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Technical Content

21326 Model Download Search Results

Showing 25 of 1805 results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
2132658-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Rows 9 | PCB Mount Orientation Right Angle | Number of Ground Positions 18 | Number of Signal Positions 36 | Number of Positions 54 | Number of Columns 6 | Number of Pairs 18 | Guide Location Right | Stackable No | Contact Features: PCB Contact Termination Area Plating Material Thickness 30 – 60 MICIN | Contact Current Rating (Max) .75 AMP | Contact Layout Inline | Contact Mating Area Plating Material Gold | Contact Mating Area 2132658-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132694-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Columns 10 | Backplane Architecture Orthogonal | Number of Signal Positions 100 | Number of Pairs 50 | Stackable No | Number of Rows 15 | Guide Location Right | Number of Positions 150 | Number of Ground Positions 50 | PCB Mount Orientation Right Angle | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness 29.92 – 59.84 MICIN | Contact Current Rating (Max) .75 AMP 2132694-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132610-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Positions 96 | Backplane Architecture Orthogonal | Number of Columns 8 | Guide Location Left | Number of Rows 12 | Stackable No | Number of Signal Positions 64 | PCB Mount Orientation Vertical | Number of Ground Positions 32 | Number of Pairs 32 | Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area 2132610-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132610-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Positions 96 | Number of Ground Positions 32 | Number of Pairs 32 | PCB Mount Orientation Vertical | Number of Rows 12 | Number of Columns 8 | Number of Signal Positions 64 | Stackable No | Guide Location Left | Backplane Architecture Orthogonal | Contact Features: PCB Contact Termination Area Plating Material Thickness 30 – 60 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Thick 2132610-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132633-2 TE Connectivity
1 IMP100O,HMP,V4P10C,LG,OEW46,5.5 2132633-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132617-2 TE Connectivity
1 IMP100O,HMP,V4P8C,LG,OEW46,5.5 2132617-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132617-1 TE Connectivity
1 IMP100O,HMP,V4P8C,LG,OEW46,4.9 2132617-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132622-3 TE Connectivity
1 IMP100,O,H,V4P8C,UG,LEW46 2132622-3
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132603-2 TE Connectivity
1 IMP100O,HMP,V4P6C,RG,OEW46,5.5 2132603-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132607-2 TE Connectivity
1 IMP100O,HMP,V4P6C,UG,DEW46,5.5 2132607-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132630-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 40 | Guide Location Unguided | Number of Positions 120 | Number of Signal Positions 80 | Number of Columns 10 | PCB Mount Orientation Vertical | Backplane Architecture Orthogonal | Number of Ground Positions 40 | Stackable No | Number of Rows 12 | Contact Features: Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Contact Current Rating (Max) .75 AMP | Contact Mating Area Length .217 INCH | Co 2132630-2
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132608-1 TE Connectivity
1 IMP100O,HMP,V4P6C,UG,REW46,4.9 2132608-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132629-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Pairs 40 | Number of Ground Positions 40 | Number of Positions 120 | Stackable No | Number of Signal Positions 80 | Backplane Architecture Orthogonal | Guide Location Unguided | Number of Columns 10 | Number of Rows 12 | Contact Features: Contact Type Pin | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Gold | Contact Base Material Copper Alloy | Contact La 2132629-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132627-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Right | Number of Rows 12 | Number of Signal Positions 80 | PCB Mount Orientation Vertical | Number of Ground Positions 40 | Stackable No | Backplane Architecture Orthogonal | Number of Columns 10 | Number of Positions 120 | Number of Pairs 40 | Contact Features: Contact Base Material Copper Alloy | Contact Mating Area Length .193 INCH | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .75 AMP | PCB C 2132627-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132697-1 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Number of Pairs 60 | Number of Signal Positions 120 | Backplane Architecture Orthogonal | Number of Rows 15 | Guide Location Right | Number of Positions 180 | Number of Columns 12 | Number of Ground Positions 60 | Stackable No | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) .75 AMP | Contact Layout Inline | Contact Mating Area Plating Material Thickness 29.92 – 59.84 MICIN | Contact Type Socket | PCB 2132697-1
3D model available
Symbol and footprint not available
 1
1 Download Model
Part Image Part Image
2132605-1 TE Connectivity
1 IMP100O,HMP,V4P6C,UG,OEW46,4.9 2132605-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132635-2 TE Connectivity
1 IMP100O,HMP,V4P10C,RG,OEW46,5.5 2132635-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132612-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Guide Location Right | PCB Mount Orientation Vertical | Number of Rows 12 | Backplane Architecture Orthogonal | Stackable No | Number of Ground Positions 32 | Number of Signal Positions 64 | Number of Columns 8 | Number of Pairs 32 | Number of Positions 96 | Contact Features: Contact Base Material Copper Nickel Silicon | Contact Current Rating (Max) .75 AMP | Contact Underplating Material Nickel | Contact Shape & Form Dual Beam | Contact T 2132612-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132605-2 TE Connectivity
1 IMP100O,HMP,V4P6C,UG,OEW46,5.5 2132605-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132624-3 TE Connectivity
1 IMP100,O,H,V4P8C,UG,REW46 2132624-3
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132635-1 TE Connectivity
1 IMP100O,HMP,V4P10C,RG,OEW46,4.9 2132635-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132600-2 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Guide Location Unguided | Number of Rows 12 | Number of Signal Positions 48 | Backplane Architecture Orthogonal | Number of Positions 72 | Number of Pairs 24 | Number of Columns 6 | Stackable No | Number of Ground Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thick 2132600-2
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132690-1 TE Connectivity
1 IMP100O,R,RA5P8C,LG,39 2132690-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132651-1 TE Connectivity
1 IMP100S,R,RA2P6C,LG,46 2132651-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
Part Image Part Image
2132603-1 TE Connectivity
1 IMP100O,HMP,V4P6C,RG,OEW46,4.9 2132603-1
3D model not available
Symbol and footprint not available
 0
0 Build or Request
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