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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219838-8
TE Connectivity
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1 | CABLE ASSEMBLY | 219838-8 |
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219837-8
TE Connectivity
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1 | CABLE ASSEMBLY | 219837-8 |
0
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2198318-1
TE Connectivity
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1 | Configuration Features: Number of Positions 40 | Number of Ports 2 | Port Matrix Configuration 2 x 1 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G | 2198318-1 |
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2198339-3
TE Connectivity
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1 | Configuration Features: Lightpipe Style Standard | Number of Ports 12 | Number of Positions 240 | Port Matrix Configuration 2 x 6 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 | 2198339-3 |
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2198339-2
TE Connectivity
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1 | Configuration Features: Number of Ports 12 | Port Matrix Configuration 2 x 6 | Number of Positions 240 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 | 2198339-2 |
1
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2198339-7
TE Connectivity
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1 | Configuration Features: Number of Positions 240 | Lightpipe Style Standard | Port Matrix Configuration 2 x 6 | Number of Ports 12 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 | 2198339-7 |
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219838-5
TE Connectivity
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1 | CABLE ASSEMBLY | 219838-5 |
0
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219837-5
TE Connectivity
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1 | CABLE ASSEMBLY | 219837-5 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198373-1
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 1 | Number of Rear EONs per Port Column 3 | Number of Positions 76 | Number of Ports 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thicknes | 2198373-1 |
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2198346-3
TE Connectivity
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1 | Configuration Features: Number of Positions 320 | Number of Ports 16 | Port Matrix Configuration 2 x 8 | Lightpipe Style Standard | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 | 2198346-3 |
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2198325-2
TE Connectivity
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1 | Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Positions 80 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G | 2198325-2 |
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2198325-4
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 2 | Lightpipe Style Standard | Number of Ports 4 | Number of Positions 80 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G | 2198325-4 |
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198318-8
TE Connectivity
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1 | Configuration Features: Lightpipe Style Standard | Number of Ports 2 | Port Matrix Configuration 2 x 1 | Number of Positions 40 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G | 2198318-8 |
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2198346-1
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 6 | Lightpipe Style Standard | Number of Ports 12 | Number of Positions 320 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 | 2198346-1 |
1
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219839-7
TE Connectivity
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1 | INTERCONNECTION DEVICE | 219839-7 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219836-1
TE Connectivity
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1 | CABLE ASSEMBLY | 219836-1 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219838-3
TE Connectivity
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1 | CABLE ASSEMBLY | 219838-3 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219837-3
TE Connectivity
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1 | CABLE ASSEMBLY | 219837-3 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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219838-6
TE Connectivity
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1 | CABLE ASSEMBLY | 219838-6 |
0
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198373-2
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 1 | Number of Ports 2 | Number of Positions 76 | Number of Rear EONs per Port Column 3 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness | 2198373-2 |
1
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198373-1
TE Connectivity
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1 | Configuration Features: Port Matrix Configuration 2 x 1 | Number of Rear EONs per Port Column 3 | Number of Positions 76 | Number of Ports 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thicknes | 2198373-1 |
1
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198373-3
TE Connectivity
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1 | Configuration Features: Number of Ports 2 | Port Matrix Configuration 2 x 1 | Number of Positions 76 | Number of Rear EONs per Port Column 3 | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thicknes | 2198373-3 |
1
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198325-5
TE Connectivity
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1 | Configuration Features: Number of Ports 4 | Number of Positions 80 | Lightpipe Style Standard | Port Matrix Configuration 2 x 2 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 G | 2198325-5 |
1
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198325-3
TE Connectivity
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1 | Configuration Features: Number of Positions 80 | Port Matrix Configuration 2 x 2 | Number of Ports 4 | Lightpipe Style Standard | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 G | 2198325-3 |
1
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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2198339-1
TE Connectivity
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1 | Configuration Features: Lightpipe Style Standard | Number of Positions 240 | Number of Ports 12 | Port Matrix Configuration 2 x 6 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 | 2198339-1 |
1
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Download Model | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||