6 | Contact Features: PCB Contact Termination Area Plating Material Thickness 50 MICIN | Contact Mating Area Length 4.9 MM | Contact Type Pin | Contact Base Material Copper Alloy | Contact Current Rating (Max) .75 AMP | Co | 2132536-2 |
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2132527-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Stackable No | Number of Pairs 18 | Number of Positions 54 | Number of Ground Positions 18 | Guide Location Left | Number of Columns 6 | Number of Rows 9 | Number of Signal Positions 36 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 50 MICIN | Contact Shape & Form Dual Beam | C | 2132527-2 |
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2132581-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Signal Positions 48 | Stackable No | Number of Columns 8 | PCB Mount Orientation Vertical | Number of Positions 72 | Guide Location Unguided | Number of Pairs 24 | Number of Rows 9 | Number of Ground Positions 24 | Backplane Architecture Orthogonal | Contact Features: Contact Current Rating (Max) .75 AMP | Contact Layout Inline | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | PCB C | 2132581-2 |
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2132582-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 24 | PCB Mount Orientation Vertical | Number of Positions 72 | Backplane Architecture Orthogonal | Stackable No | Number of Rows 9 | Guide Location Unguided | Number of Columns 8 | Number of Pairs 24 | Number of Signal Positions 48 | Contact Features: Contact Type Pin | Contact Layout Inline | Contact Base Material Copper Nickel Silicon | Contact Shape & Form Dual Beam | Contact Mating Area Plating Material Thick | 2132582-1 |
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2132590-3
TE Connectivity
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1 | IMP100,O,H,V3P8C,UG,LEW46 | 2132590-3 |
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2132591-2
TE Connectivity
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1 | IMP100O,HMP,V3P8C,UG,DEW46,5.5 | 2132591-2 |
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2132564-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 18 | Guide Location Right | Number of Ground Positions 18 | Backplane Architecture Orthogonal | Number of Rows 9 | Stackable No | Number of Columns 6 | PCB Mount Orientation Vertical | Number of Positions 54 | Number of Signal Positions 36 | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 30 – 60 MICIN | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termi | 2132564-2 |
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2132567-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Guide Location Unguided | PCB Mount Orientation Vertical | Number of Signal Positions 36 | Number of Columns 6 | Number of Pairs 18 | Number of Ground Positions 18 | Number of Positions 54 | Number of Rows 9 | Backplane Architecture Orthogonal | Stackable No | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness .76 – 1.52 | 2132567-1 |
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2132535-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Stackable No | Number of Rows 9 | Number of Positions 54 | Number of Pairs 18 | Number of Ground Positions 18 | Number of Columns 6 | PCB Mount Orientation Vertical | Number of Signal Positions 36 | Guide Location Unguided | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Thickness 1.27 MICM | Contact Current Rating (Max) .75 AMP | PCB Contact Termination Area Pla | 2132535-3 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2132574-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Columns 6 | Number of Rows 9 | Number of Positions 54 | Number of Signal Positions 36 | Number of Ground Positions 18 | Stackable No | Guide Location Unguided | Backplane Architecture Orthogonal | PCB Mount Orientation Vertical | Number of Pairs 18 | Contact Features: Contact Layout Inline | Contact Mating Area Length .177 INCH | PCB Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Thickness | 2132574-1 |
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2132597-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Ground Positions 24 | Number of Rows 12 | Stackable No | Number of Positions 72 | Number of Pairs 24 | Number of Signal Positions 48 | Guide Location Unguided | Number of Columns 6 | Backplane Architecture Orthogonal | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness .76 – 1.52 MICM | Contact Mating Area Length .193 INCH | Contact Base Material Copper Nickel Silicon | Co | 2132597-1 |
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2132574-3
TE Connectivity
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1 | Board Connector, 9 Row(s), Male, Straight, Press Fit Terminal, Black Insulator | 2132574-3 |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2132533-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Stackable No | Number of Signal Positions 36 | Number of Columns 6 | Number of Positions 54 | Number of Rows 9 | Number of Ground Positions 18 | Number of Pairs 18 | Guide Location Right | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Length .217 INCH | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Thickness 50 MI | 2132533-3 |
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2132599-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Guide Location Unguided | PCB Mount Orientation Vertical | Number of Positions 72 | Number of Columns 6 | Number of Pairs 24 | Number of Rows 12 | Stackable No | Number of Signal Positions 48 | Number of Ground Positions 24 | Backplane Architecture Orthogonal | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Base Material Copper | 2132599-1 |
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