21706 Model Download Search Results
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2170615-3
TE Connectivity
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1 | Body Features: Heat Sink Height .288 INCH | Heat Sink Height Class Custom | Heat Sink Finish Anodized Black | Heat Sink Style Pin | Configuration Features: Number of Ports 4 | Number of Rear EONs per Port Column 1 | Port Matrix Configuration 1 x 4 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.45 MM | PCB Thickness (Recommended) .057 INCH | Electrical Characteristics: Data Rate (Max) 14 GBS | Housing Features: Cage Material Nickel Silver | I | 2170615-3 |
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2170682-1
TE Connectivity
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1 | Body Features: Heat Sink Height Class Networking Tall | Heat Sink Style Fin | Heat Sink Height .57 INCH | Configuration Features: Number of Ports 4 | Port Matrix Configuration 1 x 4 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible Yes | Pluggable I/O Applications SFP+ Enhanced | Circuit Application Signal | Other: EMI Cont | 2170682-1 |
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2170608-1
TE Connectivity
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1 | Configuration Features: Number of Ports 2 | Number of Positions 76 | Port Matrix Configuration 2 x 1 | Number of Rear EONs per Port Column 3 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thicknes | 2170608-1 |
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2170605
Lapp Group
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1 | Wire And Cable | 2170605 |
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2170609
Lapp Group
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1 | Wire And Cable | 2170609 |
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2170635
Lapp Group
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1 | Wire And Cable | 2170635 |
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2170680-7
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Electrical Characteristics: Data Rate (Max) 16 GBS | Operation/Application: Pluggable I/O Applications SFP+ | Heat Sink Compatible No | Circuit Application Signal | Other: Included Lightpipe No | Packaging Features: Packaging Method Tray | Product Type Features: Form Factor SFP+ | Pluggable I/O Product Type Cage Assembly | Cage Type Single | Sealable Yes | Termination Features: Termination Method to Printed Circuit Board Through H | 2170680-7 |
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2170618-1
TE Connectivity
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1 | Body Features: Heat Sink Style Slug | Heat Sink Height Class Custom | Heat Sink Height .216 INCH | Heat Sink Finish Anodized Black | Heat Sink Height 5.5 MM | Configuration Features: Number of Ports 1 | Port Matrix Configuration 1 x 1 | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible Yes | Pluggable I/O Applications SFP+ | C | 2170618-1 |
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2170683-1
TE Connectivity
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1 | Body Features: Heat Sink Height .57 INCH | Heat Sink Height Class Networking Tall | Heat Sink Style Fin | Configuration Features: Port Matrix Configuration 1 x 6 | Number of Ports 6 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible Yes | Pluggable I/O Applications SFP+ Enhanced | Circuit Application Signal | Other: EMI Cont | 2170683-1 |
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2170619-2
TE Connectivity
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1 | Body Features: Primary Product Material Aluminum | Primary Product Plating Material Black Anodized | Fin Style Unidirectional | Configuration Features: Number of Fins 2 | Product Type Features: Device Type SFP+ | | 2170619-2 |
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2170607
Lapp Group
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1 | Wire And Cable | 2170607 |
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2170630
Lapp Group
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1 | Wire And Cable | 2170630 |
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2170620
Lapp Group
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1 | Wire And Cable | 2170620 |
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2170610-1
TE Connectivity
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1 | Connector Accessory, Cage Assembly, Nickel Silver Alloy | 2170610-1 |
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2170610-3
TE Connectivity
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1 | Configuration Features: Number of Ports 6 | Number of Rear EONs per Port Column 3 | Number of Positions 228 | Port Matrix Configuration 2 x 3 | Contact Features: Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2170610-3 |
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2170615-2
TE Connectivity
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1 | Connector Accessory, Nickel Silver Alloy | 2170615-2 |
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2170606
Lapp Group
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1 | Wire And Cable | 2170606 |
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2170680-3
TE Connectivity
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1 | Connector Accessory | 2170680-3 |
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2170630065
Molex
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1 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 6 Circuits, Tin-Bismuth Plating, Black, with Potting Capability | 2170630065 |
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2170630035
Molex
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1 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 3 Circuits, Tin-Bismuth Plating, Black, with Potting Capability | 2170630035 |
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2170610-1
TE Connectivity
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1 | Configuration Features: Number of Rear EONs per Port Column 3 | Port Matrix Configuration 2 x 3 | Number of Positions 228 | Number of Ports 6 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2170610-1 |
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2170630025
Molex
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1 | Micro-One Wire-to-Board Header, Vertical, 2.00mm Pitch, Single Row, Glow-Wire Capable, Surface Mount, 2 Circuits, Tin-Bismuth Plating, Black, with Potting Capability | 2170630025 |
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2170680-1
TE Connectivity
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1 | Configuration Features: Number of Ports 1 | Port Matrix Configuration 1 x 1 | Dimensions: PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver Alloy | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Heat Sink Compatible No | Circuit Application Signal | Pluggable I/O Applications SFP+ | Other: EMI Containment Feature Type Internal/External EMI Springs | Included Lightpipe No | Packaging Features: | 2170680-1 |
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2170620-1
TE Connectivity
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1 | Body Features: Heat Sink Finish Anodized Black | Heat Sink Height .216 INCH | Heat Sink Height Class Custom | Primary Product Material Aluminum | Heat Sink Style Blade | Cage Plating Material Tin | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Gold | Dimensions: Product Width 22 MM | Electrical Characteristics: Data Rate (Max) 10 GBS | Housing Features: Housing Material LCP (Liquid Crystal Polymer) | Cage Material Copper | 2170620-1 |
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2170695-1
TE Connectivity
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1 | Rectangular Connector, 228 Contact(s) | 2170695-1 |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/021/706/153/2170615-3-t1.jpg/jcr:content/renditions/product-details.png",null,null])
![Part Image](["https://www.te.com/catalog/common/images/PartImages/pr2170682.jpg",null,null])
![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/021/706/081/2170608-1-t1.jpg/jcr:content/renditions/product-details.png",null,null])
![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/021/706/807/2170680-7-t1.jpg/jcr:content/renditions/product-details.png",null,null])
![Part Image](["https://www.te.com/catalog/common/images/PartImages/pr2170618.jpg",null,null])
![Part Image](["https://www.te.com/catalog/common/images/PartImages/pr2170683.jpg",null,null])
![Part Image](["https://www.te.com/catalog/common/images/PartImages/pr2170619.jpg",null,null])
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